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At least 163 records · Page 9

Contracting Quality Early in the Lifecycle Using AS9145 Data Deliverables

Development schedules and a highly dynamic supply chain are a challenge to developers of complex systems produced at low volume. Flaws in designs, parts and materials availability problems, poor manufacturability, and a lack of knowledge about critical items and key process attributes can be realized well before traditional second-party quality assurance activities begin. Supplier audits and product inspections may have little mitigating effect once these foundational problems have been realized. Their impacts can be significant lifecycle disruption, cost overruns, inability to deliver to plan, and even project cancellation. AS9145, Requirements for Advanced Product Quality Planning and Production Part Approval Process, can be used to drive quality engineering practices into early development lifecycles to significantly reduce this late-cycle risk and to reduce the cost of quality overall. Since its initial publication in 2016, it has had very limited adoption by the DoD, no adoption by NASA, and sparse adoption in the aerospace and defense supply chain. A task group within the Aerospace Industries Association's (AIA) Joint Strategic Quality Council (JSQC) identified that both acquirers and suppliers see as AS9145 as a cost-adder and are hesitant to use it as an alternative to late-stage-heavy quality assurance approaches. A lack of prior use creates large capability gaps in request-for-proposal (RFP) teams, proposal teams, suppliers’ quality management systems (QMS), and in experienced personnel executing the early lifecycle approach. To create a more realizable on-ramp for using AS9145 in the space and defense sectors, the AIA JSQC task team created five deliverable requirements descriptions (DRDs) that can be used in a contract to begin to engage both parties in early lifecycle quality engineering and quality assurance activities, that reduce exposure to late-stage cost and schedule collapse due to unidentified risks in design, supply chain, and manufacturability. These DRDs drive the parties to engage in planning and analysis discussions early on to understand what production risks can be known and how they will focus resources based on safety criticality and the key elements of design and construction. The suppliers and acquirers who will produce the data and information required by the DRD will be able to incrementally evolve their QMS and the acquirer will incrementally be able to track and understand the benefits of cost shifting from late to early development phases. A white paper describing this approach and the five recommended DRDs will be published by the AIA in late 2024 or early 2025.

Jeannette Plante↗

Robust Bonding Through Process Control

Process control has been proven to be the most reliable means of safeguarding the quality of adhesive bonds according to Federal Aviation Administration (FAA). A method for implementing process control for reduction in risk in a bonded joint fabrication process is demonstrated in this study using a selected bonding system. The stepwise method included risk analysis to identify defects with the highest impact and likelihood to occur, evaluation of various pre-bond surface analysis tools to monitor for the selected defects, and demonstration of the benefits of in-process monitoring utilizing threshold limits determined from bond performance tests. The bonded system selected for investigation was an aerospace carbon fiber epoxy composite substrate surface prepared with random orbital sanding using 180 grit aluminum oxide sand paper. A series of portable, pre-bond surface analysis tools were investigated for their ability to be used for in-line bond process control. Results and threshold limits are presented from roughness, ballistic water contact angle (WCA), color, gloss, and Fourier transform infrared spectroscopy (FTIR) surface analysis tools. Results demonstrated how in-process inspection methods can be used to ensure quality of a surface preparation for a selected bonding system. A framework is provided for implementation of bond process control for robust bonding.

Kutscha, Eileen O.↗

Automated Alignment And Inspection Of Duct Welds

Machine vision system being developed for use in aligning ends of two round ducts before welding ends together and inspecting welded ducts for alignment after welding. System makes consistent, objective measurements quickly. Improves quality and reliability of welds, reduces need for rework, and reduces alignment and inspection time, thereby reducing cost of manufacture.

Cross, George S.↗

Efficient screening of rare large pit anomalies on polished surfaces using a minimalist sampling scheme

Lawrence Livermore National Laboratory (LLNL) has made significant strides in generating clean energy through its inertial confinement fusion (ICF) experiments. These experiments rely on high-density carbon (HDC) coated shells to encapsulate the fusion fuel. The success of these experiments is heavily dependent on the surface quality of these shells, as even minor imperfections, such as deep pits, can negatively impact fusion yield. Ensuring the required smoothness involves an extensive surface-finishing process that spans approximately 20 stages, making it both time-intensive and resource-demanding. A critical challenge in this process is the need for high-resolution scans to detect rare deep pits, which can be costly and impractical if performed on every shell. This highlights the necessity of developing more efficient scanning methods to optimize time and cost without compromising accuracy. To address these challenges, we introduce a novel approach that employs the multivariate Dvoretzky–Kiefer–Wolfowitz (DKW) inequality to provide a probabilistic upper bound on the error in estimating pit distribution characteristics via a Kernel Density Estimator (KDE). This error bound enables efficient and reliable estimation of pit distribution characteristics at a specified statistical confidence level using a minimal number of surface scans. The integrated DKW-KDE approach was validated through surface-finishing experiments across two batches of HDC-coated shells, demonstrating consistent and robust performance across multiple stages of the surface-finishing experiments. The validation studies suggest that the integrated DKW-KDE approach achieves comparable accuracy in estimating the risk of deleterious large pits with six scans, thus conserving time and resources. Further evaluations show that performance remains consistent across batches and over multiple polishing stages. In conclusion, based on these findings, one can leverage the minimal-scan insights to strategically improve the bottleneck inspection process, thus enhancing the productivity and quality of shell polishing and similar challenging manufacturing processes.

Inertial confinement fusion↗

Nondestructive property and defect characterization using X-rays and neutrons

As advanced manufacturing (AM) continues to mature as a fabrication technique, interest in its use for the fabrication of nuclear components continues to grow. AM nuclear parts offer the ability to create parts with complex and non-standard geometries that cannot be produced using traditional manufacturing techniques, circumvention of supply chain issues, and reduction of time from design to implementation. However, components fabricated with AM techniques must undergo nondestructive examination (NDE) to ensure they are fabricated to the required specifications to ensure safe and proper operation. The Advanced Materials and Manufacturing Technologies (AMMT) program has undertaken initial exploratory studies on several NDE techniques to evaluate their feasibility for research and development (R&D), as well as Quality Assurance and Quality Control (QA/QC), and in-service inspections of AM parts. This work describes research results on several techniques, including X-ray and neutron tomography and scattering, as well as photothermal radiometry. The experimental results are described and an overview for each techniques’ potential use on AM parts in the various phases of part development and lifetime is given. Finally, future directions for technique development and application to AM nuclear components are described.

36 MATERIALS SCIENCE↗

Optical system facilitates inspection of printed circuit boards

Optical comparator method determines the quality and registration of surface features of double-sided printed circuit boards. Color-coded superimposed images of both sides of a printed circuit board are presented to view, clearly showing details and registration of the circuitry.

Cridlin, M.↗

A hingeless rotor XV-15 design integration feasibility study. Volume 1: Engineering design studies

A design integration feasibility study was carried out to investigate what modifications to the basic XV-15 were necessary to accomplish a flight demonstration of the XV-15 with a Boeing hingeless rotor. Also investigated were additional modifications which would exploit the full capability provided by the combination of the new rotor and the existing T53 engine. An evaluation of the aircraft is presented and the data indicate improved air vehicle performance, acceptable aeroelastic margins, lower noise levels and improved flying qualities compared with the XV-15 aircraft. Inspection of the rotor system data provided shows an essentially unlimited life rotor for the flight spectrum anticipated for the XV-15.

Magee, J. P.↗

Pyroxenes from planetary basalts - Characterization of 'other' than quadrilateral components

The paper reports on a synthesis of the silicate mineralogy of a planetary basalt suite, which concerns itself only with specific aspects of pyroxene cation substitutional couples. Consideration is given to the mineral chemistry and the basalt suites in an overview fashion. Attention is given to those characteristics of pyroxene chemistry that reflect planetary constraints on the host basalts from which the pyroxenes crystallized. It is concluded that the inspection of a large number of high quality silicate analyses of pyroxenes demonstrates conclusively that these phases carry a signature of the planetary body in which they evolved. In addition, it is noted that there are planetary probes capable of constraining thermodynamic parameters that were obtained during the petrogenesis of their host basaltic liquids

Papike, J. J.↗

Thermographic Analysis of Composite Cobonds on the X-33

The methods utilized to perform an infrared thermography inspection of the bondline of structural reinforcing caps on X-33 liquid hydrogen (LH2) tank during the manufacture are described in this presentation. A total of thirty-six caps were bonded to the tank using a wet cobond process with vacuum bagging and low temperature curing. The thermal map of each bondline was acquired through the vacuum bag by applying heat to the cap and then viewing it during cool down. Poorly bonded regions, or voids, were characterized by localized hot spots in the thermal image. These regions were marked on the tank by referring to a live thermal image, then hand massaged in an attempt to remove the entrapped air. The cap was then reinspected and, if it was determined that the entrapped air could not be removed, the cap was removed and the adhesive cleaned away before it cured. Measures were then taken to better match the surface of the cap to the tank and the process repeated. After the bondline had cured sufficiently to allow vacuum bag removal, a "flash heating" thermographic Investigation was performed to verify that the cap had bonded properly to the tank. Any regions that had opened up after the preliminary inspection were marked and filled by drilling small holes in the cap and injecting resin. A final inspection was then performed to ensure the quality of the bondline.

Russell, Samual S.↗

A New Tool for Quality Control

Diffracto, Ltd. is now offering a new product inspection system that allows detection of minute flaws previously difficult or impossible to observe. Called D-Sight, it represents a revolutionary technique for inspection of flat or curved surfaces to find such imperfections as dings, dents and waviness. System amplifies defects, making them highly visible to simplify decision making as to corrective measures or to identify areas that need further study. CVA 3000 employs a camera, high intensity lamps and a special reflective screen to produce a D- Sight image of light reflected from a surface. Image is captured and stored in a computerized vision system then analyzed by a computer program. A live image of surface is projected onto a video display and compared with a stored master image to identify imperfections. Localized defects measuring less than 1/1000 of an inch are readily detected.

Source record↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Ghaffarian, Reza↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

MLF↗

Developing Approaches for Certification of Uninspectable Fracture Critical AM Components

Introduction - Human-rated spaceflight hardware is subject to the Fracture Control requirements in NASA-STD5019, which are intended to control the risk of component failure due to undetected cracks or defects. - All hardware in this mission class is classified for Fracture Control – Exempt, Non-fracture Critical, or Fracture Critical - Fracture Critical: A classification that identifies a part where failure due to the presence of a crack is a catastrophic hazard ➔ Pressure vessels, engine components, primary structure, etc. - Axiom 1: Material and manufacturing process produce structures and components with cracks or defects. - Axiom 2: The presence of a crack or defect of sufficient size reduces the strength and life of the structure. - Damage Tolerance: demonstration that a component can survive the service life (with a safety factor) in the presence of an undetected flaw or damage. - Components are manufactured from aerospace quality materials using controlled processes. - Components are inspected for damage (cracks, flaws, defects, etc.). - Components are shown by test or analysis to be tolerant to undetected flaws.

Will Tilson↗

GNPS Dashboard: collaborative exploration of mass spectrometry data in the web browser

Access to web-based platforms has enabled scientists to perform research remotely. A critical aspect of mass spectrometry data analysis is the inspection, analysis, and visualization of the raw data to validate data quality and confirm statistical observations. We developed the GNPS Dashboard, a web-based data visualization tool, to facilitate synchronous collaborative inspection, visualization, and analysis of private and public mass spectrometry data remotely.

59 BASIC BIOLOGICAL SCIENCES↗

AE (Acoustic Emission) for Flip-Chip CGA/FCBGA Defect Detection

C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.

Ghaffarian, Reza↗

Automatic welding of stainless steel tubing

The use of automatic welding for making girth welds in stainless steel tubing was investigated as well as the reduction in fabrication costs resulting from the elimination of radiographic inspection. Test methodology, materials, and techniques are discussed, and data sheets for individual tests are included. Process variables studied include welding amperes, revolutions per minute, and shielding gas flow. Strip chart recordings, as a definitive method of insuring weld quality, are studied. Test results, determined by both radiographic and visual inspection, are presented and indicate that once optimum welding procedures for specific sizes of tubing are established, and the welding machine operations are certified, then the automatic tube welding process produces good quality welds repeatedly, with a high degree of reliability. Revised specifications for welding tubing using the automatic process and weld visual inspection requirements at the Kennedy Space Center are enumerated.

Clautice, W. E.↗

Pressure-based process monitoring of direct-ink write material extrusion additive manufacturing

As additive manufacturing (AM) has become a reliable method for creating complex and unique hardware rapidly, the quality assurance of printed parts remains a priority. In situ process monitoring offers an approach for performing quality control while simultaneously minimizing post-production inspection. For extrusion printing processes, direct linkages between extrusion pressure fluctuations and print defects can be established by integrating pressure sensors onto the print head. In this work, the sensitivity of process monitoring is tested using engineered spherical defects. Pressure and force sensors located near an ink reservoir and just before the nozzle are shown to assist in identification of air bubbles, changes in height between the print head and build surface, clogs, and particle aggregates with a detection threshold of 60–70% of the nozzle diameter. Visual evidence of printed bead distortion is quantified using optical image analysis and correlated to pressure measurements. Importantly, this methodology provides an ability to monitor the quality of AM parts produced by extrusion printing methods and can be accomplished using commonly available pressure-sensing equipment.

36 MATERIALS SCIENCE↗