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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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At wafer probe, units of the TA6567 circuit, a beam leaded COS/MOS/SOS 256-bit RAM, were demonstrated to be functionally perfect. An aluminum gate current-sense version and a silicon-gate voltage-sense version of this memory were developed. Initial base line data for the beam lead SOS process using the TA5388 circuit show the stability of the dc device characteristics through the beam lead processing.
Data for the beam-leaded silicon-on-sapphire (SOS) process using the TA5388 dual-complementary pair plus inverted circuit show the stability of the dc device characteristics through the complete beam-lead processing and packaging steps. A more complex circuit, the TA6567 - a silicon-gate, voltage-sense BL/CMOS/SOS 256-bit RAM, has also been made that was functionally perfect at wafer probe. Efforts to increase the yield of this circuit and to obtain electrically perfect packaged units are discussed.
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The Si-gate CMOS/SOS process used to manufacture integrated circuits is examined. A process analysis test structure is developed to determine the defect mechanisms most detrimental to yield, control, and reliability.
The work on the Process Analysis Structure was continued with the layout being completed, the 100X and 10X artwork being finalized, and the process and test sequences being prepared. Test programs were written for computer-controlled integrated-circuit testing and data reduction.
Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed.
Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.
Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.
A Clemson University ceramic engineering design for a lunar fiberglass plant is presented. The properties of glass fibers and metal-matrix composites are examined. Lunar geology is also discussed. A raw material and site are selected based on this information. A detailed plant design is presented, and summer experiments to be carried out at Johnson Space Center are reviewed.
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No abstract available
No abstract available
NASA's new Space Launch System (SLS) will be the first rocket since the Saturn V (1967-1973) to carry astronauts beyond low earth orbit-and will carry 10% more payload than Saturn V and three times the payload of the space shuttle. The SLS configuration consists of a center core and two solid rocket boosters that separate from the core as their fuel is exhausted two minutes after lift-off. During these first two minutes of flight, the vehicle powers its way through strong shock waves as it accelerates past the speed of sound, then pushes beyond strong aerodynamic loads at the maximum dynamic pressure, and is ultimately enveloped by gaseous plumes from the booster-separation motors. The SLS program relies on computational fluid dynamic (CFD) simulations to provide much of the data needed to build aerodynamic databases describing the structural load distribution, surface pressures, and aerodynamic forces on the vehicle.