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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Development and evaluation of polyimide laminates for printed wiring board applications

A developmental and evaluation program on polyimide laminates as printed wiring boards is described. The development of an experimental polyimide with low linear coefficient of thermal expansion normal to the plane of the board is discussed, and its properties are evaluated along with two commercial polyimide printed wiring boards for comparison with the type G-10 epoxy board. Thermal cycling data indicate an urgent need for effectively controlling the expansion normal to the plane of the board in order to minimize solder joint damage.

Patterson, W. J.↗
NASA NTRS1973

The hydrolysis of polyimides

Thermal polymerization of aspartic acid produces a polysuccinimide (I), a chain of aspartoyl residues. An investigation was made of the alkaline hydrolysis of the imide rings of (I) which converts the polyimide to a polypeptide. The alkaline hydrolysis of polyimides can be expected to be kinetically complex due to increasing negative charge generated by carboxylate groups. For this reason, a diimide, phthaloyl-DL-aspartoyl-beta-alanine (IIA) was synthesized for a progressive study of the hydrolysis of polyimides. In addition, this diimide (IIA) can be related to thalidomide and might be expected to exhibit similar reactivity during hydrolysis of the phthalimide ring.

Hoagland, P. D.↗
NASA NTRS1975

Prototype rigid polyimide components

The activity is reported which was conducted for utilizing spin-off Apollo base technology to fabricate a variety of commercial and aerospace related parts that are nonflammable and resistant to high-temperature degradation. Manufacturing techniques and the tooling used to fabricate each of the polyimide/glass structures is discussed. A brief history, tracing the development of high-temperature polyimide resins, is presented along with a discussion of the properties of DuPont's PI 2501/glass material (later redesignated PI 4701/glass). Mechanical and flammability properties of DuPont's PI 2501/glass laminates are compared with epoxy, phenolic, and silicone high-temperature resin/glass material systems. Offgassing characteristics are also presented. A discussion is included of the current developments in polyimide materials technology and the potential civilian and government applications of polyimide materials to reduce fire hazards and increase the survivability of men and equipment.

Wykes, D. H.↗
NASA NTRS1978

Graphite-fiber-reinforced polyimide liners of various compositions in plain spherical bearings

A plain spherical bearing design with a ball diameter of 28.6 mm, a race length of 12.7 mm, and a 1.7-mm-thick, molded composite liner was evaluated. The liner material is a self-lubricating composite of graphite-fiber-reinforced polyimide resin (GFRPI). The liner is prepared by transfer molding a mixture of one part chopped graphite fiber and one part partially polymerized resin into the space between the bearing ball and the outer race and then completing the polymerization under heat and pressure. Several liner compositions were evaluated: two types of polyimide, condensation and addition; two types of graphite fiber, low and high modulus; and four powder additives - cadmium oxide, cadmium iodide, graphite fluoride, and molybdenum disulfide. The bearings were oscillated + or - 15 deg at 1 Hz for 20 kilocycles under a radial unit load of 29 MN sq m (4200 psi) in dry air at 25, 200, or 315 C. Both types of fiber and polyimide gave low friction and wear. A simple equation was developed to fit the wear-time data and adequately predicted wear to 100 kilocycles.

Sliney, H. E.↗
NASA NTRS1978

Feasibility demonstration for electroplating ultra-thin polyimide film

The effect of electrodeposition variables on film thickness was investigated using a dilute polyimide solution as a bath into which aluminum (as foil or as a vapor deposited coating) was immersed. The electrodeposited film was dried for 2 hours at 93 C (primarily to remove solvent) and cured for 18 hours at 186 C. Infrared studies indicate that imide formation (curing) occurs at 149 C under vacuum. From a conceptual viewpoint, satisfactory film metallized on one side can be obtained by this method. The cured ultra thin polyimide film exhibits properties equivalent to those of commercial film, and the surface appearance of the strippable polyimide film compares favorably with that of a sample of commercial film of thicker gauge. The feasibility of manufacturing approximately one million sq m of ultra thin film capable of being joined to fabricate an 800 m by 9 800 m square from starting material 0.5 to 1 m wide for space erectable structures was demonstrated.

Schneier, R.↗
NASA NTRS1978

Graphite-fiber-reinforced polyimide liners of various compositions in plain spherical bearings

Composites made of graphite-fiber-reinforced polyimide (GFRPI) with a fiber-resin ratio (by weight) of about 1 were evaluated as molded outer-race liners in plain spherical bearings. Several compositions were examined: two types of polyimide (addition and condensation polymers), two types of graphite fiber (high and low modulus) and four powder additives (CdO, CdI2, (CF1.1)n, and MoS2). Friction and wear were measured during oscillation at 25, 200, and 315 C. It is shown that all compositions provided good lubrication in dry air, that neither type of polyimide or graphite fiber nor the additives gave a clear advantage, and that wear rates were always higher during run-in, before conditions stabilized. It is concluded that GFRPI composites are self-lubricating under all but the most extreme moisture-free conditions at 25 C. The additives are helpful only with very high loads or extremely dry environments.

Sliney, H. E.↗
NASA NTRS1980

Comparison of the tribological properties at 25 C of seven different polyimide films bonded to 301 stainless steel

A pin-on-disk type of friction and wear apparatus was used to study the tribological properties of seven different polyimide films bonded to AISI 301 stainless steel disks at 25 C. It was found that the substrate material was extremely influential in determining the lubricating ability of the polyimide films. All seven films spalled in less than 1000 cycles of sliding. This was believed to be caused by poor adherence to the 301 stainless steel or the inability of the films to withstand the high localized tensile stresses imparted by the deformation of the soft substrate under sliding conditions. The friction coefficients obtained for six of the polyimides varied between 0.21 to 0.32 while one varied between 0.32 to 0.39.

Fusaro, R. L.↗
NASA NTRS1980

Development of fire-resistant, low smoke generating, thermally stable end items for commercial aircraft and spacecraft using a basic polyimide resin

A terpolyimide precursor was developed which can be foamed by microwave methods and yields foams possessing the best seating properties. A continuous process, based on spray drying techniques, permits production of polyimide powder precursors in large quantities. The constrained rise foaming process permits fabrication of rigid foam panels with improved mechanical properties and almost unlimited density characteristics. Polyimide foam core rigid panels were produced by this technique with woven fiberglass fabric bonded to each side of the panel in a one step microwave process. The fire resistance of polyimide foams was significantly improved by the addition of ceramic fibers to the powder precursors. Foams produced from these compositions are flexible, possess good acoustical attenuation and meet the minimum burnthrough requirements when impinged by high flux flame sources.

Gagliani, J.↗
NASA NTRS1980

High-temperature adhesives for bonding polyimide film

Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575 K (575 F) in vacuum. Glass transition temperatures of the polyimide/"Kapton" bondlines were monitored by thermomechanical analysis.

St.clair, A. K.↗
NASA NTRS1981

Recent developments in polyimide adhesives at NASA-Langley Research Center

Adhesive development is directed towards elevated temperature applications (200-300 C). Because of thermal stability considerations, the most attractive adhesives for this temperature range are linear and addition polyimides. The linear polymide adhesive research encompassed basic structure-property relationships, solvent studies and formulations to meet various requirements. The most recent research in linear polyimide systems was in the development of thermoplastic systems in an effort to eliminate the undesirable evolution of water classically associated with the cure going through an amide-acid intermediate step in the cure process. Addition polyimide adhesive research was undertaken in order to avoid water evolution during cure. Basic structure-property relationships for these materials led to an adhesive which was used extensively for high temperature adhesive needs. Since addition systems are of a highly crosslinked nature, they are not as resistant to impact as their linear counterparts. In order to overcome this problem, research was done in the area of elastomer-toughening these polymers.

St.clair, T. L.↗
NASA NTRS1981

Composition and method for making polyimide resin-reinforced fabric

A composition for making polyimide resin reinforced fibers or fabric is discussed. The composition includes a polyfunctional ester, a polyfunctional amine, and an end capping agent. The composition is impregnated into fibers or fabric and heated to form prepreg material. The tack retention characteristics of this prepreg material are improved by incorporating into the composition a liquid olefinic material compatible with the other ingredients of the composition. The prepreg material is heated at a higher temperature to effect formation of the polyimide resin and the monomeric additive is incorporated in the polyimide polymer structure.

Serafini, T. T.↗
NASA NTRS1982

PMR polyimides-review and update

Fiber reinforced PMR polyimides are finding increased acceptance as engineering materials for high performance structural applications. Prepreg materials based on this novel class of highly processable, high temperature resistant polyimides are commercially available and the PMR concept is used by other investigators. The current status of first and second generation PMR polyimides were reviewed. Emphasis is given to the chemistry, processing and applications of the first generation material known as PMR-15.

Serafini, T. T.↗
NASA NTRS1982

Develop, demonstrate, and verify large area composite structural bonding with polyimide adhesives

The technology required to produce graphite-polyimide structural components with operational capability at 598 K (600 F) is considered. A series of polyimide adhesives was screened for mechanical and physical properties and processibility in fabricating large midplane bonded panels and honeycomb sandwich panels in an effort to fabricate a structural test component of the space shuttle aft body flap. From 41 formulations, LaRC-13, FM34B-18, and a modified LaRC-13 adhesive were selected for further evaluation. The LaRC-13 adhesive was rated as the best of the three adhesives in terms of availability, cost, processibility, properties, and ability to produce void fee large area (12" x 12") midplane bonds. Surface treatments and primers for the adhesives were evaluated and processes were developed for the fabrication of honeycomb sandwich panels of very good quality which was evidenced by rupture in the honeycomb core rather than in the facesheet bands on flatwise tensile strength testing. The fabrication of the adhesively bonded honeycomb sandwich cover panels, ribs, and leading edge covers of Celion graphite/LARC-160 polyimide laminates is described.

Bhombal, B. D.↗
NASA NTRS1982

Polyimides: Tribological properties and their use as lubricants

Friction, wear, and wear mechanisms of several different polyimide films, solid bodies, composites, and bonded solid lubricant films are compared and discussed. In addition, the effect of such parameters as temperatures, type of atmosphere, contact stress, and specimen configuration are investigated. A friction and wear transition occurs in some polyimides at elevated temperatures and this transition is related to molecular relaxations that occur in polyimides. Friction and wear data from an accelerated test (pin-on-disk) are compared to similar data from an end use test device (plain spherical bearing), and to other polymers investigated in a similar geometry.

Fusaro, R. L.↗
NASA NTRS1983

Dynamic Mechanical Properties of N-Phenylnadimide Modified PMR Polyimide Composites

The rheological behavior of newly developd Celion 6000/N-phenylnadimide modified PMR polyimide and PMR-15 composites was investigated. The dynamic mechanical properties were correlated with the structure of N-phenylnadimide modified PMR polyimides. The storage modulus (G'), loss modulus (G''), and loss tangent (tan delta) of four composite systems were measured over a temperature range from -150 to 400 C. Three well defined peaks were seen in the regions of 360, 100, and -120 C, corresponding to the alpha, beta, and gamma relaxations, respectively, of the matrix resins. The activation energies of the alpha, beta, and gamma relaxations were estimated to be 232, 60, and 14 kcal/mole, respectively, for PMR-15. Addition of N-phenylnadimide to the PMR-15 composition lowered the glass transition temperature and the activation energies of PMR-15 polyimide. The dynamic mechanical data appear to be consistent with the formation of a copolymer from N-phenylnadimide and a PMR-15 prepolymer.

Pater, R. H.↗
NASA NTRS1983

The development of aerospace polyimide adhesives

Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.

St.clair, A. K.↗
NASA NTRS1983

Acetylene-terminated polyimide adhesives

The nadic-encapped LARC-13 addition polyimide exhibits excellent flow, is easy to process, and can be utilized for short terms at temperatures up to 593 C. It retains good lap shear strength as an adhesive for titanium after aging in air up to 125 hours at 316 C; but lap shear strength degrades with longer exposures at that temperature. Thermid 600, an addition polyimide that is acetylene encapped, exhibits thermomechanical properties even after long term exposure in at air at 316 C. An inherent drawback of this system is that it has a narrow processing window. An acetylene encapped, addition polyimide which is a hybrid of these two systems was developed. It has good retention of strength after long term aging and is easily processed. The synthesis and characterization of various molecular weight oligomers of this system are discussed as well as the bonding, aging, and testing of lap shear adhesive samples.

Hanky, A. O.↗
NASA NTRS1982

Detection of trace quantities of dimethylacetamide during the curing process of a polyimide film

An experimental study of positive ion clustering of dimethylacetamide (DMAC) with water molecules using high pressure mass spectrometry techniques is reported. The possibilities of using these techniques to determine the concentration levels of DMAC evolved from a polyimide film during the curing process, are examined. The test sample of gas contained DMAC of the order of a few micrograms, water, nitrogen, oxygen, and other compounds that might evolve during the curing cycle of a polyimide film. It is found that PPM concentrations such as DMAC lost from polyimide during curing stages can be detected with this technique. Improvement of the detection of lower concentrations (50 picograms) can be made by using electron multipliers with a gain in the 10 to the 8th power range and pulse counting techniques.

Smith, A. C.↗