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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9

All sources NASA NTRS DOE OSTI

NASA NTRS1993

Determination of parameters for hypervelocity dust grains encountered in near-Earth space

Primarily interest was in the determination of the population of micrometeoroids and space debris and interpretation of the hole size in a thin film or in a micropore foam returned from space with theoretical calculations describing the event. In order to augment the significance of the theoretical calculations of the impact event, an experiment designed to analyze the charge production due to hypervelocity impacts on thin films also produced data which described the penetration properties of micron and sub-micron sized projectiles. The thin film penetration sites in the 500 A and 1000 A aluminum films were counted and a size distribution function was derived. In the case of the very smallest dust grains, there were no independent measurements of velocities like that which existed for the larger dust grains (d(sub p) is less than or equal to 1 micron). The primary task then became to assess the relationship between the penetration hole and the particle diameter of the projectile which made the hole. The most promising means to assess the measure of the diameters of impacting grains came in the form of comparing cratering mechanics to penetration mechanics. Future experimentation will produce measurements of the cratering as opposed to the penetrating event. Particles encountered by surfaces while being flown in space will degrade that surface in a systematic manner even when the impact is with small hypervelocity particles, d(sub p) is less than or equal to 10 microns. Though not to a degree which would precipitate a catastrophic failure of a system, the degradation of the materials comprising the interconnected system will occur. It is the degradation of the optical system and the subsequent embrittlement of other materials that can lead to degradation if not to failure. It is to this end that research was conducted to compare the primary consequences for experiments which will be flown to those which have been returned.

Tanner, William G.↗

NASA NTRS2001

Chip packaging technique

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

Jayaraj, Kumaraswamy↗

NASA NTRS1986

Reference frame studies at JPL/CALTECH

Studies being undertaken in order to interconnect the three principal celestial coordinate systens are reviewed. These systems are the optical frame (FK4/FK5) based on positions of Galactic stars, the planetary/lunar ephemeris frame based on the major celestial bodies of the solar system, and the radio frame constructed from observations of quasars. The optical frame is being connected to the radio frame by VLBI observations of radio-emitting stars, and the radio frame is being tied to the ephemeris frame in several ways; for example, differential VLBI measurements between quasars and planet-orbiting spacecraft. Prospects for future interconnection studies are briefly discussed.

Dickey, J. O.↗

DOE OSTI2023

Quantifying Optical Loss of High-Voltage Degradation Modes in PV Modules Using Spectral Analysis [Slides]

The direct current bias for photovoltaic (PV) modules interconnected in series-strings may include both high voltage negative ("HV-") and positive ("HV+") polarity with respect to the electrical ground. Multiple degradation modes, resulting in quantifiable optical loss, were found to occur during HV-/HV+ sequential stress, including: corrosion of the external glass surface, encapsulant delamination (at its interfaces with the glass and the PV cell), internal haze formation (resulting from a chemical interaction between the glass and the encapsulant), corrosion and migration of the gridlines, and corrosion of the silicon nitride (SixNy) antireflective coating on the cell. The effects of these separate modes were examined using monolithic (e.g., glass or PV cell) and laminated-coupon (glass/encapsulant/glass or glass/encapsulant/cell/encapsulant/backsheet) specimens. Characterizations during and after unbiased accelerated testing at 85 degrees C/85% relative humidity included: spectrophotometry, optical microscopy, electron microscopy, and ellipsometry. For some module components (i.e., the glass and the SixNy coating), the optical performance was determined through iterative analysis of empirical measurements. Concentrating on just their spectral effect, a novel model was then developed to estimate the transfer of light to the PV cell and the return of light from the PV module with simultaneous degradation mechanisms, which was compared to a mini-module previously subjected to HV-/HV+ stress. The model suggests one-third of the current loss observed for the mini-module can be attributed to the optical degradation of the packaging materials. The dominant degradation modes include encapsulant delamination and corrosion of the SixNy coating. Recommendations are given so that the optical model may be improved relative to accelerated testing and validated relative to field aging.

14 SOLAR ENERGY↗

DOE OSTI2025

Erbium quantum memory platform with long optical coherence via back-end-of-line deposition on foundry-fabricated photonics

Realizing scalable quantum interconnects necessitates the integration of solid-state quantum memories with foundry photonics processes. While prior photonic integration efforts have relied upon specialized, laboratory-scale fabrication techniques, this work demonstrates the monolithic integration of a quantum memory platform with low-loss foundry photonic circuits via back-end-of-line deposition. We deposited thin films of titanium dioxide (Ti⁢O 2 ) doped with erbium (Er) onto silicon nitride nanophotonic waveguides and studied Er optical coherence at subkelvin temperatures with photon echo techniques. Furthermore, we suppressed optical dephasing through ex-situ oxygen annealing and optimized measurement conditions, which yielded an optical coherence time of 64 μ⁢s (a 5-kHz homogeneous linewidth) and slow spectral diffusion of 27 kHz over 4 ms, results that are comparable to state-of-the-art Er nanophotonic devices. Combined with second-long electron spin lifetimes and demonstrated electrical control of Er emission, our findings establish Er:Ti⁢O 2 on foundry photonics as a manufacturable platform for ensemble and single-ion quantum memories.

Electro-optic effects↗

NASA NTRS1991

Developments in fiber optics for distribution automation

An optical fiber based communications system of unusual design is described. The system consists of a network of optical fibers overlaid on the distribution system. It is configured as a large number of interconnected rings, with some spurs. Protocols for access to and control of the network are described. Because of the way they function, the protocols are collectively called AbNET, in commemoration of the microbiologists' abbreviation Ab for antibody. Optical data links that could be optically powered are described. There are two versions, each of which has a good frequency response and minimal filtering requirements. In one, a conventional FM pulse train is used at the transmitter, and a novel form of phase-locked loop is used as demodulator. In the other, the FM transmitter is replaced with a pulse generator arranged so that the period between pulses represents the modulating signal. Transmitter and receiver designs, including temperature compensation methods, are presented. Experimental results are given.

Kirkham, H.↗

NASA NTRS2015

Configurable Aperture Space Telescope

In December 2014, we were awarded Center Innovation Fund to evaluate an optical and mechanical concept for a novel implementation of a segmented telescope based on modular, interconnected small sats (satlets). The concept is called CAST, a Configurable Aperture Space Telescope. With a current TRL is 2 we will aim to reach TLR 3 in Sept 2015 by demonstrating a 2x2 mirror system to validate our optical model and error budget, provide straw man mechanical architecture and structural damping analyses, and derive future satlet-based observatory performance requirements. CAST provides an alternative access to visible and/or UV wavelength space telescope with 1-meter or larger aperture for NASA SMD Astrophysics and Planetary Science community after the retirement of HST

Small Satellites↗

NASA NTRS2015

Configurable Aperture Space Telescope

In December 2014, we were awarded Center Innovation Fund to evaluate an optical and mechanical concept for a novel implementation of a segmented telescope based on modular, interconnected small sats (satlets). The concept is called CAST, a Configurable Aperture Space Telescope. With a current TRL is 2 we will aim to reach TLR 3 in Sept 2015 by demonstrating a 2x2 mirror system to validate our optical model and error budget, provide strawman mechanical architecture and structural damping analyses, and derive future satlet-based observatory performance requirements. CAST provides an alternative access to visible andor UV wavelength space telescope with 1-meter or larger aperture for NASA SMD Astrophysics and Planetary Science community after the retirement of HST.

Technology↗

DOE OSTI2024

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗

NASA NTRS1994

Cubic GaS: A Surface Passivator For GaAs

Thin films of cubic form of gallium sulfide (GaS) formed on surfaces of gallium arsenide (GaAs) substrates via metal/organic chemical vapor deposition (MOCVD). Deposited cubic GaS, crystalline lattice matched to substrate GaAs, neutralizes electrically active defects on surfaces of both n-doped and p-doped GaAs. Enabling important GaAs-based semiconducting materials to serve as substrates for metal/insulator/semiconductor (MIS) capacitors. Cubic GaS enables fabrication of ZnSe-based blue lasers and light-emitting diodes. Because GaS is optically transparent, deposited to form window layers for such optoelectronic devices as light-emitting diodes, solar optical cells, and semiconductor lasers. Its transparency makes it useful as interconnection material in optoelectronic integrated circuits. Also useful in peeled-film technology because selectively etched from GaAs.

Hepp, Aloysius F.↗

NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗

DOE OSTI2025

Nickel-incorporated Oxide Composites for Fiber-Optic Based Gas Sensing

Numerous high-value applications within the energy sector involve environmental conditions that are incompatible with traditional sensor technology due to degradation of electrical interconnects, packaging, or the sensors themselves. These can include chemically harsh conditions, high temperature operation, or the presence of electromagnetic interference due to high voltage. The fiber optic platform, constructed of robust, electrically insulating glass or single crystal oxides, offers a versatile and often low cost per node solution to this problem, especially with the integration of distributed sensing techniques such as optical time-domain and frequency-domain reflectometry (OTDR, OFDR). A major challenge of gas and chemical sensing on the optical fiber platform is the fabrication of robust and stable sensing materials that interact quickly and reversibly to the presence of the target analytes. In this work, we discuss the utilization of nickel-incorporated oxides on evanescent-field optical fiber sensors for gas sensing under harsh conditions relevant to multiple energy infrastructure applications. This paper will discuss a Ni/GDC (Ni / Gd-doped ceria) based sensing layer targeting conditions relevant for high-temperature (up to at least 800 oC) hydrogen sensing applications (e.g., for operation within a solid oxide fuel cell or electrolyzer). The impact of hydrogen at elevated temperatures on the optical properties of Ni/GDC will be shown and the material mechanisms for the optical response will be discussed.

gas sensors↗

DOE OSTI2025

Nickel-incorporated Oxide Composites for Fiber-Optic Based Gas Sensing

Numerous high-value applications within the energy sector involve environmental conditions that are incompatible with traditional sensor technology due to degradation of electrical interconnects, packaging, or the sensors themselves. These can include chemically harsh conditions, high temperature operation, or the presence of electromagnetic interference due to high voltage. The fiber optic platform, constructed of robust, electrically insulating glass or single crystal oxides, offers a versatile and often low cost per node solution to this problem, especially with the integration of distributed sensing techniques such as optical time-domain and frequency-domain reflectometry (OTDR, OFDR). A major challenge of gas and chemical sensing on the optical fiber platform is the fabrication of robust and stable sensing materials that interact quickly and reversibly to the presence of the target analytes. In this work, we discuss the utilization of nickel-incorporated oxides on evanescent-field optical fiber sensors for gas sensing under harsh conditions relevant to multiple energy infrastructure applications. This paper will discuss a Ni/GDC (Ni / Gd-doped ceria) based sensing layer targeting conditions relevant for high-temperature (up to at least 800oC) hydrogen sensing applications (e.g., for operation within a solid oxide fuel cell or electrolyzer). The impact of hydrogen at elevated temperatures on the optical properties of Ni/GDC will be shown and the material mechanisms for the optical response will be discussed.

gas sensors↗

NASA NTRS1976

Flexible, FEP-Teflon covered solar cell module development

Techniques and equipment were developed for the large scale, low-cost fabrication of lightweight, roll-up and fold-up, FEP-Teflon encapsulated solar cell modules. Modules were fabricated by interconnecting solderless single-crystal silicon solar cells and heat laminating them at approximately 300 C between layers of optically clear FEP and to a loadbearing Kapton substrate sheet. Modules were fabricated from both conventional and wraparound contact solar cells. A heat seal technique was developed for mechanically interconnecting modules into an array. The electrical interconnections for both roll-up and fold-up arrays were also developed. The use of parallel-gap resistance welding, ultrasonic bonding, and thermocompression bonding processes for attaching interconnects to solar cells were investigated. Parallel-gap welding was found to be best suited for interconnecting the solderless solar cells into modules. Details of the fabrication equipment, fabrication processes, module and interconnect designs, environmental test equipment, and test results are presented.

Rauschenbach, H. S.↗

NASA NTRS1989

Parallel Optical Random Access Memory (PORAM)

It is shown that the need to minimize component count, power and size, and to maximize packing density require a parallel optical random access memory to be designed in a two-level hierarchy: a modular level and an interconnect level. Three module designs are proposed, in the order of research and development requirements. The first uses state-of-the-art components, including individually addressed laser diode arrays, acousto-optic (AO) deflectors and magneto-optic (MO) storage medium, aimed at moderate size, moderate power, and high packing density. The next design level uses an electron-trapping (ET) medium to reduce optical power requirements. The third design uses a beam-steering grating surface emitter (GSE) array to reduce size further and minimize the number of components.

Alphonse, G. A.↗

DOE OSTI2023

New trends in photonic switching and optical networking architectures for data centers and computing systems [Invited]

The rapid increases in data traffic coupled with user preferences are driving the data center and computing system service providers to offer energy-efficient, intelligent, flexible, cost-effective, high-capacity, and low-latency data services without added complexity to the users. Disaggregated heterogeneous reconfigurable computing systems realized by photonic switching and interconnects can enhance throughput and energy efficiency for artificial intelligence/machine learning (AI/ML) workloads, especially when aided by the AI/ML-enhanced control plane. Photonic switching and new optical networking architectures are expected to solve many of these challenging problems. This paper discusses new trends in photonic switching and optical network architectures for future data centers and computing systems summarized as follows: (1) flat reconfigurable disaggregated computing enabled by high-radix photonic switching and interconnects in data centers; (2) chiplet-based computing architectures empowered by embedded photonics toward heterogeneous reconfigurable computing; (3) nanosecond-scale photonic switching in data centers and computing systems; (4) AI/ML in self-driving, application-aware, and situation-aware data centers; (5) the emergence of flexible networking for cloud computing, edge computing, and split computing, as well as flexible networking for 5G/6G RF-optical networks; and (6) the deployment of embedded co-designed silicon photonics being considered for future data centers.

Yoo, S. J. Ben (ORCID:0000000274201871)↗

NASA NTRS1988

Electrooptical adaptive switching network for the hypercube computer

An all-optical network design for the hyperswitch network using regular free-space interconnects between electronic processor nodes is presented. The adaptive routing model used is described, and an adaptive routing control example is presented. The design demonstrates that existing electrooptical techniques are sufficient for implementing efficient parallel architectures without the need for more complex means of implementing arbitrary interconnection schemes. The electrooptical hyperswitch network significantly improves the communication performance of the hypercube computer.

Chow, E.↗

NASA NTRS2005

NASA Tech Briefs, April 2005

Gas-Tolerant Device Senses Electrical Conductivity of Liquid Nanoactuators Based on Electrostatic Forces on Dielectrics Replaceable Microfluidic Cartridges for a PCR Biosensor CdZnTe Image Detectors for Hard-X-Ray Telescopes High-Aperture-Efficiency Horn Antenna Full-Circle Resolver-to-Linear-Analog Converter Continuous, Full-Circle Arctangent Circuit Advanced Three-Dimensional Display System Automatic Focus Adjustment of a Microscope Topics covered include: FastScript3D - A Companion to Java 3D; Generating Mosaics of Astronomical Images; Simulating Descent and Landing of a Spacecraft; Simulating Vibrations in a Complex Loaded Structure; Rover Sequencing and Visualization Program; Software Template for Instruction in Mathematics; Support for User Interfaces for Distributed Systems; Nanostructured MnO2-Based Cathodes for Li-Ion/Polymer Cells; Multi-Layer Laminated Thin Films for Inflatable Structures; Two-Step Laser Ranging for Precise Tracking of a Spacecraft; Growing Aligned Carbon Nanotubes for Interconnections in ICs; Multilayer Composite Pressure Vessels; Texturing Blood-Glucose-Monitoring Optics Using Oxygen Beams; Fault-Tolerant Heat Exchanger; Atomic Clock Based on Opto-Electronic Oscillator; Microfocus/Polycapillary-Optic Crystallographic X-Ray Sys; Depth-Penetrating Luminescence Thermography of Thermal- Barrier Coatings; One-Dimensional Photonic Crystal Superprisms; Measuring Low-Order Aberrations in a Segmented Telescope; Mapping From an Instrumented Glove to a Robot Hand; Application of the Hilbert-Huang Transform to Financial Data; Optimizing Parameters for Deep-Space Optical Communication; and Low-Shear Microencapsulation and Electrostatic Coating.

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