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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS1999

Nondestructive Detection of Cracks in Ceramics Using Vicinal Illumination

Cracks and other defects in ceramic materials can be difficult or impossible to examine and photograph due to the extreme lack of contrast. A method for inspecting translucent ceramics using scattered light, also known as vicinal illumination, will be described. This method has been known in the ceramics industry for quite some time, but is not well known in the testing and failure analysis community. Electronics applications include substrates, packages, multilayer capacitors, and thin film resistors. Ceramic materials are used in electronic applications as microcircuit packages and substrates which carry signals and power between microcircuits. Fine cracks in ceramic materials can result in mechanical failures, electrical failures, and loss of hermeticity. Often, fine cracks are difficult or impossible to detect using standard nondestructive inspection techniques such as visual inspection, ultrasonic inspection, or vapor crack detection. Dye penetrant inspection is usually effective, but contaminates the part, which is unacceptable for space flight hardware. One effective nondestructive inspection method of detecting cracks involves examining the way in which light scatters through the ceramic material when viewed with a standard bright field reflected light microscope. This method, termed vicinal illumination, has been used for detecting cracks during failure analyses of several part types, and screening of space flight hardware. The technique has proven effective on several different types of ceramic materials as well. A related method for use with dark field equipment has also been used to successfully locate otherwise invisible cracks.

Hull, Scott M.↗
NASA NTRS1999

Assessment of Selected CERES Electronic Component Survivability under Simulated Overvoltage Conditions

In August, 1998 a Clouds and the Earth's Radiant Energy System (CERES) instrument telemetry housekeeping parameter generated a yellow warning message that indicated an on-board + 15V Data Acquisition Assembly (DAA) power converter deregulation anomaly. An exhaustive investigation was undertaken to understand this anomaly and the long-term consequences which have severely reduced CERES operations on the Tropical Rainfall Measuring Mission (TRMM) spacecraft. Among investigations performed were ground tests that approximated the on-board electronic circuitry using a small quantity of flight identical components exposed to maximum spacecraft bus over-voltage conditions. These components include monolithic integrated microcircuits that perform analog signal conditioning on instrument sensor signals and an analog- to-digital converter (ADC) for the entire DAA. All microcircuit packages have either a bipolar silicon design with internal current limiting protections or have a complementary metal oxide semiconductor (CMOS) design with bias protections. Ground tests that have been running for approximately 8 months have indicated that these components are capable of withstanding as much as twice their input supply voltage ratings without noticeable performance degradation. These data provide CERES operators with confidence of being able to continue science operations over the remaining life of the TRMM mission. This paper will discuss this anomaly and some possible causes, a simulator of affected electronics, test results, prognosis for future CERES operations, and conclusions.

Chapman, John J.↗
NASA NTRS2006

Effect of High Temperature Storage in Vacuum, Air, and Humid Conditions on Degradation of Gold/Aluminum Wire Bonds in PEMs

Microcircuits encapsulated in three plastic package styles were stored in different environments at temperatures varying from 130 C to 225 C for up to 4,000 hours in some cases. To assess the effect of oxygen, the parts were aged at high temperatures in air and in vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. High temperature storage testing of decapsulated microcircuits in air, vacuum, and HAST chambers was carried out to evaluate the role of molding compounds in the environmentally-induced degradation and failure of wire bonds (WB). This paper reports on accelerating factors of environment and molding compound on WB failures. It has been shown that all environments, including oxygen, moisture, and the presence of molding compounds reduce time-to-failures compared to unencapsulated devices in vacuum conditions. The mechanism of the environmental effect on KB degradation is discussed.

Teverovsky, Alexander↗
NASA NTRS2013

Data Transfer for Multiple Sensor Networks Over a Broad Temperature Range

At extreme temperatures, cryogenic and over 300 C, few electronic components are available to support intelligent data transfer over a common, linear combining medium. This innovation allows many sensors to operate on the same wire bus (or on the same airwaves or optical channel: any linearly combining medium), transmitting simultaneously, but individually recoverable at a node in a cooler part of the test area. This innovation has been demonstrated using room-temperature silicon microcircuits as proxy. The microcircuits have analog functionality comparable to componentry designed using silicon carbide. Given a common, linearly combining medium, multiple sending units may transmit information simultaneously. A listening node, using various techniques, can pick out the signal from a single sender, if it has unique qualities, e.g. a voice. The problem being solved is commonly referred to as the cocktail party problem. The human brain uses the cocktail party effect when it is able to recognize and follow a single conversation in a party full of talkers and other noise sources. High-temperature sensors have been used in silicon carbide electronic oscillator circuits. The frequency of the oscillator changes as a function of the changes in the sensed parameter, such as pressure. This change is analogous to changes in the pitch of a person s voice. The output of this oscillator and many others may be superimposed onto a single medium. This medium may be the power lines supplying current to the sensors, a third wire dedicated to data transmission, the airwaves through radio transmission, an optical medium, etc. However, with nothing to distinguish the identities of each source that is, the source separation this system is useless. Using digital electronic functions, unique codes or patterns are created and used to modulate the output of the sensor.

Krasowski, Michael↗
NASA NTRS2016

Open Source Radiation Hardened by Design Technology

The proposed technology allows use of the latest microcircuit technology with lowest power and fastest speed, with minimal delay and engineering costs, through new Radiation Hardened by Design (RHBD) techniques that do not require extensive process characterization, technique evaluation and re-design at each Moore's Law generation. The separation of critical node groups is explicitly parameterized so it can be increased as microcircuit technologies shrink. The technology will be open access to radiation tolerant circuit vendors. INNOVATION: This technology would enhance computation intensive applications such as autonomy, robotics, advanced sensor and tracking processes, as well as low power applications such as wireless sensor networks. OUTCOME / RESULTS: 1) Simulation analysis indicates feasibility. 2)Compact voting latch 65 nanometer test chip designed and submitted for fabrication -7/2016. INFUSION FOR SPACE / EARTH: This technology may be used in any digital integrated circuit in which a high level of resistance to Single Event Upsets is desired, and has the greatest benefit outside low earth orbit where cosmic rays are numerous.

Shuler, Robert↗
NASA NTRS1964

Microelectronics

Development and applications of microelectronics and microcircuits

TECHNOLOGY↗
DOE OSTI2024

WarpX: Delivering Unprecedented Particle-in-Cell Simulation Capability

Since 1939, more than 30 percent of all Nobel prizes in physics and four of the past 14 prizes in chemistry have been awarded for work with particle accelerators. These tools are now used to treat cancer and produce medical supplies, support research in applied fields such as pharmaceuticals, create microcircuits, and sterilize food—and the applications list continues to grow. However, the size of the facilities needed to house these machines—which are often dozens of kilometers long—has limited their future potential. Thus, researchers are motivated to create novel particle accelerator designs that provide new imaging capability but have a much smaller footprint. The Exascale Computing Project’s WarpX application captures the full complexity of the acceleration processes within plasma-based design, supporting the rapid and cost-efficient development of tens of thousands of new particle accelerators for various applications from improving human health to nuclear fusion reactors.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
NASA NTRS1966

Rugged microelectronic module package supports circuitry on heat sink

Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules.

Johnson, A. L.↗