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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Experimental board includes three layers of special tridirectionally woven fabric. Alumina particles play major role in reducing coefficient of expansion. They also serve as heat sink for heat-generating components.
The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.
Studies of tape recorder failure modes in spacecraft tape-recorder applications reveal that failures within the mechanical transport package far outnumber those of the associated electronics. It would, therefore, be desirable to simplify the transport mechanism and to separate the moving parts with a continuously fresh supply of a single inert lubricant medium. The suggestion is made to replace the ball bearings with hydrostatically pressurized fluid film bearings.
A number of space missions were proposed which utilize 30-cm mercury bombardment ion thrusters and also require a large number of thruster restarts. A test program was carried out to determine thermal cycle life of several different cathode heater designs. Plasma/flame sprayed heaters and swaged type heaters were tested. Four of the five plasma/flame sprayed heaters tested failed in a comparatively short time. Four tantalum swaged heaters that were brazed to the tantalum cathode tube were successfully tested and met the goals that were set at the start of the test.
Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.
A number of space missions have been proposed which will utilize 30-cm mercury bombardment ion thrusters and also will require a large number of thruster restarts. A test program was carried out to determine thermal cycle life of several different cathode heater designs. Plasma/flame sprayed heaters and swaged type heaters were tested. Four of the five plasma/flame sprayed heaters tested failed in a comparatively short time. Four tantalum swaged heaters that were brazed to the tantalum cathode tube were successfully tested and met the goals that were set at the start of the test.
Guidelines are given for the selection and application of three types of tantalum electrolytic capacitors in current use in the design of electrical and electronic circuits for space flight missions. In addition, the guidelines supplement requirements of existing military specifications used in the procurement of capacitors. A need exists for these guidelines to assist designers in preventing some of the recurring, serious problems experienced with tantalum electrolytic capacitors in the recent past. The three types of capacitors covered by these guidelines are; solid, wet foil, and tantalum cased wet slug.
The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure.
The FTMP (Fault-Tolerant Multiprocessor) is a complex multiprocessor computer that employs a form of redundancy related to systems considered by Mathur (1971), in which each major module can substitute for any other module of the same type. Despite the conceptual simplicity of the redundancy form, the implementation has many intricacies owing partly to the low target failure rate, and partly to the difficulty of eliminating single-fault vulnerability. An extensive analysis of the computer through the use of such modeling techniques as Markov processes and combinatorial mathematics shows that for random hard faults the computer can meet its requirements. It is also shown that the maintenance scheduled at intervals of 200 hr or more can be adequate most of the time.
The use and implementation of Ada in distributed environments in which the hardware components are assumed to be unreliable is investigated. The possibility that a distributed system can be programmed entirely in Ada so that the individual tasks of the system are unconcerned with which processor they are executing on, and that failures can occur in the underlying hardware is considered. The reduced cost of computer hardware and the advantages of distributed processing (for example, increased reliability through redundancy and greater flexibility) indicate that many aerospace computer systems can be distributed. The use of Ada and distributed systems is a good combination for aerospace embedded systems.
Flight control system (FCS) reliability is discussed in terms of sensors, computers and actuators. The servo/actuation bottleneck is discussed. FCS survivability is considered. Preliminary survivability issues. A Grumman study vehicle, R-14, and YF-16 aircraft configurations are studied. Goals of control are reviewed.
The use and implementation of Ada (a trade mark of the US Dept. of Defense) in distributed environments in which the hardware are assumed to be unreliable were investigated. The possibility that a distributed system is programmed entirely in Ada so that the individual tasks of the system are unconcerned with which processors they are executing on and failures occurring in the underlying hardware were examined.
The work performed on thermal vacuum testing of complex mechanisms is described. The objective of these tests is to assess the mechanism reliability by monitoring performance in an environment that closely resembles the environment that will occur during flight. To be both valid and cost effective, these tests are performed in a detailed, formally controlled manner. A review of the major test observations is given, during which time some failure modes are detected. Full confidence now exists in many mechanism and component designs, and much valuable data obtained.
The use and implementation of Ada in distributed environments in which reliability is the primary concern is investigated. Emphasis is placed on the possibility that a distributed system may be programmed entirely in ADA so that the individual tasks of the system are unconcerned with which processors they are executing on, and that failures may occur in the software or underlying hardware. The primary activities are: (1) Continued development and testing of our fault-tolerant Ada testbed; (2) consideration of desirable language changes to allow Ada to provide useful semantics for failure; (3) analysis of the inadequacies of existing software fault tolerance strategies.
New methods to advance the state-of-the-art of pressure sensors for the Space Shuttle Main Engine were demonstrated. The results of the feasibility and breadboard demonstration phase and the current status of the research development prototype follow-on phase are presented. A technology breakthrough utilizing silicon piezoresistive technology was achieved in the first phase. A transducer design concept for the SSME application utilizes packaging materials with similar thermal coefficients of expansion and maintains the transducer seals primarily in compression. The silicon chip design will provide dual sensing outputs with laser trimmable integrated compensating electronics. The silicon resistor ion implant dose was customized for the SSME temperature requirement. A basic acoustic modeling software program was developed to evaluate the frequency response characteristics for the package design.
The use and implementation of Ada in distributed environments in which reliability is the primary concern were investigted. A distributed system, programmed entirely in Ada, was studied to assess the use of individual tasks without concern for the processor used. Continued development and testing of the fault tolerant Ada testbed; development of suggested changes to Ada to cope with the failures of interest; design of approaches to fault tolerant software in real time systems, and the integration of these ideas into Ada; and the preparation of various papers and presentations were discussed.
The use and implementation of Ada in distributed environments in which reliability is the primary concern were investigated. In particular, the concept that a distributed system may be programmed entirely in Ada so that the individual tasks of the system are unconcerned with which processors they are executing on, and that failures may occur in the software or underlying hardware was examined. Progress is discussed for the following areas: continued development and testing of the fault-tolerant Ada testbed; development of suggested changes to Ada so that it might more easily cope with the failure of interest; and design of new approaches to fault-tolerant software in real-time systems, and integration of these ideas into Ada.
The general inadequacy of Ada for programming systems that must survive processor loss was shown. A solution to the problem was proposed in which there are no syntatic changes to Ada. The approach was evaluated using a full-scale, realistic application. The application used was the Advanced Transport Operating System (ATOPS), an experimental computer control system developed for a modified Boeing 737 aircraft. The ATOPS system is a full authority, real-time avionics system providing a large variety of advanced features. Methods of building fault tolerance into concurrent systems were explored. A set of criteria by which the proposed method will be judged was examined. Extensive interaction with personnel from Computer Sciences Corporation and NASA Langley occurred to determine the requirements of the ATOPS software. Backward error recovery in concurrent systems was assessed.