Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “high density”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS2017

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗
NASA NTRS2016

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗
DOE OSTI2024

Implosion simulations and optimum times of radiographic Images in OMEGA high-density-carbon cylinder experiments

The Los Alamos Ignition Threshold team is planning direct-drive cylinder implosion experiments (CylDRT24B) at the OMEGA laser, scheduled for Thursday 23 May 2024, to investigate the effect of granular microstructure in high density carbon (HDC) shells. Granular microstructure is believed to play a crucial role in seeding perturbations, reducing compression, and enhancing mix in the implosion of HDC shells at the National Ignition Facility (NIF). But the ICF community lacks a detailed understanding of how grains induce these effects, owing partly to the practical difficulty of numerically simulating the behavior of tiny nanometer-scale granular structures in laboratory-scale experiments. Our planned experiments are aimed at acquiring data to help constrain simulations and calibrate reduced models.

36 MATERIALS SCIENCE↗
NASA NTRS1991

High density packaging and interconnect of massively parallel image processors

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Carson, John C.↗
DOE OSTI2024

Modular Coaxial Power Converter for High-Density Integration into Medium-Voltage Cables

This work proposes to combine the functionality benefits of power electronics with the power density benefits of medium-voltage cables to create a streamlined, high-density power electronics solution that seamlessly integrates with medium-voltage cables. Located at the ends of a medium- or high-voltage line, the proposed converter uses a cascade of coaxial power conversion cells to gradually step down the voltage, and excels in high step-down applications. By mimicking the coaxial geometry of medium-voltage cables, the converter preserves the axisymmetric electric field of the cable which, when combined with a solid insulating dielectric, provides a voltage scaling advantage over conventional planar and PCB-based converter solutions. Similar to medium voltage cables, the converter is fully passively cooled. A passive cooling strategy allows for combined installation with existing medium voltage cable systems without the added cost, maintenance needs, infrastructure, and reliability concerns associated with active cooling systems. The scalability of the modular structure in combination with the integration benefits provide a flexible power electronics system that can adapt to the evolving demands of the grid.

coaxial power conversion cells↗
DOE OSTI2024

Pyrolysis of high-density polyethylene: Degradation behaviors, kinetics, and product characteristics

Pyrolysis is a promising technology for converting plastic waste into valuable raw materials while offering a potential solution to the global plastic pollution crisis. In this study, the thermal pyrolysis of high-density polyethylene (HDPE) is investigated in a drop tube reactor under nearly isothermal conditions. The impact of reaction temperature and gas/volatile residence time on carbon conversion and product distribution is examined across a range of 500–900°C and 3.6–32.2s, respectively. Non-condensable gas products detected by online mass spectrometry are H 2 , CH 4 , C 2 H 4 , C 2 H 6 , C 3 H 6 , and C 3 H 8 . At elevated temperatures and prolonged residence time, H 2 yield reaches as high as 8.6 wt% of the initial HDPE mass due to intensified cracking reactions of C 2 –C 3 hydrocarbons and long-chain aliphatic compounds. Consequently, pyrolysis tars consist mainly of polycyclic aromatic hydrocarbons (PAHs) with 5–7 rings, accompanied by visible coke deposition within the reactor. HDPE decomposition to volatiles is an endothermic process and it is complete at a temperature between 492°C and 525°C, depending on the heating rate employed, from non-isothermal thermogravimetric analysis and differential scanning calorimetry (TGA-DSC) measurements. The thermal degradation of HDPE pellets follows the two-dimensional nucleation growth model for conversion levels up to 0.8 with an apparent activation energy of 259–270 kJ/mol and a pre-exponential factor of 4.83 × 10 17 –1.37 × 10 19 min -1 , determined from various isoconversional methods such as Flynn-Wall-Ozawa (FWO), Kissinger-Akahira-Sunose (KAS), and Starink, along with Criado's master plots. Further, these findings provide valuable insights into optimizing process parameters and refining reactor design for pyrolysis, which can be integrated with gasification and reforming processes to enhance hydrogen production on a larger scale.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1976

Measurements of uranium mass confined in high density plasmas

An X-ray absorption method for measuring the amount of uranium confined in high density, rf-heated uranium plasmas is described. A comparison of measured absorption of 8 keV X-rays with absorption calculated using Beer Law indicated that the method could be used to measure uranium densities from 3 times 10 to the 16th power atoms/cu cm to 5 times 10 to the 18th power atoms/cu cm. Tests were conducted to measure the density of uranium in an rf-heated argon plasma with UF6 infection and with the power to maintain the discharge supplied by a 1.2 MW rf induction heater facility. The uranium density was measured as the flow rate through the test chamber was varied. A maximum uranium density of 3.85 times 10 to the 17th power atoms/cu cm was measured.

Stoeffler, R. C.↗
DOE OSTI2024

The effect of plasma shaping on high density H-mode SOL profiles and fluctuations in TCV

Abstract The impact of plasma shaping on the properties of high density H-mode scrape-off layer (SOL) profiles and transport at the outer midplane has been investigated on Tokamakà configuration variable. The experimental dataset has been acquired by evolving the upper triangularity while keeping the other parameters constant. The scan comprises δ u p values between 0.0 and 0.6, excluding negative triangularity scenarios. Within this study, a transition from type-I edge localised modes to the quasi-continuous exhaust regime takes place from low to high δ u p . The modification of the upstream SOL profiles has been assessed, in terms of separatrix quantities, within the α t turbulence control parameter theoretical framework (Eich et al 2020 Nucl. Fusion 60 056016). The target parallel heat load and the upstream near-SOL density profiles have been shown to broaden significantly for increasing α t . Correspondingly, in the far SOL a density shoulder formation is observed when moving from low to high δ u p . These behaviours have been correlated with an enhancement of the SOL fluctuation level, as registered by wall-mounted Langmuir probes as well as the thermal helium beam diagnostic. Specifically, both the background and the filamentary-induced fluctuating parts of the first wall ion saturation current signal are larger at higher δ u p , with filaments being ejected more frequently into the SOL. Comparison of two pulses at the extremes of the δ u p scan range, but with otherwise same input parameters, shows that the midplane neutral pressure does not change much during the H-mode phase of the discharge. This indicates that indirect effects of the change in geometry, linked to first wall recycling sources, should not play a significant role. The total core radiation increases at high δ u p , on account of a stronger plasma–wall interaction and resulting larger carbon impurity intake from the first wall. This is likely associated to the enhanced first wall fluctuations, as well as a smaller outer gap and the close-to-double-null magnetic topology at high shaping.

Stagni, A. (ORCID:0000000180841544)↗
DOE OSTI2022

High-density polarization-induced 2D electron gases in N-polar pseudomorphic undoped GaN/Al 0.85 Ga 0.15 N heterostructures on single-crystal AlN substrates

The polarization difference and band offset between Al(Ga)N and GaN induce two-dimensional (2D) free carriers in Al(Ga)N/GaN heterojunctions without any chemical doping. A high-density 2D electron gas (2DEG), analogous to the recently discovered 2D hole gas in a metal-polar structure, is predicted in a N-polar pseudomorphic GaN/Al(Ga)N heterostructure on unstrained AlN. We report the observation of such 2DEGs in N-polar undoped pseudomorphic GaN/AlGaN heterostructures on single-crystal AlN substrates by molecular beam epitaxy. With a high electron density of ~4.3 ×10 13 /cm 2 that maintains down to cryogenic temperatures and a room temperature electron mobility of ~450 cm 2 /V s, a sheet resistance as low as ~320 Ω/$\Box$ is achieved in a structure with an 8 nm GaN layer. Finally, these results indicate significant potential of AlN platform for future high-power RF electronics based on N-polar III-nitride high electron mobility transistors.

42 ENGINEERING↗
NASA NTRS1968

Molding a high-density laminate

Molding press is used to form phenolic resin impregnated glass fiber cloth into a high-density, cylindrical-ring laminate. The press applies clamping pressure and heat to a mold containing the glass fiber cloth laminate, which has hydrostatic pressure applied to it by means of a specially designed pressure plug.

Haraway, W. M.↗
NASA NTRS1980

Orbiter thermal pressure drop characteristics for shuttle orbiter thermal protection system components: High density tile, low density tile, densified low density tile, and strain isolation pad

Pressure drop tests were conducted on available samples of low and high density tile, densified low density tile, and strain isolation pads. The results are presented in terms of pressure drop, material thickness and volume flow rate. Although the test apparatus was only capable of a small part of the range of conditions to be encountered in a Shuttle Orbiter flight, the data serve to determine the type of flow characteristics to be expected for each material type tested; the measured quantities also should serve as input for initial venting and flow through analysis.

Lawing, P. L.↗
NASA NTRS2024

High Density Vertiplex - Scalable Autonomous Operations - Flight Test Report

This Technical Memorandum describes the approach taken within the High Density Vertiplex Project to perform rapid prototyping and assessment of the UAM Ecosystem including representative: Onboard Autonomous Systems, Ground Control and Fleet Management Systems, Airspace Management Systems, and Vertiport Automation Systems (VAS). Small Uncrewed Aerial Systems (sUAS) were employed as effective low risk and inexpensive surrogates for larger proposed UAM aircraft to accelerate the prototyping effort, ensure safety, greatly mitigate costs, and accelerate progress. Flight testing performed included multivehicle operations where usability Human Factors (HF) data was collected on the operators.

Jacob Schaefer↗
DOE OSTI2021

Real-Time Lossless Compression for Ultra-High-Density Synchrophasor and Point on Wave Data

Modern advanced Phasor Measurement Units (PMUs) are developed with ultra-high reporting rates to meet the demand for monitoring the power systems dynamics in detail. Due to the large volume of data, the communication and storage systems are seriously challenged with the presence of Ultra-High-Density (UHD) synchrophasor and Point on Wave (POW) data. Therefore, it is an urgent task to compress the UHD data for more efficient communication and data storage. This paper proposes several methods to compress the synchrophasor and POW data in a lossless manner. First, an Improved-Time-Series-Special Compression (ITSSC) method is proposed to compress the UHD frequency data. Second, a Delta-difference Huffman method is combined with the TSSC algorithm to compress the UHD phase angle data. Finally, a cyclical high-order delta modulation method is proposed to compress the UHD POW data. The proposed models are extensively tested and compared with different existing lossless compression algorithms using the field-collected synchrophasor and POW data at different reporting rates. The results indicate that the proposed algorithms are efficient in performing lossless compression for the UHD synchrophasor and POW data in real time.

42 ENGINEERING↗
DOE OSTI2025

Influence of plasma screening on high-density inverse bremsstrahlung absorption

A spherical-implosion platform diagnosed with the “beamlets” scattered-light detector provides high sensitivity to the impact of plasma screening on inverse bremsstrahlung absorption. Contrary to the more restrictive screening length suggested previously [D. Turnbull et al., Phys. Rev. Lett. 130, 145103 (2023); D. Turnbull et al., Phys. Plasmas 31, 063304 (2024)], the beamlets data indicate that the electron-only Debye length is the relevant screening length for high-density inverse bremsstrahlung absorption. Furthermore, using the updated absorption model, we simulate the OMEGA direct-drive inertial confinement fusion implosion database and show that bang times are well reproduced without any ad hoc multipliers.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
NASA NTRS2000

Ultra-High Density Holographic Memory Module with Solid-State Architecture

NASA's terrestrial. space, and deep-space missions require technology that allows storing. retrieving, and processing a large volume of information. Holographic memory offers high-density data storage with parallel access and high throughput. Several methods exist for data multiplexing based on the fundamental principles of volume hologram selectivity. We recently demonstrated that a spatial (amplitude-phase) encoding of the reference wave (SERW) looks promising as a way to increase the storage density. The SERW hologram offers a method other than traditional methods of selectivity, such as spatial de-correlation between recorded and reconstruction fields, In this report we present the experimental results of the SERW-hologram memory module with solid-state architecture, which is of particular interest for space operations.

Markov, Vladimir B.↗
DOE OSTI2024

High-density stable glasses formed on soft substrates

Enabled by surface-mediated equilibration, physical vapour deposition can create high-density stable glasses comparable with liquid-quenched glasses aged for millions of years. Deposition is often performed at various rates and temperatures on rigid substrates to control the glass properties. Here, in this work, we demonstrate that on soft, rubbery substrates, surface-mediated equilibration is enhanced up to 170 nm away from the interface, forming stable glasses with densities up to 2.5% higher than liquid-quenched glasses within 2.5 h of deposition. Gaining similar properties on rigid substrates would require 10 million times slower deposition, taking ~3,000 years. Controlling the modulus of the rubbery substrate provides control over the glass structure and density at constant deposition conditions. These results underscore the significance of substrate elasticity in manipulating the properties of the mobile surface layer and thus the glass structure and properties, allowing access to deeper states of the energy landscape without prohibitively slow deposition rates.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Evidence for anti-synergism between ion-assisted etching and in-plasma photoassisted etching of silicon in a high-density chlorine plasma

Etching of p-Si in 60 mTorr 10%Cl2/90%Ar Faraday-shielded inductively coupled high density plasmas was investigated under both ionassisted etching (IAE) and photoassisted etching (PAE) conditions. Real-time etching rates and after-etching Si surface chemical compositions were obtained by laser interferometry and vacuum-transfer x-ray photoelectron spectroscopy (XPS), respectively. Precisely controlled ion energy distributions (IEDs) were generated by applying pulsed negative DC bias on the conductive sample stage. Above a 36 eV threshold at a total flow rate of 250 SCCM, the IAE rate increased with the square root of the ion energy. In contrast to the DC bias, etching under RF bias did not exhibit a threshold ion energy because of the wide IED. XPS spectra revealed that the surface layer under PAE conditions had a significantly lower chlorine content, composed of only SiCl. Under IAE conditions, however, silicon dangling bonds (Si•), SiCl 2 , and SiCl 3 were found on the surface, in addition to SiCl, with a relative abundance of SiCl > SiCl 2 , and SiCl 3 . The absence of higher chlorides and Si• under PAE conditions suggested that vacuum ultraviolet photons and above threshold-energy ions interact with the surface very differently. By varying the duty cycle of the pulsed DC bias, it was found that the IAE rate scaled with the energetic ion dose, but only for low duty cycles. For higher duty cycles, the apparent IAE yield fell off with an increasing Cl coverage on the surface, as the duty cycle went up, which pointed to a negative synergy (antisynergism) between PAE and IAE as the explanation. This antisynergism was further supported by the observed decrease of the total etching rate with an increasing period of the pulsed DC bias. A plausible mechanism is that increasing the pulsing period causes more near-surface damage, creating more recombination centers that lead to a higher loss rate of electron-hole pairs through recombination, thereby reducing the PAE rate.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗