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At least 163 records · Page 9

The Inclusion of Arbitrary Load Histories in the Strength Decay Model for Stress Rupture

Stress rupture is a failure mechanism where failures can occur after a period of time, even though the material has seen no increase in load. Carbon/epoxy composite materials have demonstrated the stress rupture failure mechanism. In a previous work, a model was proposed for stress rupture of composite overwrap pressure vessels (COPVs) and similar composite structures based on strength degradation. However, the original model was limited to constant load periods (holds) at constant load. The model was expanded in this paper to address arbitrary loading histories and specifically the inclusions of ramp loadings up to holds and back down. The broadening of the model allows for failures on loading to be treated as any other failure that may occur during testing instead of having to be treated as a special case. The inclusion of ramps can also influence the length of the "safe period" following proof loading that was previously predicted by the model. No stress rupture failures are predicted in a safe period because time is required for strength to decay from above the proof level to the lower level of loading. Although the model can predict failures during the ramp periods, no closed-form solution for the failure times could be derived. Therefore, two suggested solution techniques were proposed. Finally, the model was used to design an experiment that could detect the difference between the strength decay model and a commonly used model for stress rupture. Although these types of models are necessary to help guide experiments for stress rupture, only experimental evidence will determine how well the model may predict actual material response. If the model can be shown to be accurate, current proof loading requirements may result in predicted safe periods as long as 10(13) years. COPVs design requirements for stress rupture may then be relaxed, allowing more efficient designs, while still maintaining an acceptable level of safety.

Reeder, James R.↗

Effect of Preloading on Fatigue Strength in Dynamic Fatigue Testing of Ceramic Materials at Elevated Temperatures

Previously derived solutions of fatigue strength as a function of preloading were verified by applying preloads to elevated temperature dynamic fatigue tests of 96 wt% alumina at 1000 C and NC 132 silicon nitride at 1100 C. The technique was found very useful in identification and control of the governing failure mechanism when multiple failure mechanisms, such as slow crack growth, creep and oxidation occurred simultaneously at elevated temperatures.

Choi, Sung R.↗

Investigation of advanced fault insertion and simulator methods

The cooperative agreement partly supported research leading to the open-literature publication cited. Additional efforts under the agreement included research into fault modeling of semiconductor devices. Results of this research are presented in this report which is summarized in the following paragraphs. As a result of the cited research, it appears that semiconductor failure mechanism data is abundant but of little use in developing pin-level device models. Failure mode data on the other hand does exist but is too sparse to be of any statistical use in developing fault models. What is significant in the failure mode data is that, unlike classical logic, MSI and LSI devices do exhibit more than 'stuck-at' and open/short failure modes. Specifically they are dominated by parametric failures and functional anomalies that can include intermittent faults and multiple-pin failures. The report discusses methods of developing composite pin-level models based on extrapolation of semiconductor device failure mechanisms, failure modes, results of temperature stress testing and functional modeling. Limitations of this model particularly with regard to determination of fault detection coverage and latency time measurement are discussed. Indicated research directions are presented.

Dunn, W. R.↗

Active doping controls the mode of failure in dense colloidal gels

Mechanical properties of disordered materials are governed by their underlying free energy landscape. In contrast to external fields, embedding a small fraction of active particles within a disordered material generates nonequilibrium internal fields, which can help to circumvent kinetic barriers and modulate the free energy landscape. In this work, we investigate through computer simulations how the activity of active particles alters the mechanical response of deeply annealed polydisperse colloidal gels. We show that the “swim force” generated by the embedded active particles is responsible for determining the mode of mechanical failure, i.e., brittle vs. ductile. We find, and theoretically justify, that at a critical swim force the mechanical properties of the gel decrease abruptly, signaling a change in the mode of mechanical failure. The weakening of the elastic modulus above the critical swim force results from the change in gel porosity and distribution of attractive forces among gel particles, while below the critical swim force, the ductility enhancement is caused by an increase of gel structural disorder. Above the critical swim force, the gel develops a pronounced heterogeneous structure characterized by multiple pore spaces, and the mechanical response is controlled by dynamical heterogeneities. We contrast these results with those of a simulated monodisperse gel that exhibits a nonmonotonic trend of ductility modulation with increasing swim force, revealing a complex interplay between the gel energy landscape and embedded activity.

Zhou, Tingtao (ORCID:000000021766719X)↗

Analyses of Transistor Punchthrough Failures

The failure of two transistors in the Altitude Switch Assembly for the Solid Rocket Booster followed by two additional failures a year later presented a challenge to failure analysts. These devices had successfully worked for many years on numerous missions. There was no history of failures with this type of device. Extensive checks of the test procedures gave no indication for a source of the cause. The devices were manufactured more than twenty years ago and failure information on this lot date code was not readily available. External visual exam, radiography, PEID, and leak testing were performed with nominal results Electrical testing indicated nearly identical base-emitter and base-collector characteristics (both forward and reverse) with a low resistance short emitter to collector. These characteristics are indicative of a classic failure mechanism called punchthrough. In failure analysis punchthrough refers to an condition where a relatively low voltage pulse causes the device to conduct very hard producing localized areas of thermal runaway or "hot spots". At one or more of these hot spots, the excessive currents melt the silicon. Heavily doped emitter material diffuses through the base region to the collector forming a diffusion pipe shorting the emitter to base to collector. Upon cooling, an alloy junction forms between the pipe and the base region. Generally, the hot spot (punch-through site) is under the bond and no surface artifact is visible. The devices were delidded and the internal structures were examined microscopically. The gold emitter lead was melted on one device, but others had anomalies in the metallization around the in-tact emitter bonds. The SEM examination confirmed some anomalies to be cosmetic defects while other anomalies were artifacts of the punchthrough site. Subsequent to these analyses, the contractor determined that some irregular testing procedures occurred at the time of the failures heretofore unreported. These testing irregularities involved the use of a breakout box and were the likely cause of the failures. There was no evidence to suggest a generic failure mechanism was responsible for the failure of these transistors.

Nicolas, David P.↗

Compressive behavior of undulations in filament-wound composites

The compressive performance of a filament-wound cylinder can be severely degraded by unavoidable fiber curvatures due to the presence of crossover bands. These crossover bands contain fiber undulations which influence the compressive strength, stiffness, and associated failure mechanisms of a filament-wound structure. The primary objectives of this study were to identify failure mechanisms and measure the compressive strength and stiffness of test specimens which model the microundulations. Compressive tests were conducted on flat-panel coupons which were developed to model the mechanics of large-scale fiber undulation regions in filament-wound composite cylinders. The primary effect of the undulation regions within a filament-wound structure is to initiate failure. Depending on the overall laminate configuration, the failure process includes various combinations of failure mechanisms, such as delaminations, matrix splitting and/or fiber fracture. These failure mechanisms are aggravated by the presence of large deformations caused by the reduction in local compressive stiffness and the introduction of complex material couplings due to the fiber undulation. Furthermore, the adjacent layers have been shown to strongly influence the compressive strength, stiffness, and associated failure mechanisms by weakening or reinforcing the laminate.

Jensen, David W.↗

Service Life Extension of the Propulsion System of Long-Term Manned Orbital Stations

One of the critical non-replaceable systems of a long-term manned orbital station is the propulsion system. Since the propulsion system operates beginning with the launch of station elements into orbit, its service life determines the service life of the station overall. Weighing almost a million pounds, the International Space Station (ISS) is about four times as large as the Russian space station Mir and about five times as large as the U.S. Skylab. Constructed over a span of more than a decade with the help of over 100 space flights, elements and modules of the ISS provide more research space than any spacecraft ever built. Originally envisaged for a service life of fifteen years, this Earth orbiting laboratory has been in orbit since 1998. Some elements that have been launched later in the assembly sequence were not yet built when the first elements were placed in orbit. Hence, some of the early modules that were launched at the inception of the program were already nearing the end of their design life when the ISS was finally ready and operational. To maximize the return on global investments on ISS, it is essential for the valuable research on ISS to continue as long as the station can be sustained safely in orbit. This paper describes the work performed to extend the service life of the ISS propulsion system. A system comprises of many components with varying failure rates. Reliability of a system is the probability that it will perform its intended function under encountered operating conditions, for a specified period of time. As we are interested in finding out how reliable a system would be in the future, reliability expressed as a function of time provides valuable insight. In a hypothetical bathtub shaped failure rate curve, the failure rate, defined as the number of failures per unit time that a currently healthy component will suffer in a given future time interval, decreases during infant-mortality period, stays nearly constant during the service life and increases at the end when the design service life ends and wear-out phase begins. However, the component failure rates do not remain constant over the entire cycle life. The failure rate depends on various factors such as design complexity, current age of the component, operating conditions, severity of environmental stress factors, etc. Development, qualification and acceptance test processes provide rigorous screening of components to weed out imperfections that might otherwise cause infant mortality failures. If sufficient samples are tested to failure, the failure time versus failure quantity can be analyzed statistically to develop a failure probability distribution function (PDF), a statistical model of the probability of failure versus time. Driven by cost and schedule constraints however, spacecraft components are generally not tested in large numbers. Uncertainties in failure rate and remaining life estimates increase when fewer units are tested. To account for this, spacecraft operators prefer to limit useful operations to a period shorter than the maximum demonstrated service life of the weakest component. Running each component to its failure to determine the maximum possible service life of a system can become overly expensive and impractical. Spacecraft operators therefore, specify the required service life and an acceptable factor of safety (FOS). The designers use these requirements to limit the life test duration. Midway through the design life, when benefits justify additional investments, supplementary life test may be performed to demonstrate the capability to safely extend the service life of the system. An innovative approach is required to evaluate the entire system, without having to go through an elaborate test program of propulsion system elements. Evaluating every component through a brute force test program would be a cost prohibitive and time consuming endeavor. ISS propulsion system components were designed and built decades ago. There are no representative ground test articles for some of the components. A 'test everything' approach would require manufacturing new test articles. The paper outlines some of the techniques used for selective testing, by way of cherry picking candidate components based on failure mode effects analysis, system level impacts, hazard analysis, etc. The type of testing required for extending the service life depends on the design and criticality of the component, failure modes and failure mechanisms, life cycle margin provided by the original certification, operational and environmental stresses encountered, etc. When specific failure mechanism being considered and the underlying relationship of that mode to the stresses provided in the test can be correlated by supporting analysis, time and effort required for conducting life extension testing can be significantly reduced. Exposure to corrosive propellants over long periods of time, for instance, lead to specific failure mechanisms in several components used in the propulsion system. Using Arrhenius model, which is tied to chemically dependent failure mechanisms such as corrosion or chemical reactions, it is possible to subject carefully selected test articles to accelerated life test. Arrhenius model reflects the proportional relationship between time to failure of a component and the exponential of the inverse of absolute temperature acting on the component. The acceleration factor is used to perform tests at higher stresses that allow direct correlation between the times to failure at a high test temperature to the temperatures to be expected in actual use. As long as the temperatures are such that new failure mechanisms are not introduced, this becomes a very useful method for testing to failure a relatively small sample of items for a much shorter amount of time. In this article, based on the example of the propulsion system of the first ISS module Zarya, theoretical approaches and practical activities of extending the service life of the propulsion system are reviewed with the goal of determining the maximum duration of its safe operation.

Kamath, Ulhas↗

Probing the properties and mechanisms of failure waves in soda-lime glass

Soda-lime glass (SLG) and other silica glasses exhibit the failure wave phenomenon under shock compression. The mechanism responsible for this peculiar behavior of glasses is still unresolved. In this study, a series of plate impact experiments was performed at three different impact stresses of 6.4, 8.3, and 10.8 GPa to better understand the mechanisms underlying the failure wave phenomenon. Specifically, spall experiments were conducted to probe the speed and existence of failure waves at different stresses in SLG. A layered glass target was used to probe the possibility of a “renucleation” of the wave at the SLG–SLG interface. When it existed, the failure wave was inferred to propagate at a speed of 1.3 km/s. However, it was observed that the failure wave phenomenon ceases to exist for impact stresses higher than 10 GPa. In experiments with a 6.4 GPa impact stress, the peak free surface velocity was significantly less than what is predicted by stress-Hugoniot calculations. This velocity deficit and other important features of the measured free surface velocity profiles were simulated using finite element analysis by incorporating an abrupt densification of SLG at a critical stress in the equation of state. Furthermore, this densification feature is similar to what would be expected of a phase transition. Although unable to unambiguously reveal the mechanism causing the failure wave phenomenon, the results of the present work clearly indicate that the failure wave causes a secondary compression and densification in SLG.

36 MATERIALS SCIENCE↗

Simulated signatures of ignition

Ignition on the National Ignition Facility (NIF) provides a novel opportunity to evaluate past data to identify signatures of capsule failure mechanisms. We have used new simulations of high-yield implosions as well as some from past studies in order to identify unique signatures of different ignition failure mechanisms: jetting due to the presence of voids or defects, jetting due to the capsule fill tube, interfacial mixing due to instabilities or due to plasma transport, radiative cooling due to the presence of contaminant in the hot spot, long-wavelength drive asymmetry, and preheat. Many of these failure mechanisms exhibit unique trajectories that can be distinguished through variations in experimental observables such as neutron yield, down-scattered ratio (DSR), and burn width. Our simulations include capsules using both plastic and high-density carbon ablators and span all high-yield designs considered since the beginning of the National Ignition Campaign in 2011. We observe that the variability in trajectories through the space of neutron yield, DSR, and burn width varies little across capsule design yet are unique to the failure mechanism. The experimental trajectories are most consistent with simulated preheat and jetting due to voids and defects, which are the only failure mechanisms that are indistinguishable in our analysis. This suggests that improvements to capsule compression due to improved capsule quality or reduced preheat have played a primary role in enabling high yields on NIF. Furthermore, our analysis suggests that further improvements have the potential to increase yields further.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

A Hierarchical Approach to Fracture Mechanics

Recent research conducted under NASA LaRC's Creativity and Innovation Program has led to the development of an initial approach for a hierarchical fracture mechanics. This methodology unites failure mechanisms occurring at different length scales and provides a framework for a physics-based theory of fracture. At the nanoscale, parametric molecular dynamic simulations are used to compute the energy associated with atomic level failure mechanisms. This information is used in a mesoscale percolation model of defect coalescence to obtain statistics of fracture paths and energies through Monte Carlo simulations. The mathematical structure of predicted crack paths is described using concepts of fractal geometry. The non-integer fractal dimension relates geometric and energy measures between meso- and macroscales. For illustration, a fractal-based continuum strain energy release rate is derived for inter- and transgranular fracture in polycrystalline metals.

Saether, Erik↗

An integrated computational materials engineering framework to analyze the failure behaviors of carbon fiber reinforced polymer composites for lightweight vehicle applications

A bottom-up multi-scale modeling approach is used to develop an Integrated Computational Materials Engineering (ICME) framework for carbon fiber reinforced polymer (CFRP) composites, which has the potential to reduce development to deployment lead time for structural applications in lightweight vehicles. In this work, we develop and integrate computational models comprising of four size scales to fully describe and characterize three types of CFRP composites. In detail, the properties of the interphase region are determined by an analytical gradient model and molecular dynamics analysis at the nano-scale, which is then incorporated into micro-scale unidirectional (UD) representative volume element (RVE) models to characterize the failure strengths and envelopes of UD CFRP composites. Then, the results are leveraged to propose an elasto-plastic-damage constitutive law for UD composites to study the fiber tows of woven composites as well as the chips of sheet molding compound (SMC) composites. Subsequently, the failure mechanisms and failure strengths of woven and SMC composites are predicted by the meso-scale RVE models. Finally, building upon the models and results from lower scales, we show that a homogenized macro-scale model can capture the mechanical performance of a hat-section-shaped part under four-point bending. Along with the model integration, we will also demonstrate that the computational results are in good agreement with experiments conducted at different scales. The present work illustrates the potential and significance of integrated multi-scale computational modeling tools that can virtually evaluate the performance of CFRP composites and provide design guidance for CFRP composites used in structural applications.

36 MATERIALS SCIENCE↗

Accelerated Aging System for Prognostics of Power Semiconductor Devices

Prognostics is an engineering discipline that focuses on estimation of the health state of a component and the prediction of its remaining useful life (RUL) before failure. Health state estimation is based on actual conditions and it is fundamental for the prediction of RUL under anticipated future usage. Failure of electronic devices is of great concern as future aircraft will see an increase of electronics to drive and control safety-critical equipment throughout the aircraft. Therefore, development of prognostics solutions for electronics is of key importance. This paper presents an accelerated aging system for gate-controlled power transistors. This system allows for the understanding of the effects of failure mechanisms, and the identification of leading indicators of failure which are essential in the development of physics-based degradation models and RUL prediction. In particular, this system isolates electrical overstress from thermal overstress. Also, this system allows for a precise control of internal temperatures, enabling the exploration of intrinsic failure mechanisms not related to the device packaging. By controlling the temperature within safe operation levels of the device, accelerated aging is induced by electrical overstress only, avoiding the generation of thermal cycles. The temperature is controlled by active thermal-electric units. Several electrical and thermal signals are measured in-situ and recorded for further analysis in the identification of leading indicators of failures. This system, therefore, provides a unique capability in the exploration of different failure mechanisms and the identification of precursors of failure that can be used to provide a health management solution for electronic devices.

Celaya, Jose R.↗

A creep cavity growth model for creep-fatigue life prediction of a unidirectional W/Cu composite

A microstructural model was developed to predict creep-fatigue life in a (0)(sub 4), 9 volume percent tungsten fiber-reinforced copper matrix composite at the temperature of 833 K. The mechanism of failure of the composite is assumed to be governed by the growth of quasi-equilibrium cavities in the copper matrix of the composite, based on the microscopically observed failure mechanisms. The methodology uses a cavity growth model developed for prediction of creep fracture. Instantaneous values of strain rate and stress in the copper matrix during fatigue cycles were calculated and incorporated in the model to predict cyclic life. The stress in the copper matrix was determined by use of a simple two-bar model for the fiber and matrix during cyclic loading. The model successfully predicted the composite creep-fatigue life under tension-tension cyclic loading through the use of this instantaneous matrix stress level. Inclusion of additional mechanisms such as cavity nucleation, grain boundary sliding, and the effect of fibers on matrix-stress level would result in more generalized predictions of creep-fatigue life.

Kim, Young-Suk↗

Failure Investigation of an Intra-Manifold Explosion in a Horizontally-Mounted 870 lbf Reaction Control Thruster

In June 2010, an 870 lbf Space Shuttle Orbiter Reaction Control System Primary Thruster experienced an unintended shutdown during a test being performed at the NASA White Sands Test Facility. Subsequent removal and inspection of the thruster revealed permanent deformation and misalignment of the thruster valve mounting plate. Destructive evaluation determined that after three nominal firing sequences, the thruster had experienced an energetic event within the fuel (monomethylhydrazine) manifold at the start of the fourth firing sequence. The current understanding of the phenomenon of intra-manifold explosions in hypergolic bipropellant thrusters is documented in literature where it is colloquially referred to as a ZOT. The typical ZOT scenario involves operation of a thruster in a gravitational field with environmental pressures above the triple point pressure of the propellants. Post-firing, when the thruster valves are commanded closed, there remains a residual quantity of propellant in both the fuel and oxidizer (nitrogen tetroxide) injector manifolds known as the "dribble volume". In an ambient ground test configuration, these propellant volumes will drain from the injector manifolds but are impeded by the local atmospheric pressure. The evacuation of propellants from the thruster injector manifolds relies on the fluids vapor pressure to expel the liquid. The higher vapor pressure oxidizer will evacuate from the manifold before the lower vapor pressure fuel. The localized cooling resulting from the oxidizer boiling during manifold draining can result in fuel vapor migration and condensation in the oxidizer passage. The liquid fuel will then react with the oxidizer that enters the manifold during the next firing and may produce a localized high pressure reaction or explosion within the confines of the oxidizer injector manifold. The typical ZOT scenario was considered during this failure investigation, but was ultimately ruled out as a cause of the explosion. Converse to the typical ZOT failure mechanism, the failure of this particular thruster was determined to be the result of liquid oxidizer being present within the fuel manifold.

Durning, Joseph G., III↗

Floating Node Method and Virtual Crack Closure Technique for Modeling Matrix Cracking-Delamination Interaction

A novel approach is proposed for high-fidelity modeling of progressive damage and failure in composite materials that combines the Floating Node Method (FNM) and the Virtual Crack Closure Technique (VCCT) to represent multiple interacting failure mechanisms in a mesh-independent fashion. In this study, the approach is applied to the modeling of delamination migration in cross-ply tape laminates. Delamination, matrix cracking, and migration are all modeled using fracture mechanics based failure and migration criteria. The methodology proposed shows very good qualitative and quantitative agreement with experiments.

DeCarvalho, N. V.↗

Floating Node Method and Virtual Crack Closure Technique for Modeling Matrix Cracking-Delamination Migration

A novel approach is proposed for high-fidelity modeling of progressive damage and failure in composite materials that combines the Floating Node Method (FNM) and the Virtual Crack Closure Technique (VCCT) to represent multiple interacting failure mechanisms in a mesh-independent fashion. In this study, the approach is applied to the modeling of delamination migration in cross-ply tape laminates. Delamination, matrix cracking, and migration are all modeled using fracture mechanics based failure and migration criteria. The methodology proposed shows very good qualitative and quantitative agreement with experiments.

DeCarvalho, Nelson V.↗

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗