Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “digital electronic circuits”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 163 records · Page 9

Light-detection electronics for a Raman lidar

A light-detection system for an optical radar, or lidar, unit to be used for remote temperature and composition measurements was designed, built, and bench tested. This detection system processes three return signal wavelengths: two Raman wavelengths, and the Rayleigh-Mie wavelength at 694.3 nanometers. Means of coping with photomultiplier tube instabilities and limitations are discussed. Circuits for gain control, ranging, and digitizing are included. The phototube gains can be switched fully on in 80 meters (450 nsec) or off in 30 meters (200 nsec) of range. The range circuit processes signals from 0.1 to 2 kilometers, with an estimated range resolution of less than 5 meters.

Leser, R. J.↗

Design, development, and fabrication of a electronic analog microminiaturized electronic analog signal to discrete time interval converter

The microminiaturization of an electronic analog signal to discrete time interval converter is presented. Discrete components and integrated circuits comprising the converter were assembled on a thin-film ceramic substrate containing nichrome resistors with gold interconnections. The finished assembly is enclosed in a flat package measuring 3.30 by 4.57 centimeters. The module can be used whenever conversion of analog to digital signals is required, in particular for the purpose of regulation by means of pulse modulation. In conjunction with a precision voltage reference, the module was applied to control the duty cycle of a switching regulator within a temperature range of -55 C to +125 C, and an input voltage range of 10V to 35V. The output-voltage variation was less than + or - 300 parts per million, i.e., less than + or - 3mV for a 10V output.

Schoenfeld, A. D.↗

Effects of Temperature on the Performance and Stability of Recent COTS Silicon Oscillators

Silicon oscillators have lately emerged to serve as potential replacement for crystal and ceramic resonators to provide timing and clock signals in electronic systems. These semiconductor-based devices, including those that are based on MEMS technology, are reported to be resistant to vibration and shock (an important criteria for systems to be deployed in space), immune to EMI, consume very low current, require few or no external components, and cover a wide range of frequency for analog and digital circuits. In this work, the performance of five recently-developed COTS silicon oscillator chips from different manufacturers was determined within a temperature range that extended beyond the individual specified range of operation. In addition, restart capability at extreme temperatures, i.e. power switched on while the device was soaking at extreme (hot or cold) temperature, and the effects of thermal cycling under a wide temperature range on the operation of these silicon oscillators were also investigated. Performance characterization of each oscillator was obtained in terms of its output frequency, duty cycle, rise and fall times, and supply current at specific test temperatures. The five different oscillators tested operated beyond their specified temperature region, with some displaying excellent stability throughout the whole test temperature range. Others experienced some instability at certain temperature test points as evidenced by fluctuation in the output frequency. Recovery from temperature-induced changes took place when excessive temperatures were removed. It should also be pointed out that all oscillators were able to restart at the extreme test temperatures and to withstand the limited thermal cycling without undergoing any significant changes in their characteristics. In addition, no physical damage was observed in the packaging material of any of these silicon oscillators due to extreme temperature exposure and thermal cycling. It is recommended that additional and more comprehensive testing under long term cycling be carried out to fully establish the reliability of these devices and to determine their suitability for use in space exploration missions under extreme temperature conditions.

Patterson, Richard L.↗

Servomotor and Controller Having Large Dynamic Range

A recently developed micro-commanding rotational-position-control system offers advantages of less mechanical complexity, less susceptibility to mechanical resonances, less power demand, less bulk, less weight, and lower cost, relative to prior rotational-position-control systems based on stepping motors and gear drives. This system includes a digital-signal- processor (DSP)-based electronic controller, plus a shaft-angle resolver and a servomotor mounted on the same shaft. Heretofore, micro-stepping has usually been associated with stepping motors, but in this system, the servomotor is micro-commanded in response to rotational-position feedback from the shaft-angle resolver. The shaft-angle resolver is of a four-speed type chosen because it affords four times the resolution of a single-speed resolver. A key innovative aspect of this system is its position-feedback signal- conditioning circuits, which condition the resolver output signal for multiple ranges of rotational speed. In the preferred version of the system, two rotational- speed ranges are included, but any number of ranges could be added to expand the speed range or increase resolution in particular ranges. In the preferred version, the resolver output is conditioned with two resolver-to-digital converters (RDCs). One RDC is used for speeds from 0.00012 to 2.5 rpm; the other RDC is used for speeds of 2.5 to 6,000 rpm. For the lower speed range, the number of discrete steps of RDC output per revolution was set at 262,144 (4 quadrants at 16 bits per quadrant). For the higher speed range, the number of discrete steps per revolution was set at 4,096 (4 quadrants at 10 bits per quadrant).

Alhorn, Dean C.↗

Controller for Driving a Piezoelectric Actuator at Resonance

A digital control system based partly on an extremum-seeking control algorithm tracks the changing resonance frequency of a piezoelectric actuator or an electrically similar electromechanical device that is driven by a sinusoidal excitation signal and is required to be maintained at or near resonance in the presence of uncertain, changing external loads and disturbances. Somewhat more specifically, on the basis of measurements of the performance of the actuator, this system repeatedly estimates the resonance frequency and alters the excitation frequency as needed to keep it at or near the resonance frequency. In the original application for which this controller was developed, the piezoelectric actuator is part of an ultrasonic/sonic drill/corer. Going beyond this application, the underlying principles of design and operation are generally applicable to tracking changing resonance frequencies of heavily perturbed harmonic oscillators. Resonance-frequency-tracking analog electronic circuits are commercially available, but are not adequate for the present purpose for several reasons: The input/output characteristics of analog circuits tend to drift, often necessitating recalibration, especially whenever the same controller is used in driving a different resonator. In the case of an actuator in a system that has multiple modes characterized by different resonance frequencies, an analog controller can tune erroneously to one of the higher-frequency modes. The lack of programmability of analog controllers is problematic when faults occur, and is especially problematic for preventing tuning to a higher-frequency mode. In contrast, a digital controller can be programmed to restrict itself to a specified frequency range and to maintain stability even when the affected resonator is driven at high power and subjected to uncertain disturbances and variable loads. The present digital control system (see figure) is implemented by means of an algorithm that comprises three main subalgorithms: a hill-climbing control algorithm, an estimation-based extremum-seeking control (ESC) algorithm, and a supervisory algorithm. The hill-climbing algorithm is useful for coarse tracking to find and remain within the vicinity of the resonance. The ESC algorithm is not capable of coarse resonance tracking, but is capable of fine resonance tracking once the estimates of parameters generated by the hill-climbing algorithm have converged sufficiently. On the basis of the parameter-estimation errors, the supervisory algorithm switches operation to whichever of the other two algorithms performs best at a given time.

Aldrich, Jack↗

Electronics for Deep Space Cryogenic Applications

Deep space probes and planetary exploration missions require electrical power management and control systems that are capable of efficient and reliable operation in very cold temperature environments. Typically, in deep space probes, heating elements are used to keep the spacecraft electronics near room temperature. The utilization of power electronics designed for and operated at low temperature will contribute to increasing efficiency and improving reliability of space power systems. At NASA Glenn Research Center, commercial-off-the-shelf devices as well as developed components are being investigated for potential use at low temperatures. These devices include semiconductor switching devices, magnetics, and capacitors. Integrated circuits such as digital-to-analog and analog-to-digital converters, DC/DC converters, operational amplifiers, and oscillators are also being evaluated. In this paper, results will be presented for selected analog-to-digital converters, oscillators, DC/DC converters, and pulse width modulation (PWM) controllers.

Patterson, R. L.↗

Development of Thermal Infrared Sensor to Supplement Operational Land Imager

The thermal infrared sensor (TIRS) is a quantum well infrared photodetector (QWIP)-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 m. The focal plane will contain three 640 ~512 QWIP arrays mounted onto a silicon substrate. The readout integrated circuit (ROIC) addresses each pixel on the QWIP arrays and reads out the pixel value (signal). The ROIC is controlled by the focal plane electronics (FPE) by means of clock signals and bias voltage value. The means of how the FPE is designed to control and interact with the TIRS focal plane assembly (FPA) is the basis for this work. The technology developed under the FPE is for the TIRS focal plane assembly (FPA). The FPE must interact with the FPA to command and control the FPA, extract analog signals from the FPA, and then convert the analog signals to digital format and send them via a serial link (USB) to a computer. The FPE accomplishes the described functions by converting electrical power from generic power supplies to the required bias power that is needed by the FPA. The FPE also generates digital clocking signals and shifts the typical transistor-to-transistor logic (TTL) to }5 V required by the FPA. The FPE also uses an application- specific integrated circuit (ASIC) named System Image, Digitizing, Enhancing, Controlling, And Retrieving (SIDECAR) from Teledyne Corp. to generate the clocking patterns commanded by the user. The uniqueness of the FPE for TIRS lies in that the TIRS FPA has three QWIP detector arrays, and all three detector arrays must be in synchronization while in operation. This is to avoid data skewing while observing Earth flying in space. The observing scenario may be customized by uploading new control software to the SIDECAR.

Shu, Peter↗

Nuclear Science Symposium, 19th, and Nuclear Power Systems Symposium, 4th, Miami, Fla., December 6-8, 1972, Proceedings.

Major topics covered include radiation monitoring instrumentation, nuclear circuits and systems, biomedical applications of nuclear radiation in diagnosis and therapy, plasma research for fusion power, reactor control and instrumentation, nuclear power standards, and applications of digital computers in nuclear power plants. Systems and devices for space applications are described, including the Apollo alpha spectrometer, a position sensitive detection system for UV and X-ray photons, a 4500-volt electron multiplier bias supply for satellite use, spark chamber systems, proportional counters, and other devices. Individual items are announced in this issue.

Source record↗

Compact Radar Transceiver with Included Calibration

The Digital Beamforming Synthetic Aperture Radar (DBSAR) is an eight-channel phased array radar system that employs solid-state radar transceivers, a microstrip patch antenna, and a reconfigurable waveform generator and processor unit. The original DBSAR transceiver design utilizes connectorized electronic components that tend to be physically large and heavy. To achieve increased functionality in a smaller volume, PCB (printed circuit board) transceivers were designed to replace the large connectorized transceivers. One of the most challenging problems designing the transceivers in a PCB format was achieving proper performance in the calibration path. For a radar loop-back calibration path, a portion of the transmit signal is coupled out of the antenna feed and fed back into the receiver. This is achieved using passive components for stability and repeatability. Some signal also leaks through the receive path. As these two signal paths are correlated via an unpredictable phase, the leakage through the receive path during transmit must be 30 dB below the calibration path. For DBSAR s design, this requirement called for a 100-dB isolation in the receiver path during transmit. A total of 16 solid-state L-band transceivers on a PCB format were designed. The transceivers include frequency conversion stages, T/R switching, and a calibration path capable of measuring the transmit power-receiver gain product during transmit for pulse-by-pulse calibration or matched filtering. In particular, this calibration path achieves 100-dB isolation between the transmitted signal and the low-noise amplifier through the use of a switching network and a section of physical walls achieving attenuation of radiated leakage. The transceivers were designed in microstrip PCBs with lumped elements and individually packaged components for compactness. Each transceiver was designed on a single PCB with a custom enclosure providing interior walls and compartments to isolate transceiver subsystems from radiated interference. The enclosure also acts as a heat sink for the voltage regulators and power amplifiers inside the system. The PCB transceiver design produces transmit pulses of 2 W with an arbitrary duty cycle. Each transceiver is fed by an external 120-MHz signal transmit and two 1,140-MHz local oscillator signals. The received signal is amplified and down-converted to 120 MHz and is fed to the data processor. The transceiver dimensions are approximately 3.5 11.5 0.6 in. (9 29 1.5 cm). The PCB transceiver design reduces the volume and weight of the DBSAR instrument while maintaining the functionality found in the original design. Both volume and weight are critical for airborne and flight remote sensing instrumentation.

McLinden, Matthew↗

Maximum Acceleration Recording Circuit

Coarsely digitized maximum levels recorded in blown fuses. Circuit feeds power to accelerometer and makes nonvolatile record of maximum level to which output of accelerometer rises during measurement interval. In comparison with inertia-type single-preset-trip-point mechanical maximum-acceleration-recording devices, circuit weighs less, occupies less space, and records accelerations within narrower bands of uncertainty. In comparison with prior electronic data-acquisition systems designed for same purpose, circuit simpler, less bulky, consumes less power, costs and analysis of data recorded in magnetic or electronic memory devices. Circuit used, for example, to record accelerations to which commodities subjected during transportation on trucks.

Bozeman, Richard J., Jr.↗

Re-Configurable Electronics Characterization under Extreme Thermal Environment

The need for reconfigurable electronics is driven by requirements to survive longer missions and harsher environments. It is possible to compensate for degradations in Extreme Environments (EE). EE has effect on electronics: circuits are designed to exploit device characteristics and when a certain temperature or radiation range is exceeded the circuit function gradually degrades. It is possible to employ Hardening by reconfiguration (HBR) to mitigate drifts, degradation, or damage on electronic devices in EE by using reconfigurable devices and an adaptive self-reconfiguration of circuit topology. In this manner degraded components can be salvaged, and completely damaged components can be bypassed. The challenge of conventional design is replaced with that of designing a recover process that automatically performs the (re) design in place of the designer. The objective of testing a Digital Signal Processor (DSP) under the extreme temperatures was to determine the lowest temperature at which the DAP can operate. The objective of testing a Xilinx VirtexII Pro FPGA board was to initially find our whether the evaluation board and the FPGA would survive and continue at temperature ranges from -180 C, and 120 C. The Virtex II functioned correctly at the temperatures tested. The next test was done on the GM-C filter building block using the same temperature range as the Virtex II. The current lower and upper limits were shown to be reduced as the temperature gets lower. The device function can be recovered by increasing the Vb from .08V to .85V. The negative and positive saturation voltages increases as the temperature gets higher. The function of the device can be recovered by decreasing the Vb from .8V to around .75V. The next test was performed to test the recovery of the GmC low pass filter through Vb in a filter circuit. The test indicate that bias voltage control adjustment is an efficient mechanism for circuit recovery at extreme temperatures.

reliability↗

(abstract) A High Throughput 3-D Inner Product Processor

A particularily challenging image processing application is the real time scene acquisition and object discrimination. It requires spatio-temporal recognition of point and resolved objects at high speeds with parallel processing algorithms. Neural network paradigms provide fine grain parallism and, when implemented in hardware, offer orders of magnitude speed up. However, neural networks implemented on a VLSI chip are planer architectures capable of efficient processing of linear vector signals rather than 2-D images. Therefore, for processing of images, a 3-D stack of neural-net ICs receiving planar inputs and consuming minimal power are required. Details of the circuits with chip architectures will be described with need to develop ultralow-power electronics. Further, use of the architecture in a system for high-speed processing will be illustrated.

imaging parallel processing algorithms linear vect↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

Electronic Still Camera

A handheld, programmable, digital camera is disclosed that supports a variety of sensors and has program control over the system components to provide versatility. The camera uses a high performance design which produces near film quality images from an electronic system. The optical system of the camera incorporates a conventional camera body that was slightly modified, thus permitting the use of conventional camera accessories, such as telephoto lenses, wide-angle lenses, auto-focusing circuitry, auto-exposure circuitry, flash units, and the like. An image sensor, such as a charge coupled device ('CCD') collects the photons that pass through the camera aperture when the shutter is opened, and produces an analog electrical signal indicative of the image. The analog image signal is read out of the CCD and is processed by preamplifier circuitry, a correlated double sampler, and a sample and hold circuit before it is converted to a digital signal. The analog-to-digital converter has an accuracy of eight bits to insure accuracy during the conversion. Two types of data ports are included for two different data transfer needs. One data port comprises a general purpose industrial standard port and the other a high speed/high performance application specific port. The system uses removable hard disks as its permanent storage media. The hard disk receives the digital image signal from the memory buffer and correlates the image signal with other sensed parameters, such as longitudinal or other information. When the storage capacity of the hard disk has been filled, the disk can be replaced with a new disk.

Holland, S. Douglas↗

High resolution angular sensor

Specifications for the pointing stabilization system of the large space telescope were used in an investigation of the feasibility of reducing ring laser gyro output quantization to the sub-arc-second level by the use of phase locked loops and associated electronics. Systems analysis procedures are discussed and a multioscillator laser gyro model is presented along with data on the oscillator noise. It is shown that a second order closed loop can meet the measurement noise requirements when the loop gain and time constant of the loop filter are appropriately chosen. The preliminary electrical design is discussed from the standpoint of circuit tradeoff considerations. Analog, digital, and hybrid designs are given and their applicability to the high resolution sensor is examined. the electrical design choice of a system configuration is detailed. The design and operation of the various modules is considered and system block diagrams are included. Phase 1 and 2 test results using the multioscillator laser gyro are included.

Gneses, M. I.↗

NASA Tech Briefs, August 2008

Customizable Digital Receivers for Radar Two-Camera Acquisition and Tracking of a Flying Target Visual Data Analysis for Satellites A Data Type for Efficient Representation of Other Data Types Hand-Held Ultrasonic Instrument for Reading Matrix Symbols Broadband Microstrip-to-Coplanar Strip Double-Y Balun A Topographical Lidar System for Terrain-Relative Navigation Programmable Low-Voltage Circuit Breaker and Tester Electronic Switch Arrays for Managing Microbattery Arrays Topics covered include: Lower-Dark-Current, Higher-Blue-Response CMOS Imagers; Fabricating Large-Area Sheets of Single-Layer Graphene by CVD; Support for Diagnosis of Custom Computer Hardware; Providing Goal-Based Autonomy for Commanding a Spacecraft; Dynamic Method for Identifying Collected Sample Mass; Optimal Planning and Problem-Solving; Attitude-Control Algorithm for Minimizing Maneuver Execution Errors; Grants Document-Generation System; Heat-Storage Modules Containing LiNO3 3H2O and Graphite Foam; Precipitation-Strengthened, High-Temperature, High-Force Shape Memory Alloys; Improved Relief Valve Would Be Less Susceptible to Failure; Safety Modification of Cam-and-Groove Hose Coupling; Using Composite Materials in a Cryogenic Pump; Using Electronic Noses to Detect Tumors During Neurosurgery; Producing Newborn Synchronous Mammalian Cells; Smaller, Lower-Power Fast-Neutron Scintillation Detectors; Rotationally Vibrating Electric-Field Mill; Estimating Hardness from the USDC Tool-Bit Temperature Rise; Particle-Charge Spectrometer; Automated Production of Movies on a Cluster of Computers; FIDO-Class Development Rover; and Tone-Based Command of Deep Space Probes Using Ground Antennas.

Source record↗

Circuit For Control Of Electromechanical Prosthetic Hand

Proposed circuit for control of electromechanical prosthetic hand derives electrical control signals from shoulder movements. Updated, electronic version of prosthesis, that includes two hooklike fingers actuated via cables from shoulder harness. Circuit built around favored shoulder harness, provides more dexterous movement, without incurring complexity of computer-controlled "bionic" or hydraulically actuated devices. Additional harness and potentiometer connected to similar control circuit mounted on other shoulder. Used to control stepping motor rotating hand about prosthetic wrist to one of number of angles consistent with number of digital outputs. Finger-control signals developed by circuit connected to first shoulder harness transmitted to prosthetic hand via sliprings at prosthetic wrist joint.

Bozeman, Richard J., Jr.↗