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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Model Development for the ACME Lab Modular Wall and A-Frame Assemblies

The structural frame used for conducting large structural tests was replaced by the ACME (Applied Combined Mechanical Environments) Lab in Building 860 of Sandia National Laboratories in Albuquerque, NM. This new design required simulation and analysis to verify maximum loads and corresponding factors of safety. Two major assemblies which are part of the ACME Lab, the Modular Wall and A-Frame, were designed to operate with a multitude of components in various configurations and with varying loads. Simulations of the Modular Wall and A-Frame structures were performed through explicit analysis to determine safety factors for numerous loading scenarios. The Modular Wall had safety factors of 1.1 for the lateral, diagonal, and gusset loading conditions. The A-Frame had safety factors of 2 for all loading conditions simulated.

42 ENGINEERING↗
NASA NTRSDate not supplied

Structural Analysis, Modeling, and Testing of Multi-nut Joint for TriTruss Structure

The Multi-nut joint, developed at NASA Langley Research Center (LaRC), was designed to assemble TriTruss modules for a doubly curved 65.6-feet telescope support structure. Axial and bending tests for a multi-nut joint in the TriTruss structure were conducted to characterize the structural performance of the multi-nut joint and to obtain the installation torque value of the attachment fastener. This paper describes the summary of the axial and bending tests of the multi-nut joint, along with the test results. The equivalent axial stiffness (EA) and equivalent bending stiffness (EI) of the multi-nut joint were characterized based on these test results and are presented in this report. Additionally, finite element models (FEMs) of the axial and bending test specimens were developed, and the predicted axial and bending responses of the multi-nut joint were compared with the test results. Test-analysis comparison results show that the predicted axial load-displacement response of the test specimen was within 5 percent of the test results, while the predicted load-bending response of the test specimen exhibited a consistent trend with the test data.

TriTruss↗
NASA NTRSDate not supplied

Structural Analysis, Modeling, and Testing of Multi-nut Joint for TriTruss Structure

The Multi-nut joint, developed at NASA Langley Research Center (LaRC), was designed to assemble TriTruss modules for a doubly curved 65.6-feet telescope support structure. Axial and bending tests for a multi-nut joint in the TriTruss structure were conducted to characterize the structural performance of the multi-nut joint and to obtain the installation torque value of the attachment fastener. This paper describes the summary of the axial and bending tests of the multi-nut joint, along with the test results. The equivalent axial stiffness (EA) and equivalent bending stiffness (EI) of the multi-nut joint were characterized based on these test results and are presented in this report. Additionally, finite element models (FEMs) of the axial and bending test specimens were developed, and the predicted axial and bending responses of the multi-nut joint were compared with the test results. Test-analysis comparison results show that the predicted axial load-displacement response of the test specimen was within 5 percent of the test results, while the predicted load-bending response of the test specimen exhibited a consistent trend with the test data.

Structural analysis↗
DOE OSTI2022

Wire-based metallization and stringing for solar cells

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

Sewell, Richard Hamilton↗
DOE OSTI2023

Wire-based metallization and stringing for solar cells

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

14 SOLAR ENERGY↗
NASA NTRS1974

ATS-F notching criteria as determined by analysis and test

Description of the development of the notching criteria for the ATS-F structural model sinusoidal vibration test. A brief description of the ATS-F spacecraft is followed by a definition of the significant structural tests conducted as part of the structural model test program. The interrelationship of these tests with dynamic analyses in the development of the notching criteria for the qualification level vibration test is discussed in some detail. A brief summary of the vibration test results is also included.

Swales, T. G.↗
DOE OSTI2022

Hierarchically structured metal carbides as conductive fillers in thermo-responsive polymer nanocomposites for battery safety

Integrating thermo-responsive polymer switching materials (TRPS) into lithium-ion batteries (LIBs) has been recognized as one of the most effective strategies to prevent thermal runaway under various abuse scenarios. However, the current methods to obtain TRPS cannot satisfy different practical applications. Herein, we develop a versatile strategy for the preparation of various metal carbides (e.g., tungsten carbide, molybdenum carbide) with controllable hierarchical structure that is featured with surface protrusion structure, which is critical for high conductivity and rapid thermal response. Systematic studies of the phase and morphology evolutions by advanced characterizations illustrate that the reducing agent and reduction rate are critical for developing the specific morphology. In conclusion, by using the above-mentioned carbides as the conductive fillers of TRPS, the resulting TRPS with a specially controlled shape exhibits over 5 order of conductivity improvement compared with common carbides with particulate morphology, in addition to reversible shutdown performance and effective thermal abuse protections toward safe LIB operation.

25 ENERGY STORAGE↗
DOE OSTI2023

Conductive overbraid of continuous fiber thermoplastic composite tows

Here, to meet the increasing demand for lightweight materials with multifunctional capabilities, a new high-rate manufacturing method and material system, referred to as M-TOW ® (multifunctional-tow) is introduced. Overbraiding is used to incorporate highly conductive wire onto the continuous fiber reinforced tow (M-TOW ® ), offering a solution for integrating thermal and electrical conductivity into hybrid-molded composite structures. The conductivity performance of different wire configurations are compared before and after forming the M TOW ® , measuring electrical conductivities up to 5.5 x 10 5 S / cm and thermal conductivities up to 21 W / mK. Results conclude that the integration of conductive wires into thermoplastic preforms is a viable means of expanding the functionality of lightweight, high strength composite structures.

3-dimensional reinforcement↗
DOE OSTI2024

Wire-based metallization for solar cells

Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.

Sewell, Richard Hamilton↗
NASA NTRSDate not supplied

Understanding Dynamic Challenges of In-Space Modular Assembly and Reconfiguration of Flexible Structures from Early Efforts

A review of 1980s to early 2010s research supporting and documenting successful missions for on-orbit assembly of large space structures was conducted to bring together flexible space structure dynamics challenges and progress toward solutions. Research in this period focused on issues ranging from ground validation via unique test beds to in-space modal characterization and model adjustment. The phased assembly of the International Space Station (ISS), along with its evolving structural loads and dynamics, provides the central example, with ground and on-orbit tests of other systems providing contributing and contrasting examples of potential value for researchers facing today’s challenges.

Modal Space Testing↗
DOE OSTI2021

Fiber attach enabled wafer level fanout

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Ardalan, Shahab↗
DOE OSTI2023

Fiber attach enabled wafer level fanout

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Ardalan, Shahab↗
DOE OSTI2025

Synthesis and post-heating treatment of inorganic NaF·Na 3 SbS 4 solid electrolytes

Sulfide-type sodium (Na) solid electrolytes (SEs) with halide doping have attracted serious interest due to their high ionic conductivity and great potential in solid-state Na batteries. While other halogens such as Cl, Br, I have been studied to enhance Na-ion transport in sulfide-type SEs, the introduction of fluorine (F) is rarely investigated. Moreover, synthetic parameters such as heating treatment temperatures strongly influence the structure and conductive properties of halide-doped sulfide SEs. Herein, we prepared xNaF·(1-x)Na 3 SbS 4 nanocomposites with varying concentration of F using a low-temperature (150 °C) heating method, and studied the effects of post-heating treatment on structure and conductivity. In-situ neutron diffraction was employed to investigate the structural evolution of X-doped Na 3 SbS 4 (X = F, Cl) during the post-heating treatment and cooling process. In addition, the post-heating treatment at 300 °C leads to increased ionic conductivity of xNaF·(1-x)Na 3 SbS 4 nanocomposites with various F contents. After 300 °C post-heating treatment, 0.2NaF·0.8Na 3 SbS 4 exhibited the highest conductivity of 0.48 mS cm –1 at room temperature. Moreover, improved electrochemical stability was also observed in Na-Sn symmetric cells, specially, with prolonged stable cycling for 300 h and much lower polarization voltage (<0.35 V). Furthermore, this work highlights the importance of post-heating treatment on the structural evolution and its role in exploring new halide-incorporated sulfide-type SEs, promoting the development of inorganic solid-state ionic conductors.

25 ENERGY STORAGE↗
NASA NTRS1997

Thermal Conductivity Database of Various Structural Carbon-Carbon Composite Materials

Advanced thermal protection materials envisioned for use on future hypersonic vehicles will likely be subjected to temperatures in excess of 1811 K (2800 F) and, therefore, will require the rapid conduction of heat away from the stagnation regions of wing leading edges, the nose cap area, and from engine inlet and exhaust areas. Carbon-carbon composite materials are candidates for use in advanced thermal protection systems. For design purposes, high temperature thermophysical property data are required, but a search of the literature found little thermal conductivity data for carbon-carbon materials above 1255 K (1800 F). Because a need was recognized for in-plane and through-the-thickness thermal conductivity data for carbon-carbon composite materials over a wide temperature range, Langley Research Center (LaRC) embarked on an effort to compile a consistent set of thermal conductivity values from room temperature to 1922 K (3000 F) for carbon-carbon composite materials on hand at LaRC for which the precursor materials and thermal processing history were known. This report documents the thermal conductivity data generated for these materials. In-plane thermal conductivity values range from 10 to 233 W/m-K, whereas through-the-thickness values range from 2 to 21 W/m-K.

Ohlhorst, Craig W.↗
NASA NTRS1988

The structure of shocks with thermal conduction and radiative cooling

A general analysis is presented of the structure of a steady state, plane-parallel shock wave in which both thermal conduction and radiative cooling are important. The fluid is assumed to have a perfect-gas equation of state, with radiative cooling a function only of its temperature and density. Conduction in both diffusive and saturated regimes is treated. For the case of a strong shock, with conductivity and cooling function varying as power laws in temperature, approximate analytic solutions describing the shock wave are derived. For a plasma of solar composition, conduction is found to have a significant effect on the shock temperature and overall thickness of the postshock layer only for shock velocities greater than about 30,000 km/s, corresponding to shock temperatures greater than about 10 to the 10th K, but it affects the local structure of parts of the shock wave at much lower velocities. The effects of conduction are greatly enhanced if the heavy-element abundance is increased.

Lacey, Cedric G.↗