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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

NASA Tech Briefs, November 1995

The contents include: 1) Mission Accomplished; 2) Resource Report: Marshall Space Flight Center; 3) NASA 1995 Software of the Year Award; 4) Microbolometers Based on Epitaxial YBa2Cu3O(sub 7-x) Thin Films; 5) Garnet Random-Access Memory; 6) Fabrication of SNS Weak Links on SOS Substrates; 7) High-Voltage MOSFET Switching Circuit; 8) Asymmetric Switching for a PWM H-Bridge Power Circuit; 9) Better Ohmic Contacts for InP Semiconductor Devices; 10) Low-Bandgap Thermovoltaic Materials and Devices; 11) Digital Frequency-Differencing Circuit; 12) Imaging Magnetometer; 13) Computer-Assisted Monitoring of a Complex System; 14) Buffered Telemetry Demodulator; 15) Compact Multifunction Inspection Head; 16) Optical Detection of Fractures in Ceramic Diaphragms; 17) Eddy-Current Detection of Cracks in Reinforced Carbon/Carbon; 18) Apparent Thermal Conductivity of Multilayer Insulation; 19) Optimizing Misch-Metal Compositions in Metal Hydride Anodes; 20) Device for Sampling Surface Contamination; 21) Probabilistic Failure Assessment for Fatigue; 22) Probabilistic Fatigue and Flaw-Propagation Analysis; 23) Windows Program for Driving the TDU-850 Printer; 24) Subband/Transform MATLAB Functions for Processing Images; 25) Computing Equilibrium Chemical Compositions; 26) Program Processes Thermocouple Readings; 27) ICAN-Second-Generation Integrated Composite Analyzer; 28) Integrated Composite Analyzer with Damping Capabilities; 29) Computing Efficiency of Transfer of Microwave Power; 30) Program Calculates Power Demands of Electronic Designs; 31) Cost-Estimation Program; 32) Program Estimates Areas Required by Electronic Designs; 33) Program to Balance Mapped Turbopump Assemblies; 34) BiblioTech; 35) Controlling Mirror Tilt With a Bimorph Actuator; 36) Burst-Disk Device Simulates Effect of Pyrotechnic Device; 37) Bearing-Mounting Concept Accommodates Thermal Expansion; 38) Parallel-Plate Acoustic Absorbers for Hot Environments; 39) Adjustable-Length Strut Withstands Large Cyclic Loads; 40) Tool Indicates Contact Angles in Bearing Raceways; 41) Gravity Slides With Magnetic Braking; 42) High-Torque, Lightweight, Pneumatically Driven Wrench for Small Spaces; 43) Device for Testing Compatibility of an O-Ring; 44) Magnetic Heat Pump Containing Flow Diverters; 45) Variable-Tilt Helicopter Rotor Mast; 46) "Beach-Ball" Robotic Rovers; 47) Apparatus Would Measure Temperatures of Ball Bearings; 48) Flexible Borescope for Inspecting Ducts; 49) Texturing Copper To Reduce Secondary Emission of Electrons; 50) Automated Laser Cutting in Three Dimensions; 51) Algorithm Helps Monitor Engine Operation; 52) Flexible Revision of Data-Processing Communications; 53) Software for Managing the Use of Land; 54) Thermal Strap Increases Cryocooling Efficiency; 55) Reversible Nut With Engagement Indication; 56) Control Algorithms for Kinematically Redundant Manipulators; 57) Computed Hydrogen-Flow Splits in a Rocket Engine; 58) Pressure and Thermal Modeling of Rocket Launches; 59) Field of View of a Spacecraft Antenna: Analysis and Software; 60) Digital Controller for Laser-Beam-Steering Subsystem; 61) More About Beam-Steering Subsystem for Laser Communication; 62) Digital Controller for Laser-Beam-Steering Subsystem: Part 2; 63) Interface Circuit Board for Space-Shuttle Communications; 64) Automated Planning of Spacecraft Telecommunications; 65) Artifacts of Spectral Analysis of Instrument Readings; 66) Neural-Network Controller for Vibration Suppression; 67) Adaptive Finite-Element Computation in Fracture Mechanics; 68) Attitude Control for the Cassini Spacecraft; 69) Analytical Model for Fluid Dynamics in a Microgravity Environment; 70) Study of Rocket-Engine Joints Bonded by NVCU/NARloy-Z; 71) Improved Silicon Nitride for Advanced Heat Engines; 72) Parameters for Welding Aluminum/Lithium Alloys; 73) Lightweight Composite Intertank Structure; 74) Foil Patches Seal Small Vacuum Leaks; 75) Data Base on Cables and Connectors; 76) Effect of Clock Mode on Radiation Hardnessf an ADC; and 77) Fault-Tolerant Control for a Robotic Inspection System.

Source record↗
NASA NTRS1993

Wide-bandwidth high-resolution search for extraterrestrial intelligence

A third antenna was added to the system. It is a terrestrial low-gain feed, to act as a veto for local interference. The 3-chip design for a 4 megapoint complex FFT was reduced to finished working hardware. The 4-Megachannel circuit board contains 36 MByte of DRAM, 5 CPLDs, the three large FFT ASICs, and 74 ICs in all. The Austek FDP-based Spectrometer/Power Accumulator (SPA) has now been implemented as a 4-layer printed circuit. A PC interface board has been designed and together with its associated user interface and control software allows an IBM compatible computer to control the SPA board, and facilitates the transfer of spectra to the PC for display, processing, and storage. The Feature Recognizer Array cards receive the stream of modulus words from the 4M FFT cards, and forward a greatly thinned set of reports to the PC's in whose backplane they reside. In particular, a powerful ROM-based state-machine architecture has been adopted, and DRAM has been added to permit integration modes when tracking or reobserving source candidates. The general purpose (GP) array consists of twenty '486 PC class computers, each of which receives and processes the data from a feature extractor/correlator board set. The array performs a first analysis on the provided 'features' and then passes this information on to the workstation. The core workstation software is now written. That is, the communication channels between the user interface, the backend monitor program and the PC's have working software.

Horowitz, Paul↗
NASA NTRS1994

Simulation of materials processing: Fantasy or reality?

This experiment introduces students to the application of computer-aided design (CAD) and analysis of materials processing in the context of integrated circuit (IC) fabrication. The fabrication of modern IC's is a complex process which consists of several sequential steps. These steps involve the precise control of processing variables such as temperature, humidity, and ambient gas composition. In essence, the particular process employed during the fabrication becomes a 'recipe'. Due to economic and other considerations, CAD is becoming an indispensable part of the development of new recipes for IC fabrication. In particular, this experiment permits the students to explore the CAD of the thermal oxidation of silicon.

Jenkins, Thomas J.↗
NASA NTRS1993

Circuit and method for producing a flexible reference voltage

A flexible reference voltage circuit includes a circuit for producing a first digital signal representative of a range of reference voltage levels; a circuit for producing a second digital signal representative of a selected reference voltage level within the range of reference voltage levels; an adder for adding the first and second digital signals to produce a third digital signal; and a digital to analog converter for providing an output voltage in response to the third digital signal. The method of producing a flexible reference voltage performed by the circuit is also claimed. The invention can be used with a differential protection circuit to provide a series of trip level ranges, with a series of selectable trip levels in each range. This is accomplished in a high accuracy circuit which is relatively simple to construct, thereby minimizing size and complexity of the current sensor module, in differential protection applications, or the circuitry, if used in a power system controller. Standard digital logic components can be used to perform the necessary range/level decoding.

Thornton, Roger D.↗
NASA NTRS2008

Using Piezoelectric Devices to Transmit Power through Walls

A method denoted wireless acoustic-electric feed-through (WAEF) has been conceived for transmitting power and/or data signals through walls or other solid objects made of a variety of elastic materials that could be electrically conductive or nonconductive. WAEF would make it unnecessary to use wires, optical fibers, tubes, or other discrete wall-penetrating signal-transmitting components, thereby eliminating the potential for structural weakening or leakage at such penetrations. Avoidance of such penetrations could be essential in some applications in which maintenance of pressure, vacuum, or chemical or biological isolation is required. In a basic WAEF setup, a transmitting piezoelectric transducer on one side of a wall would be driven at resonance to excite ultrasonic vibrations in the wall. A receiving piezoelectric transducer on the opposite side of the wall would convert the vibrations back to an ultrasonic AC electric signal, which would then be detected and otherwise processed in a manner that would depend on the modulation (if any) applied to the signal and whether the signal was used to transmit power, data, or both. An electromechanical-network model has been derived as a computationally efficient means of analyzing and designing a WAEF system. This model is a variant of a prior model, known in the piezoelectric-transducer art as Mason's equivalent-circuit model, in which the electrical and mechanical dynamics, including electromechanical couplings, are expressed as electrical circuit elements that can include inductors, capacitors, and lumped-parameter complex impedances. The real parts of the complex impedances are used to account for dielectric, mechanical, and coupling losses in all components (including all piezoelectric-transducer, wall, and intermediate material layers). In an application to a three-layer piezoelectric structure, this model was shown to yield the same results as do solutions of the wave equations of piezoelectricity and acoustic propagation in their full complexity.

Sherrit, Stewart↗
NASA NTRS2009

Micro-Horn Arrays for Ultrasonic Impedance Matching

Thin-layered structures containing arrays of micromachined horns, denoted solid micro-horn arrays (SMIHAs), have been conceived as improved means of matching acoustic impedances between ultrasonic transducers and the media with which the transducers are required to exchange acoustic energy. Typically, ultrasonic transducers (e.g., those used in medical imaging) are piezoelectric or similar devices, which produce small displacements at large stresses. However, larger displacements at smaller stresses are required in the target media (e.g., human tissues) with which acoustic energy is to be exchanged. Heretofore, efficiencies in transmission of acoustic energy between ultrasonic transducers and target media have been severely limited because substantial mismatches of acoustic impedances have remained, even when coupling material layers have been interposed between the transducers and the target media. In contrast, SMIHAs can, in principle, be designed to effect more nearly complete acoustic impedance matching, leading to power transmission efficiencies of 90 percent or even greater. The SMIHA concept is based on extension, into the higher-frequency/ lower-wavelength ultrasonic range, of the use of horns to match acoustic impedances in the audible and lower-frequency ultrasonic ranges. In matching acoustic impedance in transmission from a higher-impedance acoustic source (e.g., a piezoelectric transducer) and a lowerimpedance target medium (e.g., air or human tissue), a horn acts as a mechanical amplifier. The shape and size of the horn can be optimized for matching acoustic impedance in a specified frequency range. A typical SMIHA would consist of a base plate, a face plate, and an array of horns that would constitute pillars that connect the two plates (see figure). In use, the base plate would be connected to an ultrasonic transducer and the face plate would be placed in contact with the target medium. As at lower frequencies, the sizes and shapes of the pillars could be tailored for impedance matching in a specified ultrasonic frequency range. In a design that would be simplest to implement by micromachining, the horns would have constant cross-sectional areas as shown in the upper part of the figure. In this case, the dimensions of the horns could be chosen on the basis of a Mason equivalent-circuit model (a simplified model, well-known in the piezoelectric-transducer art, in which the electrical and mechanical dynamics, including electromechanical couplings, are expressed as electrical circuit elements that can include inductors, capacitors, and lumped-parameter complex impedances.) In a more complex, more nearly optimum design, the cross-sectional area of each horn would be either stepped or made to vary as a continuous function of through-the thickness position, as shown in the lower part of the figure.

Rao, Shanti↗
NASA NTRS2011

Miniaturized Airborne Imaging Central Server System

In recent years, some remote-sensing applications require advanced airborne multi-sensor systems to provide high performance reflective and emissive spectral imaging measurement rapidly over large areas. The key or unique problem of characteristics is associated with a black box back-end system that operates a suite of cutting-edge imaging sensors to collect simultaneously the high throughput reflective and emissive spectral imaging data with precision georeference. This back-end system needs to be portable, easy-to-use, and reliable with advanced onboard processing. The innovation of the black box backend is a miniaturized airborne imaging central server system (MAICSS). MAICSS integrates a complex embedded system of systems with dedicated power and signal electronic circuits inside to serve a suite of configurable cutting-edge electro- optical (EO), long-wave infrared (LWIR), and medium-wave infrared (MWIR) cameras, a hyperspectral imaging scanner, and a GPS and inertial measurement unit (IMU) for atmospheric and surface remote sensing. Its compatible sensor packages include NASA s 1,024 1,024 pixel LWIR quantum well infrared photodetector (QWIP) imager; a 60.5 megapixel BuckEye EO camera; and a fast (e.g. 200+ scanlines/s) and wide swath-width (e.g., 1,920+ pixels) CCD/InGaAs imager-based visible/near infrared reflectance (VNIR) and shortwave infrared (SWIR) imaging spectrometer. MAICSS records continuous precision georeferenced and time-tagged multisensor throughputs to mass storage devices at a high aggregate rate, typically 60 MB/s for its LWIR/EO payload. MAICSS is a complete stand-alone imaging server instrument with an easy-to-use software package for either autonomous data collection or interactive airborne operation. Advanced multisensor data acquisition and onboard processing software features have been implemented for MAICSS. With the onboard processing for real time image development, correction, histogram-equalization, compression, georeference, and data organization, fast aerial imaging applications, including the real time LWIR image mosaic for Google Earth, have been realized for NASA fs LWIR QWIP instrument. MAICSS is a significant improvement and miniaturization of current multisensor technologies. Structurally, it has a complete modular and solid-state design. Without rotating hard drives and other moving parts, it is operational at high altitudes and survivable in high-vibration environments. It is assembled from a suite of miniaturized, precision-machined, standardized, and stackable interchangeable embedded instrument modules. These stackable modules can be bolted together with the interconnection wires inside for the maximal simplicity and portability. Multiple modules are electronically interconnected as stacked. Alternatively, these dedicated modules can be flexibly distributed to fit the space constraints of a flying vehicle. As a flexibly configurable system, MAICSS can be tailored to interface a variety of multisensor packages. For example, with a 1,024x1,024 pixel LWIR and a 8,984x6,732 pixel EO payload, the complete MAICSS volume is approximately 7x9x11 in. (=18x23x28 cm), with a weight of 25 lb (=11.4 kg).

Sun, Xiuhong↗
NASA NTRS2018

A High Frequency (HF) Inductive Power Transfer Circuit for High Temperature Applications Using SiC Schottky Diodes

Wireless sensors placed in high temperature environments, such as aircraft engines, are desirable to reduce the mass and complexity of routing wires. While communication with the sensors is straight forward, providing power wirelessly is still a challenge. This paper introduces an inductive wireless power transfer circuit incorporating SiC Schottky diodes and its operation from room temperature (25 C) to 500 C.

Diode↗
NASA NTRS1966

Fluid logic control circuit operates nutator actuator motor

Fluid logic control circuit operates a pneumatic nutator actuator motor. It has no moving parts and consists of connected fluid interaction devices. The operation of this circuit demonstrates the ability of fluid interaction devices to operate in a complex combination of series and parallel logic sequence.

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NASA NTRS1969

An unconventional magnetically-coupled multivibrator

Multivibrator circuit provides a low-frequency sine wave output without using a low-frequency power transformer or filter components. This circuit, utilizing two transistors and a magnetic core, represents a reduction in complexity, size, and weight over similar units.

Moore, E. T.↗
NASA NTRS1981

A thermochemical model of radiation damage and annealing applied to GaAs solar cells

Calculations of the equilibrium conditions for continuous radiation damage and thermal annealing are reported. The calculations are based on a thermochemical model developed to analyze the incorporation of point imperfections in GaAs, and modified by introducing the radiation to produce native lattice defects rather than high-temperature and arsenic atmospheric pressure. The concentration of a set of defects, including vacancies, divacancies, and impurity vacancy complexes, are calculated as a function of temperature. Minority carrier lifetimes, short circuit current, and efficiency are deduced for a range of equilibrium temperatures. The results indicate that GaAs solar cells could have a mission life which is not greatly limited by radiation damage.

Conway, E. J.↗
NASA NTRS1991

Deep FIFO Surge Buffer

First-in/first-out (FIFO) temporarily stores short surges of data generated by data-acquisition system at excessively high rate and releases data at lower rate suitable for processing by computer. Size and complexity reduced while capacity enhanced by use of newly developed, sophisticated integrated circuits and by "byte-folding" scheme doubling effective depth and data rate.

Temple, Gerald↗
NASA NTRS2020

Composite Piezoelectric Resonator 1D Modeling with Loss

Abstract – Maximizing the benefit of applying piezoelectric materials in composite structures, which are a mix of piezoelectric and elastic elements, requires analytical modeling. In this paper we describe two main classes of resonators and how to model using network equivalent including material losses. These include extensional devices where the layer areas are parallel to the direction of wave travel as found in a variety of thickness or length mode transducers (BC. Stress T1 = T2 at boundary) and transverse mode resonators (BC. Strain S1 = S2 at boundary) where the major layer area is perpendicular to the wave direction as is found in radial mode or length thickness mode composite resonators. In order to illustrate these models we will use Mason’s equivalent circuits with elastic, dielectric and piezoelectric loss. It is noted that in order to maintain consistency with the linear equations of piezoelectricity and the wave equation care is required when applying complex loss coefficients to the models. Although these techniques are applicable to other models we use Mason’s network equivalent circuit because it is intuitive for composite modeling due to the frequency independent turns ratio and the independence of the equations describing the elastic layers from the adjoining layer properties which aids in understanding the boundary conditions to impose on the layer boundaries. We will present network models for a variety of applications with loss and show how to calculate their impedance spectra, interface stress, strain velocity and displacement spectra.

Sherrit, Stewart↗
NASA NTRS2008

Making Complex Electrically Conductive Patterns on Cloth

A method for automated fabrication of flexible, electrically conductive patterns on cloth substrates has been demonstrated. Products developed using this method, or related prior methods, are instances of a technology known as 'e-textiles,' in which electrically conductive patterns ar formed in, and on, textiles. For many applications, including high-speed digital circuits, antennas, and radio frequency (RF) circuits, an e-textile method should be capable of providing high surface conductivity, tight tolerances for control of characteristic impedances, and geometrically complex conductive patterns. Unlike prior methods, the present method satisfies all three of these criteria. Typical patterns can include such circuit structures as RF transmission lines, antennas, filters, and other conductive patterns equivalent to those of conventional printed circuits. The present method overcomes the limitations of the prior methods for forming the equivalent of printed circuits on cloth. A typical fabrication process according to the present method involves selecting the appropriate conductive and non-conductive fabric layers to build the e-textile circuit. The present method uses commercially available woven conductive cloth with established surface conductivity specifications. Dielectric constant, loss tangent, and thickness are some of the parameters to be considered for the non-conductive fabric layers. The circuit design of the conductive woven fabric is secured onto a non-conductive fabric layer using sewing, embroidery, and/or adhesive means. The portion of the conductive fabric that is not part of the circuit is next cut from the desired circuit using an automated machine such as a printed-circuit-board milling machine or a laser cutting machine. Fiducials can be used to align the circuit and the cutting machine. Multilayer circuits can be built starting with the inner layer and using conductive thread to make electrical connections between layers.

Chu, Andrew↗
NASA NTRS1988

Addressable Inverter Matrix Tests Integrated-Circuit Wafer

Addressing elements indirectly through shift register reduces number of test probes. With aid of new technique, complex test structure on silicon wafer tested with relatively small number of test probes. Conserves silicon area by reduction of area devoted to pads. Allows thorough evaluation of test structure characteristics and of manufacturing process parameters. Test structure consists of shift register and matrix of inverter/transmission-gate cells connected to two-by-ten array of probe pads. Entire pattern contained in square area having only 1.6-millimeter sides. Shift register is conventional static CMOS device using inverters and transmission gates in master/slave D flip-flop configuration.

Buehler, Martin G.↗
NASA NTRS1986

Optical techniques to feed and control GaAs MMIC modules for phased array antenna applications

A complex signal distribution system is required to feed and control GaAs monolithic microwave integrated circuits (MMICs) for phased array antenna applications above 20 GHz. Each MMIC module will require one or more RF lines, one or more bias voltage lines, and digital lines to provide a minimum of 10 bits of combined phase and gain control information. In a closely spaced array, the routing of these multiple lines presents difficult topology problems as well as a high probability of signal interference. To overcome GaAs MMIC phased array signal distribution problems optical fibers interconnected to monolithically integrated optical components with GaAs MMIC array elements are proposed as a solution. System architecture considerations using optical fibers are described. The analog and digital optical links to respectively feed and control MMIC elements are analyzed. It is concluded that a fiber optic network will reduce weight and complexity, and increase reliability and performance, but higher power will be required.

Bhasin, K. B.↗