On-Wafer Testing of Circuits Through 220 GHz
We have jointly developed the capability to perform on-wafer s-parameter and noise figure measurements through 220 GHz.
MMIC↗
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Results for “WAFER”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Sonic Wafering of III-V substrates for High Efficiency Cells: A path to <$0.50/W
This project developed and demonstrated Sonic Lift-off, a novel technology that enables the reuse of expensive semiconductor substrates used to manufacture high-efficiency solar cells. By using sound waves to precisely separate thin layers of material, the process significantly reduces manufacturing costs while maintaining the performance of advanced III–V solar cells. These solar cells are among the most efficient in the world and are used in space, aerospace, and emerging terrestrial applications. The results of this work show that substrate reuse can be achieved without degrading device performance, offering a pathway to more affordable, high-performance solar technologies. This advancement supports U.S. clean energy goals by enabling broader deployment of renewable energy systems and strengthening domestic manufacturing capabilities in advanced photovoltaics.
14 SOLAR ENERGY↗
A wafer transfer technology for MEMS adaptive optics
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wafer transfer micro-electromechanical systems ada↗
A new wafer-level membrane transfer technique for MEMS deformable mirrors
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membrane transfer wafer-level transfer indium-bond↗
Multi-Wafer Bulk Micromachines Nano-g Accelerometer
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Multi-Wafer Micromachines↗
Suppression of crack formation in wafer-scale amorphous SiNx films by residual hydrogen-ligands manipulation
Not Available
36 MATERIALS SCIENCE↗
Crack Catcher AI – Enabling smart fracture mechanics approaches for damage control of thin silicon cells or wafers
Not Available
Budiman, Arief Suriadi (ORCID:0000000306844426)↗
Wafer-scale integration of freestanding photonic devices with color centers in silicon carbide
Not Available
Majety, Sridhar↗
Wafer Scale Engine Applications for Carbon Capture and Storage
This is a demonstration of WSE/WFA software toward the simulation of CO2 injection into a reservoir.
Kim, Hyoungkeun↗
Breaking the Molecular Dynamics Timescale Barrier Using a Wafer-Scale System
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Santos, Kylee↗
Electroless Ni Plating on Micropatterned Si (100) Wafers Without Surface Pretreatment
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25 ENERGY STORAGE↗
Shock experiments using thin wafer or foil impactors: an impulsive test capability for gas guns
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McCoy, Chad August [Sandia National Laboratories (↗
Bonding large area silicon wafers Quarterly report
Bonding of large area silicon crystals to heat sinks, and determination of stresses between bonded materials
Source record↗
Bonding large area silicon wafers Quarterly report
Bonding large area silicon single crystals to heat sinks
Source record↗
Bonding large area silicon wafers
Low temperature liquid-solid and solid-solid diffusion bonding of silicon substrates to heat sinks
Source record↗
Laser scribing of silicon wafers
Laser scribing eliminates microcracking at scribe line intersections, minimizes or eliminates preparation of scribe channels, and increases yield during the breaking process. Rapid overlapping of spots in the form of a line permits scribing speeds of 1.5 to 2.5 in./sec at 50 pulses/sec.
Calihan, C.↗