Tin in the ultraviolet solar spectrum
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Allen, M. S.↗
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Ground based studies for the space processing of lead-tin-telluride
This paper summarizes the results of a series of studies dealing with crystal growth from the melt and in particular, the growth of the narrow bandgap semiconductor PbSnTe by the Bridgman technique. Theoretical calculations have shown that for low Prandtl number fluids such as semiconductors, convection has no effect on the temperature field in the melt but has a significant effect on the compositional field. They also show that convective flow will exist in a Bridgman growth system on earth, even in the 'thermally stable' configuration. Measurements of the specific heat have been made up to temperatures of 722 C. The thermal diffusivity has been measured up to 1010 C which includes values for the melt. The interdiffusion coefficients for PbTe and SnTe in the melt have been determined. A technique has been developed and tested which provides a vacuum tight quartz ampoule with electrical feedthroughs for interface demarcation studies during the Bridgman growth. Analysis of crystals grown has indicated that the PbSnTe system is solutally unstable and the distribution of SnTe in the crystal, after an anomalous first to freeze region, follows that predicted by Pfann for convection controlled growth. Studies of the amount of supercooling in PbSnTe indicate that this may explain an anomalous composition distribution in the first to freeze region of an unseeded growth.
Crouch, R. K.↗
Effects of tin on microstructure and mechanical behavior of Inconel 718
Columbium, for which the United States is 100 percent import reliant, is of strategic importance to the U.S. aerospace industry. A major amount of the Cb is used in Inconel 718. Should Cb sources be disrupted, it may be desired to use a grade of Cb melting stock having greater Sn content then the preferred vacuum rade. Additions of Sn to Inconel 718 were varied from none added to 1 wt %. The Sn additions below 800 ppm had no detrimental effects on 650 C stress rupture behavior; however, 1-wt % Sn severely degraded both life and ductility. Additions of Sn in excess of 200 ppm were slightly detrimental to the 425 C tensile yield strength and ductility. The Sn additions had no effect on the microstructure of Inconel 718 even after stress rupture testing for over 6000 hr at 650 C.
Dreshfield, R. L.↗
The oxidation of carbon monoxide using a tin oxide catalyst
This paper outlines some of the steps involved in the development by the United Kingdom Atomic Energy Authority (UKAEA) of a catalytic device for the recombination of carbon monoxide and oxygen in a CO2 laser system. It contrasts the differences between CO oxidation for air purification and for laser environmental control, but indicates that there are similarities between the physical specifications. The principal features of catalytic devices are outlined and some experimental work described. This includes measurements concerning the structure and mechanical properties of the artifact, the preparation of the catalyst coating and its interaction with the gaseous environment. The paper concludes with some speculation about the method by which the reaction actually occurs.
Sampson, Christopher F.↗
Growth of lead tin telluride crystals in gels
Improved gels and several geometries were investigated for use in growing crystals. The use of lead sulfide test crystals proved workable, but it was impossible to obtain and maintain a sufficiently concentrated telluride ion solution to successfully grow lead telluride crystals. It appears that oxygen in the solution is capable of oxidizing the telluride ion up to tellurium metal. The method may still be successful, but only if precautions are taken to eliminate dissolved oxygen from the gels and aqueous solutions and to maintain a suitable concentration of telluride, Te(2)-(aq.).
Barber, Patrick G.↗
Influence of convection of spiral structures in lead-tin eutectic
Convection was generated during directional solidification by the accelerated crucible rotation technique (spin up/spin down). This stirring increased the rotation rate of the microstructure and reduced the length solidifying cooperatively, but had no influence on the lamellar spacing.
Popov, Dimitar↗
Dendritic growth of undercooled nickel-tin. I, II
A comparison is made between high speed cinematography and optical temperature measurements of the solidification of an undercooled Ni-25 wt pct Sn alloy. The first part of this study notes that solidification during the recalescence period at all undercoolings studied occurred in the form of a dendritelike front moving across the sample surface, and that the growth velocities observed agree with calculation results for the dendrite growth model of Lipton et al. (1986); it is concluded that the coarse structure observed comprises an array of much finer, solute-controlled dendrites. In the second part, attention is given to the solidification of levitated metal samples within a transparent glass medium for the cases of two undercooled Ni-Sn alloys, one of which is eutectic and another hypoeutectic. The data obtained suggest a solidification model involving dendrites of very fine structure growing into the melt at temperatures near the bulk undercooling temperature.
Wu, Y.↗
Structure and recalescence behavior of undercooled nickel-tin alloys
The effects of undercooling on the thermal behavior and structure of Ni-Sn alloys are investigated. Hypoeutectic (Ni-25 wt pct Sn) and eutectic (Ni-32.5 wt pct Sn) compositions of the Ni-Sn alloy were undercooled using a levitation melting with glass encasement technique, and the recalescence of these alloys was measured using a high speed temperature sensing device and a digital oscilloscope. It is observed that in both samples the total solidification and recalescence times decrease with increasing undercooling; the volume fraction of normal lamellar eutectic decreases with increasing undercooling; and in the hypoeutectic sample, the morphology of the primary phase changes from dendritic to spherical with increasing undercooling.
Wu, Yanzhong↗
Dendritic growth of undercooled nickel-tin. III
The paper is concerned with structures and microsegregations in undercooled droplets of Ni-25 wt pct Sn and eutectic Ni-32.5 wt pct Sn alloys. An analysis of experimental results suggests that all samples solidify dendritically and that the final structures are largely the result of ripening. Experimental data on minimum solute composition in the samples produced are bounded by two curves both of which assume equilibrium at all liquid-solid interfaces during recalescence and subsequent cooling. The eutectic alloy samples often show a dendritic structure over the surface in areas where shrinkage is present. This structure appears to be the remnant of an original growth structure in which only limited ripening occurred, due to the rapid removal of interdendritic liquid by shrinkage.
Wu, Y.↗
Structure, property and performance characteristics of HCD-ion plated TiN coatings
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Erdemir, A.↗
Phase selection during crystallization of undercooled liquid eutectic lead-tin alloys
During rapid solidification substantial amounts of undercooling are in general required for formation of metastable phases. Crystallization at varying levels of undercooling and melting of metastable phases were studied during slow cooling and heating of emulsified PB-Sn alloys. Besides the experimental demonstration of the reversibility of metastable phase equilibra, two different principal solidification paths have been identified and compared with the established metastable phase diagram and predictions from classical nucleation theory. The results suggest that the most probable solidification path is described by the 'step rule' resulting in the formation of metastable phases at low undercooling, whereas the stable eutectic phase mixture crystallizes without metastable phase formation at high undercooling.
Fecht, H. J.↗
Composite superconducting wires obtained by high-rate tinning in molten Bi-Pb-Sr-Ca-Cu-O system
Long lengths of metal superconductor composites were prepared by passing a copper wire through the bismuth based molten oxide system at a constant speed. The key to successful composite preparation is the high pulling speed involved, which permits minimization of the severe interaction between the unbuffered metal surface and the oxide melt. Depending on the temperature of the melt and the pulling speed, a coating with different thickness and microstructure appeared. The nonannealed thick coatings contained a Bi2(Sr,Ca)2Cu1O6 phase as a major component. After relatively short time annealing at 800 C, both resistivity and initial magnetization versus temperature measurements show superconducting transitions beginning in the 110 to 115 K region. The effects of annealing and composition on obtained results are discussed. This method of manufacture led to the fabrication of wire with a copper core in a dense covering with uniform thickness of about h approximately equal to 5 to 50 microns. Composite wires with h approximately equal to 10 microns (h/d approximately equal to 0.1) sustained bending on a 15 mm radius frame without cracking during flexing.
Grosav, A. D.↗
Tin soldering of aluminum and its alloys
A method is presented for soldering aluminum to other metals. The method adopted consists of a galvanic application to the surface of the light-metal parts to be soldered, of a layer of another metal, which, without reacting electrolytically on the aluminum, adheres strongly to the surface to which it is applied, and is, on the other hand, adapted to receive the soft solder. The metal found to meet the criteria best was iron.
Gallo, Gino↗
Electrically conducting polyimide film containing tin complexes
Disclosed is a thermally-stable SnO2-surfaced polyimide film wherein the electrical conductivity of the SnO2 surface is within the range of about 3.0 x 10(exp -3) to about 1 x 10(exp -2) ohms(exp -1). Also disclosed is a method of preparing this film from a solution containing a polyamic acid and SnCl4 (DMSO)2.
St.clair, Anne K.↗
In-Situ Monitoring of a Bismuth-Tin Alloy Solidification Using MEPHISTO
Experiments were carried out to study the morphological stability of Bi- 1 atomic % Sn alloys using the MEPHISTO directional solidification apparatus aboard Space Shuttle Columbia (STS-87, launched Nov. 19, 1997) and in ground-based studies. The Seebeck signal and temperature measurements indicate that convection was significant for ground-based studies. In the space-based experiments, interface breakdown was observed at growth velocities of 6.7, 27, and 40 microns/sec, but not at 1.8 and 3.3 microns/sec.
Abbaschian, Reza↗
Whiskers of Tin-Lead (Sn-Pb) on Reflowed Die Attach Solder Used in the Manufacture of Die Attach Solder Used in the Manufacture of a Laser Diode Array
intent of this presentation is to depict a mechanism for creating damaging electrical shunts on laser diodes: Failure Mechanism. Metal whisker formation from die attach solder.
Leidecker, Henning↗
Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries
It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was first to make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age. Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.
fatigue failure solder joints failure mechanisms s↗
Electrically conducting polyimide film containing tin complexes
Disclosed is a thermally-stable SnO.sub.2 -surfaced polyimide film wherein the electrical conductivity of the SnO.sub.2 surface is within the range of about 3.0.times.10.sup.-3 to about 1.times.10.sup.-2 ohms.sup.-1,. Also disclosed is a method of preparing this film from a solution containing a polyamic acid and SnCl.sub.4 (DMSO).sub.2.
St. Clair, Anne K.↗