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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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150 records · Page 9
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Enabling fast charging of lithium-ion batteries through secondary-/dual- pore network: Part II - numerical model

To increase the market share of electric vehicles, it is desirable to reduce the battery charge times, which are significantly limited by poor electrolyte transport. A high rate charging is achievable by using expensive and low energy density cells with thin electrodes. For higher energy density cells, new electrolytes with improved conductivity and diffusivity and/or electrodes with advanced architecture are required to boost the electrolyte transport, leading to a more uniform utilization of active materials. In our previous work, an analytical model was developed to investigate the effect of secondary pore network (SPN) on electrolyte transport and the configuration of SPN was optimized by enforcing equal characteristic diffusion times in through-plane and in-plane directions. Here, to evaluate the effect of SPN on the fast-charging capability of lithium-ion batteries, a 2D physics-based electrochemical model is developed with SPN in either one or both electrodes. Additionally, the effect of SPN on cell energy density and lithium plating is investigated for cells with different loadings and electrode porosities. Combining SPN with elevated charging temperatures, the model predicts that the volumetric discharge energy density of a 3 mA h/cm2 cell can reach 270 Wh/L after a 6C constant-current charging.

25 ENERGY STORAGE↗
DOE OSTI2020

Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies

Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Microstructure-refinement–driven enhanced tensile properties of high-pressure die-cast A380 alloy through friction stir processing

This work employs friction stir processing (FSP), a well-known severe plastic deformation technique, to selectively modify the microstructure of thin-walled, high-pressure die-cast (HPDC) aluminum alloy A380, a major HPDC alloy fabricated in the die casting sector. FSP effectively breaks down Al dendrites and acicular Si particles, creating a homogenized distribution of equiaxed Si particles in the aluminum matrix. After FSP, the refined Si particles (~1.5 µm) are smaller than the eutectic Si particles (3–8 µm) in HPDC condition. In addition, interparticle distance has decreased almost 50% compared to dendritic arm spacing, and FSP has reduced the aspect ratio of Si particles to ~2. Furthermore, FSP eliminates porosity, and breaks down needle-like second-phase Fe-Mn and Cu-rich particles, yielding a refined, homogeneous distribution. The FSP-induced microstructural refinement and porosity reduction improve bulk yield strength and ductility by 23% and 66%. Tensile properties are enhanced beyond those of the die skin of the HPDC plate, and the alloy possesses lower defect density and a highly refined microstructure. This study establishes the viability of FSP as a tool for microstructure modification and mechanical property improvement for HPDC Al alloys for the light-weighting goal of the automotive industries.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Validation Exercise of a Coarse Finite Element Model of Laser Welds

The objective of this project is to validate low-fidelity models of 304L to 304L stainless steel partial-penetration laser welds for thin sheets. Low-fidelity means that the weld is represented by coarsely meshed element blocks. Here, the hexahedral element size is approx imately half the weld penetration depth. The material behavior of the block is represented by a J2 plasticity model with a Voce hardening function. The source of the data used in this work is an extensive experimental study conducted by Sharlotte Kramer (1528) and published in 2015. Figure 1 shows a cross-section of the weld of interest. The nominal thickness of the sheets is 0.063 in. while the target penetration depth of the weld is in the range of 0.028 to 0.032 in., extending about half the sheet thickness. Uniaxial tension tests provided data for calibration of base material and weld models. Results of two validation geometries were also provided. The principal validation geometry is shown in Fig. 2. It consists of a plate specimen with in-plane dimensions 6 in × 2.875 in loaded in tension. A circular plug with a 1.5 in. diameter was cut from the center of the plate and then welded in place. The details of the welding schedule are given. An important assumption is that the welds in the calibration and validation specimens have similar geometric and material properties as those in the validation tests. The task was to first calibrate models for the base material and the welds and then simulate the validation tests until the point of weld first failure.

36 MATERIALS SCIENCE↗
DOE OSTI2020

FY20 Status Report on Creep Rupture Testing to Support the Development of Alloy 709 Code Case

This report provides an update on the status of the creep rupture testing on the first commercial heat of Alloy 709 in support of the Alloy 709 Code Case development. A creep test laboratory has been set up at ANL that comprises of 15 indirectly loaded test frames capable of testing ASTM-size specimens of the commercial heat of Alloy 709. The systems are equipped with high temperature furnaces capable of operation up to 1000°C in an air environment. During FY18, uniaxial ASTM-sized creep specimens were fabricated from 9 Alloy 709 plates that were processed by AOD, ESR, and ESR-homogenized routes and subsequently solution annealed at 1050, 1100, and 1150°C, and creep-rupture tests were performed at 330MPa and 600°C. The test results led to the down selection of the ESR-1100°C condition to support the code case. In FY19, 15 creep-rupture tests of the ESR-1100°C material, requiring the use of Type K thermocouples, were initiated to support the 100,000-hour Code Case. 8 tests were completed in FY19. In FY20, 6 tests were completed at the time of writing this report. In addition, 1 more test were loaded in FY20, using Type S thermocouples, and was completed. This report presents the data from the completed tests in FY20 and also the microstructural characterization of the fractured specimens. The creep data enabled the preliminary analysis of the creep behavior of this material. The characterization showed that in brittle fractures, the pores were narrow and thin, and elongated in the direction perpendicular to the loading direction, while in ductile fractures, the pores were much rounder. Dense precipitates were observed in all the samples, the size of which grew with test temperature. Some of the precipitates could be identified to be M23C6 based on their cuboid shape.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
DOE OSTI2022

Explosion dynamics of thin flat foils at high current density

This paper presents characteristic features of the explosion of thin flat foils for currents and pulse risetimes ranging from 8 kA at 350 ns to 1000 kA at ~100 ns. Foils made of aluminum, copper, nickel, and titanium with thicknesses of 1–100 µm are tested. Various diagnostics in the optical, UV, and x-ray spectral ranges are used to image the exploding foils from initial breakdown to complete destruction or pinching. It is shown that foil explosion is a complex process that depends on many factors, but features common to all foils are found that do not depend on the parameters of the generators or, accordingly, on the energy deposited in the foil: for example, the breakdown of flat foils under different conditions occurs at the edges of the foil. For the first time, the formation of a precursor over the central part of the foil is shown, which significantly changes the dynamics of the foil explosion.

36 MATERIALS SCIENCE↗