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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Advanced Composite Solar Sail System (ACS3): Mechanisms and Lessons Learned from a CubeSat Solar Sail Deployer

This is an overview of the National Aeronautics and Space Administration (NASA) Advanced Composite Solar Sail System (ACS3) technology demonstration project mechanisms, their development, the testing they underwent, as well as the lessons learned in those activities. This overview includes an overall description of the primary deployment mechanisms and ground support equipment (GSE) needed for packaging the solar sail system.

Mechanisms↗
NASA NTRS1999

Review of Stack CSP Technologies

CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.

3D CSP stack CSP Chip Scale Package MCM Mulitchip ↗
NASA NTRS2008

Ultra-Thin, Flexible Electronics

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.

electronics packaging↗
NASA NTRSDate not supplied

Upscaling of 500 °C Durable SiC JFET-R Integrated Circuits

At HiTEC2018, NASA Glenn Research Center reported the first demonstration of yearlong 500°C operation of ceramic-packaged “Generation 10” ~200-transistor integrated circuits (ICs) based on two-level interconnect silicon carbide (4H-SiC) junction field effect transistors and resistors (JFET-R). This HiTEC 2021submissionupdateson-going efforts at NASA Glenn spanning two subsequent prototype IC generations “11 and 12” to increase both complexity and durability of these ICs. Increased chip complexities of around 1000 transistors/chip for Gen. 11and near 3000 transistors/chip for Gen. 12 aremade possibleby reductions in minimum layout feature sizes (including resistorwidth shrinkage from 6 μm to 2μm) coupled with enlarged die size (from 3x3 mm to 5x5mm). Gen. 11 ICs electrically tested to date include an 8-bit delta-sigma analog to digital converter (ADC) as well as upscaled random access memory (RAM)and nearly 1 kbit read only memory (ROM). However, Gen. 11 prototype ICs exhibited significantly lower yield and durability than Gen. 10 ICs. Development of revised processing is being investigated towards mitigating these issues in subsequentGen. 12 fabrication runcurrentlyin progress.

Silicon Carbide↗
NASA NTRSDate not supplied

Upscaling of 500 °C Durable SiC JFET-R Integrated Circuits

At HiTEC 2018, NASA Glenn Research Center reported the first demonstration of yearlong 500 °C operation of ceramic-packaged “Generation 10” ~200-transistor integrated circuits (ICs) based on two-level interconnect silicon carbide (4H-SiC) junction field effect transistors and resistors (JFET-R). This HiTEC 2021 submission updates on-going efforts at NASA Glenn spanning two subsequent prototype IC generations “11 and 12” to increase both complexity and durability of these ICs. Increased chip complexities of around 1000 transistors/chip for Gen. 11 and near 3000 transistors/chip for Gen. 12 are made possible by reductions in minimum layout feature sizes (including resistor width shrinkage from 6 µm to 2 µm) coupled with enlarged die size (from 3 x 3 mm to 5 x 5 mm). Gen. 11 ICs electrically tested to date include an 8-bit delta-sigma analog to digital converter (ADC) as well as upscaled random access memory (RAM) and nearly 1 kbit read only memory (ROM). However, Gen. 11 prototype ICs exhibited significantly lower yield and durability than Gen. 10 ICs. Development of revised processing is being investigated towards mitigating these issues in subsequent Gen. 12 fabrication run currently in progress.

silicon carbide↗
NASA NTRS1966

Reliability through packaging design.

Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles

COOLING SYSTEM↗
NASA NTRS1982

Computer program for solving laminar, transitional, or turbulent compressible boundary-layer equations for two-dimensional and axisymmetric flow

A numerical algorithm and computer program are presented for solving the laminar, transitional, or turbulent two dimensional or axisymmetric compressible boundary-layer equations for perfect-gas flows. The governing equations are solved by an iterative three-point implicit finite-difference procedure. The software, program VGBLP, is a modification of the approach presented in NASA TR R-368 and NASA TM X-2458, respectively. The major modifications are: (1) replacement of the fourth-order Runge-Kutta integration technique with a finite-difference procedure for numerically solving the equations required to initiate the parabolic marching procedure; (2) introduction of the Blottner variable-grid scheme; (3) implementation of an iteration scheme allowing the coupled system of equations to be converged to a specified accuracy level; and (4) inclusion of an iteration scheme for variable-entropy calculations. These modifications to the approach presented in NASA TR R-368 and NASA TM X-2458 yield a software package with high computational efficiency and flexibility. Turbulence-closure options include either two-layer eddy-viscosity or mixing-length models. Eddy conductivity is modeled as a function of eddy viscosity through a static turbulent Prandtl number formulation. Several options are provided for specifying the static turbulent Prandtl number. The transitional boundary layer is treated through a streamwise intermittency function which modifies the turbulence-closure model. This model is based on the probability distribution of turbulent spots and ranges from zero to unity for laminar and turbulent flow, respectively. Several test cases are presented as guides for potential users of the software.

Harris, J. E.↗
NASA NTRS1999

Performance Boosting Additive

Mainstream Engineering Corporation was awarded Phase I and Phase II contracts from Goddard Space Flight Center's Small Business Innovation Research (SBIR) program in early 1990. With support from the SBIR program, Mainstream Engineering Corporation has developed a unique low cost additive, QwikBoost (TM), that increases the performance of air conditioners, heat pumps, refrigerators, and freezers. Because of the energy and environmental benefits of QwikBoost, Mainstream received the Tibbetts Award at a White House Ceremony on October 16, 1997. QwikBoost was introduced at the 1998 International Air Conditioning, Heating, and Refrigeration Exposition. QwikBoost is packaged in a handy 3-ounce can (pressurized with R-134a) and will be available for automotive air conditioning systems in summer 1998.

Source record↗
NASA NTRS2022

Bayesian Rules of Thumb: Robust Uncertainty Quantification in Early Project Cost Estimation

Systems engineers often make use of cost Rules ofThumb in order to estimate cost during early phases of projectformulation. These Rules of Thumb typically take the form ofa sequence of percentages over which a total cost is allocatedacross NASA WBS elements. Rules of Thumb can then be usedto extrapolate cost from one or more known WBS elements tothe remaining unknown WBS elements, assisting early projectformulation architecture studies (such as those in JPL’s Team Xand A Team).A number of issues can arise when generating and using costRules of Thumb. For example, many records of project costsconsist of incomplete data. Typical methods of dealing withincomplete cost allocation data include (a) ignoring missionswith incomplete data, or (b) taking averages of the non-zero percentagesacross missions, but both of these methods can result inbiased estimates if the existence of incomplete data correlateswith total mission cost or any particular WBS element. Anothercommon example is cost reported in one or more incorrect WBSelements. This is especially prevalent in smaller missions whereit is more common for engineers to perform tasks that fall underthe purview of multiple WBS elements.Furthermore, a Rule of Thumb estimate is typically reported asa point estimate; there is no reported uncertainty around thepercentages used to generate an allocation. Even in the rarecase in which confidence intervals around mean percentages areprovided, there may be positive or negative correlations betweenWBS elements which can skew estimates.Here we attempt to address these problems by formulatingprobabilistic Rules of Thumb in which a distribution of allocationschemes, rather than a single allocation scheme, is generated.We use a bootstrap imputation method to simultaneouslyaccount for uncertainty in the missing data while using allavailable information contained in the dataset. The imputeddatasets are then input into a multivariate Bayesian modelwhich accounts for correlations between WBS elements andproperly accounts for uncertainty in the final Rule of Thumbpercentages and predictions. We describe the mathematicalmodel and provides snippets of R code utilizing the brms(Bayesian Regression Models using Stan) package. To illustratethis model, we generate a Bayesian Level 2 WBS Cost Rule ofThumb for MIDEX (Medium-Class Explorers) missions withdata extracted from NASA’s CADRe. We then compare thismethod’s performance with the classical Rule of Thumb method.

Hooke, Melissa A↗
NASA NTRS1975

ATM CMG/EPEA

The Apollo Telescope mount double gimballed control moment gyro ATM CMG is described. Photographs of the CMG and its subassemblies are presented along with a functional block diagram of the CMG subsystem. Analog processing electronics for ATM vehicle pointing control and ATM experiment package pointing control are also described.

Abramowitz, R.↗