Thermally drawn rechargeable battery fiber enables pervasive power
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Khudiyev, Tural↗
SEARCH · Engineering Papers
Results for “Printed electronics”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Predicting Deposition Rate and Closing the Loop on Aerosol Jet Printing with In‐Line Light Scattering Measurements
Aerosol jet printing is a compelling noncontact, digital manufacturing technology for flexible, hybrid, and conformal electronics, but batch‐to‐batch variability and process drift inhibit systematic study and translation to production environments. Emerging measurement techniques for the aerosol volume fraction, a key parameter governing deposition rate, have shown promise for real‐time response, including a recent demonstration of human‐in‐the‐loop control. By integrating improved light scattering measurements with custom software, a robust environment for real‐time monitoring is established and fully automated closed‐loop control over the deposition rate during printing is enabled. The physical basis for scattering measurements as a feedback source is examined and the quantitative insight this provides for ink development and fundamental process studies is highlighted. Three candidate process variables for closed‐loop control, namely the atomizer voltage, carrier gas flow rate, and print speed, are then evaluated. The atomizer voltage demonstrates the best extended duration validity because it addresses atomization variability directly, but carrier gas flow rate and print speed provide faster and more deterministic responses. This methodology is then demonstrated for electrical properties using a silver nanoparticle ink, maintaining 98% of printed patterns within 10% of the mean resistance value over 3 h of printing.
36 MATERIALS SCIENCE↗
Deconvoluting sources of variability in aerosol jet printing using light scattering measurements
Aerosol jet printing (AJP) is a digital additive manufacturing technique for hybrid and conformal electronics, where its contactless deposition readily enables patterning over 3D surface topography. However, the complexity of aerosol transport physics makes deposition rate sensitive to process variability, hindering widespread industry adoption. Light scattering measurements have recently been demonstrated as a capable tool for measuring deposition rate in real time, enabling closed-loop control and in-situ qualification frameworks. These inline optical measurements present further opportunity as a diagnostic tool to understand the effects of secondary process parameters affecting vapor–liquid equilibrium and heat and mass transport during deposition. Downstream of the optical measurement cell, changing the sheath gas flow rate, increasing temperature via an inline heater, and adding solvent vapor via a sheath gas bubbler were observed to alter drying physics during sheath-collimation, and thereby impaction efficiency. Further upstream, the introduction of solvent vapor via a carrier gas bubbler and liquid build-up in the printhead were seen to affect the quantitative relationship between the light scattering data and the true deposition rate. Using this information, tightened controls of meaningful secondary parameters were implemented to improve the batch-to-batch consistency for printing a dielectric ink. In addition to advancing AJP process reliability for production, this work demonstrates the capability of inline optical measurements to provide insight into process physics and deconvolute competing mechanisms that underly variability.
additive manufacturing↗
Obtaining Real Production Data Through On-Component Printed SIR Patterns
Cleanliness validation of printed circuit assemblies has become increasingly important as electronic assemblies become smaller, denser, and more challenging to clean, prompting an increase in reliance in custom solutions. With increasingly fast paced development cycles, long lead times and costs of quality custom surrogate test boards become prohibitive in obtaining cleanliness data that is a true representative of the final product. In this study, aerosol jet printing, an additive manufacturing technology for electronics, was used to manufacture surface insulation resistance (SIR) test structures that were evaluated on their ability to detect cleanliness defects and remain stable when clean, as well as their survivability to standard electronics wash processes. Additionally, in an effort to further increase the agility of true product testing, SIR test structures were printed directly onto ball-grid-arrays (BGAs) and tested the survivability of conformally printed leads for data acquisition. SIR test structures displayed good wash survivability on standard FR4 and BGAs, including wraparounds for on-component prints, and high sensitivity to cleanliness defects. The presented results demonstrate the feasibility of printed SIR structures as a quick-turn, highly customizable solution for wash validation with potential for increased fidelity cleanliness testing.
SIR, Additive Manufacturing, Printed Electronics, ↗
The Influence of Microstructure on TCR for Inkjet-Printed Resistive Temperature Detectors Fabricated Using AgNO 3 /Ethylene-Glycol-Based Inks
This study investigated the influence of microstructure on the performance of Ag inkjet-printed, resistive temperature detectors (RTDs) fabricated using particle-free inks based on a silver nitrate (AgNO 3 ) precursor and ethylene glycol as the ink solvent. Specifically, the temperature coefficient of resistance (TCR) and sensitivity for sensors printed using inks that use monoethylene glycol (mono-EG), diethylene glycol (di-EG), and triethylene glycol (tri-EG) and subjected to a low-pressure argon (Ar) plasma after printing were investigated. Scanning electron microscopy (SEM) confirmed previous findings that microstructure is strongly influenced by the ink solvent, with mono-EG inks producing dense structures, while di- and tri-EG inks produce porous structures, with tri-EG inks yielding the most porous structures. RTD testing revealed that sensors printed using mono-EG ink exhibited the highest TCR (1.7 × 10 -3 /°C), followed by di-EG ink (8.2 × 10 -4 /°C) and tri-EG ink (7.2 × 10 -4 /°C). These findings indicate that porosity exhibits a strong negative influence on TCR. Sensitivity was not strongly influenced by microstructure but rather by the resistance of RTD. The highest sensitivity (0.84 Ω/°C) was observed for an RTD printed using mono-EG ink but not under plasma exposure conditions that yield the highest TCR.
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
Intern Abstract for Spring 2016
The Human Interface Branch - EV3 - is evaluating Organic lighting-emitting diodes (OLEDs) as an upgrade for current displays on future spacecraft. OLEDs have many advantages over current displays. Conventional displays require constant backlighting which draws a lot of power, but with OLEDs they generate light themselves. OLEDs are lighter, and weight is always a concern with space launches. OLEDs also grant greater viewing angles. OLEDs have been in the commercial market for almost ten years now. What is not known is how they will perform in a space-like environment; specifically deep space far away from the Earth's magnetosphere. In this environment, the OLEDs can be expected to experience vacuum and galactic radiation. The intern's responsibility has been to prepare the OLED for a battery of tests. Unfortunately, it will not be ready for testing at the end of the internship. That being said much progress has been made: a) Developed procedures to safely disassemble the tablet. b) Inventoried and identified critical electronic components. c) 3D printed a testing apparatus. d) Wrote software in Python that will test the OLED screen while being radiated. e) Built circuits to restart the tablet and the test pattern, and ensure it doesn't fall asleep during radiation testing. f) Built enclosure that will house all of the electronics Also, the intern has been working on a way to take messages from a simulated Caution and Warnings system, process said messages into packets, send audio packets to a multicast address that audio boxes are listening to, and output spoken audio. Currently, Cautions and Warnings use a tone to alert crew members of a situation, and then crew members have to read through their checklists to determine what the tone means. In urgent situations, EV3 wants to deliver concise and specific alerts to the crew to facilitate any mitigation efforts on their part. Significant progress was made on this project: a) Open channel with the simulated Caution and Warning system to acquire messages. b) Configure audio boxes. c) Grab pre-recorded audio files. d) Packetize the audio stream. A third project that was assigned to implement LED indicator modules for an Omnibus project. The Omnibus project is investigating better ways designing lighting for the interior of spacecraft-both spacecraft lighting and avionics box status lighting indication. The current scheme contains too much of the blue light spectrum that disrupts the sleep cycle. The LED indicator modules are to simulate the indicators running on a spacecraft. Lighting data will be gathered by human factors personal and use in a model underdevelopment to model spacecraft lighting. Significant progress was made on this project: Designed circuit layout a) Tested LEDs at LETF. b) Created GUI for the indicators. c) Created code for the Arduino to run that will illuminate the indicator modules.
Gibson, William↗
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits
Printed millimeter wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-Dimension Heterogeneous Integration (3DHI) to improve performance beyond traditional systems. Here, in this paper, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A PDMS stamp assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.
42 ENGINEERING↗
Development and implementation of an electronic library tour for the NASA Langley Technical Library
The role of librarians today is drastically influenced by the changing nature of information and library services. The museum-like libraries of yesterday are a thing of the past: today's libraries are bustling with life, activity, and the sounds of new technologies. Libraries are replacing their paper card catalogs with state-of-the-art online systems, which provide faster and more comprehensive search capabilities. Even the resources themselves are changing. New formats for information, such as CD-ROM's, are becoming popular for all types of publications, from bibliographic tools to encyclopedias to electronic journals, even replacing print materials completely in some cases. Today it is almost impossible to walk into a library and find the information you need without coming into contact with at least one computer system. Librarians are not only struggling to keep up with the technological advancements of the day, but they are becoming information intermediaries: they must teach library users how to use all of the new systems and electronic resources. Not surprisingly, bibliographic instruction itself has taken on a new look and feel in these electronically advanced libraries. Many libraries are experimenting with the development of expert systems and other computer aided instruction interfaces for teaching patrons how to use the library and its resources. One popular type of interface in library instruction programs is hypertext, which utilizes 'stacks' or linked pages of information. Hypertext stacks can incorporate color graphics along with text to provide a more interesting interface and entice users into trying out the system. Another advantage of hypertext is that it is generally easy to use, even for those unfamiliar with computers. As such, it lends itself well to application in libraries, which often serve a broad range of clientele. This paper will discuss the design, development, and implementation of a hypertext library tour in a special library setting. The library featured in the electronic library tour is the National Aeronautics and Space Administration's Technical Library at Langley Research Center in Hampton, Virginia.
Rinker, Nancy A.↗
Self-Driving Laboratory for Polymer Electronics
Owing to the chemical pluripotency and viscoelastic nature of electronic polymers, polymer electronics have shown unique advances in many emerging applications such as skin-like electronics, large-area printed energy devices, and neuromorphic computing devices, but their development period is years-long. Recent advancements in automation, robotics, and learning algorithms have led to a growing number of self-driving (autonomous) laboratories that have begun to revolutionize the development and accelerated discovery of materials. In this perspective, we first introduce the current state of autonomous laboratories. Then we analyze why it is challenging to conduct polymer electronics research by an autonomous laboratory and highlight the needs. Here, we further discuss our efforts in building an autonomous laboratory, namely Polybot, for the automated synthesis and characterization of electronic polymers and their processing and fabrication into electronic devices. Finally, we share our vision in using a self-driving laboratory for different types of polymer electronics research.
36 MATERIALS SCIENCE↗
Advancing flexible electronics and additive manufacturing
There is high interest in the synergism of thin-film and flexible electronics with additive manufacturing. This review primarily focuses on the prospective developments in convergence with flexible electronics manufacturing technologies. Specifically, this paper covers the latest 3D printing and hybrid manufacturing technologies, the utility of specific types of materials, their functionalization and characterization, post-processing and testing strategies toward fabricating robust and application-specific flexible electronics. Besides exploring the advances in this area of research—it also highlights the limitations and gaps that have been observed in the previous years that will challenge and offer opportunities for advancing research and development. Lastly, the future of 3D-printed flexible electronics is discussed in the aspects of customizability, scalability, and its game-changing and state-of-the-art potential for intelligent sensing, instrumentation, and wearables for various medical, engineering, and industrial applications.
36 MATERIALS SCIENCE↗
Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods
In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.
Process control↗
In-situ qualification and physics-based process design for aerosol jet printing via spatially correlated light scattering measurements
Aerosol jet printing is a contactless, digital, and additive technique broadly used for manufacturing flexible, hybrid, and conformal electronics. However, batch-to-batch variability has hindered widespread industry adoption and scaling to production volumes. Recently, light scattering measurements have emerged as a tool to measure aerosol volume fraction – a key parameter determining deposition rate – and have proven an effective feedback source for closed loop control on timescales ranging from minutes to hours. Here, the efficacy of light scattering measurements as a tool for in-situ qualification over shorter time durations is explored. To be the linear relationship between light scattering measurements and deposition rate was validated at 500 ms time intervals, allowing deposition rate to be mapped to positional coordinates and providing a new data stream to drive quality control assessments. Because light scattering measurements are indicative of a physical process parameter, they were substituted into equations for resistance and sheet resistance, resulting in predictions nominally within 10% of measured values for sets of printed devices. Finally, to highlight a more active utility, light scattering measurements were employed in a print repair framework, successfully repairing prints with randomly induced defects to within 5% of the measured resistance of a control set.
36 MATERIALS SCIENCE↗
Radio frequency mixing modules for superconducting qubit room temperature control systems
As the number of qubits in nascent quantum processing units increases, the connectorized RF (radio frequency) analog circuits used in first generation experiments become exceedingly complex. The physical size, cost, and electrical failure rate all become limiting factors in the extensibility of control systems. We have developed a series of compact RF mixing boards to address this challenge by integrating I/Q quadrature mixing, intermediate frequency/LO (local oscillator)/RF power level adjustments, and direct current bias fine tuning on a 40 × 80 mm 2 four-layer printed circuit board with electromagnetic interference shielding. The RF mixing module is designed to work with RF and LO frequencies between 2.5 and 8.5 GHz. The typical image rejection and adjacent channel isolation are measured to be ~27 dBc and ~50 dB. By scanning the drive phase in a loopback test, the module short-term amplitude and phase linearity are typically measured to be 5 ×10 -4 (V pp /V mean ) and 1 ×10 -3 radian (pk-pk). The operation of the RF mixing board was validated by integrating it into the room temperature control system of a superconducting quantum processor and executing randomized benchmarking characterization of single and two qubit gates. We measured a single-qubit process infidelity of 9.3(3) × 10 -4 and a two-qubit process infidelity of 2.7(1) × 10 -2 .
47 OTHER INSTRUMENTATION↗
CRADA Number NFE-18-07325 with TCPoly, Inc. (CRADA Final Report)
TCPoly is commercializing high performance composite materials for the 3D printing industry and the company focus is manufacturing high thermal conductivity plastics for 3D printing of heat exchangers, electronic cooling devices, and mold tooling. Through the Innovation Crossroads Program, I was able to collaborate with ORNL researchers to expand the company’s technology offering and revamp the company’s business model and focus.
36 MATERIALS SCIENCE↗
Complex interconnecting of flat packs without multilayer boards.
Stick module interconnection of flat packs into single-axis motherboard
PRINTED CIRCUIT↗
Coating Circuit Boards With Silicone
Techniques appropriate to boards containing CMOS circuits detailed. Document presents procedure for applying thin conformal coating to such electronic assemblies as printed-circuit boards and wire-wrapped boards. Coating is from 1 to 7 mils (25 to 178 micrometers) thick and composed of room-temperature-vulcanizing (RTV) silicone. Specifies materials, equipment, spraying method, and quality requirements. Takes into account special needs of circuits made with complementary metal-oxide/semiconductor (CMOS) devices on circuit boards. Special attention given to preventing damage by electrostatic discharge, to which CMOS circuits especially sensitive.
Gaudiano, S.↗
Inexpensive Implementation of Many Strain Gauges
It has been proposed to develop arrays of strain gauges as arrays of ordinary metal film resistors and associated electronic readout circuitry on printed circuit boards or other suitable substrates. This proposal is a by-product of a development of instrumentation utilizing metal film resistors on printed-circuit boards to measure temperatures at multiple locations. In the course of that development, it was observed that in addition to being sensitive to temperature, the metal film resistors were also sensitive to strains in the printed-circuit boards to which they were attached. Because of the low cost of ordinary metal film resistors (typically <$0.01 apiece at 2007 prices), the proposal could enable inexpensive implementation of arrays of many (e.g., 100 or more) strain gauges, possibly concentrated in small areas. For example, such an array could be designed for use as a computer keyboard with no moving parts, as a device for sensing the shape of an object resting on a surface, or as a device for measuring strains at many points on a mirror, a fuel tank, an airplane wing, or other large object. Ordinarily, the effect of strain on resistance would be regarded as a nuisance in a temperature-measuring application, and the effect of temperature on resistance would be regarded as a nuisance in a strain-measuring application. The strain-induced changes in resistance of the metal film resistors in question are less than those of films in traditional strain gauges. The main novel aspect of present proposal lies in the use of circuitry affording sufficient sensitivity to measure strain plus means for compensating for the effect of temperature. For an array of metal film resistors used as proposed, the readout circuits would include a high-accuracy analog-to-digital converter fed by a low noise current source, amplifier chain, and an analog multiplexer chain. Corrections would be provided by use of high-accuracy calibration resistors and a temperature sensor. By use of such readout circuitry, it would be possible to read the resistances of as many as 100 fixed resistors in a time interval of 1 second at a resolution much greater than 16 bits. The readout data would be processed, along with temperature calibration data, to deduce the strain on the printed-circuit board or other substrate in the areas around the resistors. It should also be possible to also deduce the temperature from the readings.
Berkun, Andrew C.↗
Modular Pulsed Plasma Electric Propulsion System for Cubesats
Current capabilities of CubeSats must be improved in order to perform more ambitious missions. Electric propulsion systems will play a key role due to their large specific impulse. Compared to other propulsion alternatives, their simplicity allows an easier miniaturization and manufacturing of autonomous modules into the nano and pico-satellite platform. Pulsed Plasma Thrusters (PPTs) appear as one of the most promising technologies for the near term. The utilization of solid and non-volatile propellants, their low power requirements and their proven reliability in the large scale make them great candidates for rapid implementation. The main challenges are the integration and miniaturization of all the electronic circuitry into a printed circuit board (PCB) that can satisfy the strict requirements that CubeSats present. NASA Ames and the George Washington University have demonstrated functionality and control of three discrete Micro-Cathode Arc Thrusters (CAT) using a bench top configuration that was compatible with the ARC PhoneSat Bus. This demonstration was successfully conducted in a vaccum chamber at the ARC Environmental Test Laboratory. A new effort will integrate a low power Plasma Processing Unit and two plasma thrusters onto a single printed circuit board that will utilize less than 13 U of Bus volume. The target design will be optimized for the accommodation into the PhoneSatEDISON Demonstration of SmallSatellite Networks (EDSN) bus as it uses the same software interface application, which was demonstrated in the previous task. This paper describes the design, integration and architecture of the proposed propulsion subsystem for a planned Technology Demonstration Mission. In addition, a general review of the Pulsed Plasma technology available for CubeSats is presented in order to assess the necessary challenges to overcome further development.
PCB↗