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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9

High-Power Electron Accelerators for Space (and other) Applications

This is a presentation on high-power electron accelerators for space and other applications. The main points covered are: electron beams for space applications, new designs of RF accelerators, high-power high-electron mobility transistors (HEMT) testing, and Li-ion battery design. In summary, the authors have considered a concept of 1-MeV electron accelerator that can operate up to several seconds. This concept can be extended to higher energy to produce higher beam power. Going to higher beam energy requires adding more cavities and solid-state HEMT RF power devices. The commercial HEMT have been tested for frequency response and RF output power (up to 420 W). Finally, the authors are testing these HEMT into a resonant load and planning for an electron beam test in FY17.

43 PARTICLE ACCELERATORS↗

Power electronics for a 1-kilowatt arc jet thruster

After more than two decades, new space mission requirements have revived interest in arcjet systems. The preliminary development and demonstration of new, high efficiency, power electronic concepts for start up and steady state control of dc arcjets is reported. The design comprises a pulse width modulated power converter which is closed loop configured to give fast current control. An inductor, in series with the arcjet, serves the dual role of providing instantaneous current control, as well as a high voltage arc ignition pulse. Benchmark efficiency, transient response, regulation, and ripple data are presented. Tests with arcjets demonstrate that the power electronics breadboard can start thrusters consistently with no apparent damage and transfer reliably to the nondestructive high voltage arc mode in less than a second.

Gruber, R. P.↗

Increasing the mobility and power-electronics figure of merit of AlGaN with atomically thin AlN/GaN digital-alloy superlattices

Alloy scattering in random AlGaN alloys drastically reduces the electron mobility and, therefore, the power-electronics figure of merit. As a result, Al compositions greater than 75% are required to obtain even a twofold increase in the Baliga figure of merit compared to GaN. However, beyond approximately 80% Al composition, donors in AlGaN undergo the DX transition, which makes impurity doping increasingly more difficult. Moreover, the contact resistance increases exponentially with the increase in Al content, and integration with dielectrics becomes difficult due to the upward shift of the conduction band. Atomically thin superlattices of AlN and GaN, also known as digital alloys, are known to grow experimentally under appropriate growth conditions. These chemically ordered nanostructures could offer significantly enhanced figure of merit compared to their random alloy counterparts due to the absence of alloy scattering, as well as better integration with contact metals and dielectrics. In this work, we investigate the electronic structure and phonon-limited electron mobility of atomically thin AlN/GaN digital-alloy superlattices using first-principles calculations based on density-functional and many-body perturbation theory. The bandgap of the atomically thin superlattices reaches 4.8 eV, and the in-plane (out-of-plane) mobility is 369 (452) cm 2 V -1 s -1 . Using the modified Baliga figure of merit that accounts for the dopant ionization energy, here we demonstrate that atomically thin AlN/GaN superlattices with a monolayer sublattice periodicity have the highest modified Baliga figure of merit among several technologically relevant ultra-wide bandgap materials, including random AlGaN, β-Ga 2 O 3 , cBN, and diamond.

36 MATERIALS SCIENCE↗

Power Electronics for Electrolyzer Applications to Enable Grid Services

The Power Electronics for Electrolyzer Applications to Enable Grid Services project aims to develop smart converter for dedicated electrolyzer applications to enable grid services via standardization of control interfaces between hydrogen electrolyzer system low-level controls and power converter controls. The project provides additional revenue source for electrolyzer through participation in grid services and reduces the cost of deployment and controls integration through standardization and risk due to supply-chain issues. It also enables the adoption of green hydrogen via standardizing the integration of energy storage, renewables, and distributed energy resources. Furthermore, the work provides a controlled validation environment to evaluate scalable integration solution for hydrogen production technologies, improves overall reliability and maintainability of the electrolyzer system for grid applications, and directly contributes to DOE HFTO's "Hydrogen Shot" goal.

energy transitions↗

SiC MOSFET Based Modular Universal Power Electronics Regulator

A modular and scalable SiC MOSFET based universal power electronics regulator (UPER) allows coordinated integration of energy resources and loads, elimination of extra power conversion stages, and allowance of more sources or loads added with a simple plug and play feature. A comprehensive investigation has been conducted in term of the typical distributed generations and loads employed in buildings, in order to outline a detailed specification for UPER. Thus, a common DC bus voltage of 500 V and power rating of 3 kW are dedicatedly selected. The UPER hardware design and implementation are completely illustrated, including the static and dynamic characterization of the employed SiC MOSFET. The dedicated universal power cell and Plug-and-Play gate driver performs reliable continuous operation even exposed to an extreme fast switching speed (> 100 V/ns). The continuous operation of buck mode verified the UPER hardware development at 50 kHz with an overall efficiency of 98.19%. A new voltage polarity reversal phenomenon was also discovered in the verification of the isolated DAB stage with planar transformers.

Zheng, Sheng↗

Power Electronics Module with Integrated Ceramic Heat Exchanger

NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.

25 ENERGY STORAGE↗

System, method, and apparatus for integrating high power density power electronics on a mobile application

A motor drive converter includes a cold plate having a first side and a second side, the first side being opposite to the second side. The motor drive converter may further include at least one motor phase power electronics disposed on the first side of the cold plate, and a capacitor array disposed on the second side of the cold plate. The cold plate may include slots therethrough for a conductor to pass through the cold plate. The conductor may be configured to electrically coupling the capacitor array and the at least one motor phase power electronics.

Stoltz, Thomas Joseph↗

Power Electronics Based Self-Monitoring and Diagnosing for Photovoltaic Systems

Faults in photovoltaic (PV) systems can seriously affect the efficiency, energy yield, cost, safety, and reliability of PV plants. Condition monitoring of PV plants is, therefore, a very important approach to estimating the health condition of PV modules and power electronics in the system. However, additional hardware for PV system monitoring adds cost to the system's operation; delayed maintenance service also causes additional energy production loss. The Center for Power Electronics Systems (CPES) at the Virginia Polytechnic Institute and State University and Siemens Cooperate Research developed the online impedance measurement for a PV panel self-monitoring and diagnosing technology using the DC-DC converter connected to the panel. Small-signal impedances of a monocrystalline silicon PV panel were modeled and simulated to reflect fault conditions such as the short-circuit, hot-spot, and junction box faults. Modeling and simulation results were validated firstly using a test setup consisting of a solar simulator, a network analyzer, small-signal injectors, and a monocrystalline PV panel rated at 300 W.

14 SOLAR ENERGY↗

Use of Grid-Forming Medium-Voltage Power Electronics Hub in a Microgrid Setting: Preprint

This paper presents the application of a new design of a multiport, modular, medium-voltage power electronics hub (M3PE-HUB) in a microgrid setting. The M3PE-HUB system was modeled in a digital real-time simulator (DRTS) and integrated into the Banshee microgrid test system. This paper presents the preliminary DRTS simulation-based results of the M3PE- HUB system connected in a test microgrid system. Verification and validation of the M3PE-HUB architecture and controls in the test microgrid setting are the primary contributions of this work. The results of the operation during the islanding and resynchronization process indicate the feasibility of the proposed architecture in a microgrid setting. This paper also presents results for a system reconfiguration use case where the M3PE- HUB was used to reconfigure the system under a fault condition.

grid forming↗

Body of Knowledge for Silicon Carbide Power Electronics

Wide band gap semiconductors, such as silicon carbide (SiC), have emerged as very promising materials for future electronic components due to the tremendous advantages they offer in terms of power capability, extreme temperature tolerance, and high frequency operation. This report documents some issues pertaining to SiC technology and its application in the area of power electronics, in particular those geared for space missions. It also serves as a body of knowledge (BOK) in reference to the development and status of this technology obtained via literature and industry survey as well as providing a listing of the major manufacturers and their capabilities. Finally, issues relevant to the reliability of SiC-based electronic parts are addressed and limitations affecting the full utilization of this technology are identified.

Silicon Carbide Power Electronics↗

Cybersecurity Challenges in Low-Inertia Power-Electronics-Dominated Grids

Here, the low inertia characteristics of the power electronics dominated grid (PEDG) introduces challenges while restoring voltage and frequency to their nominal values. These stability challenges create new cybersecurity vulnerabilities that are not thoroughly discussed in the literature. Cyber events such as false data injection (FDI), denial of service (DoS), man-in-the-middle attacks, stealthy attacks, and advanced persistent threats target PEDG to disrupt grid stability or gain financial benefits. The low inertia of PEDG (< 2s) compared to traditional grids (~10s) exacerbates these vulnerabilities. In response to stealthy attacks on state variables that supervisory layers cannot detect until significant harm occurs, the low inertia characteristics of PEDG offer substantial stealthy attack surfaces. To counteract such threats, PEDG must be equipped with ultra-fast real-time anomaly detection system and trajectory prediction mechanism to achieve effective cyberattack resiliency.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Extended Pulse-Powered Humidity-Freeze Cycling for Testing Module-Level Power Electronics

An EMI suppression capacitor (polypropylene film type) failed by 'popcorning' due to vapor outgassing in pulse powered humidity-freeze cycles. No shorts or shunts could be detected despite mildly corroded metallization visible in the failed capacitor. Humidity-freeze cycling is optimized to break into moisture barriers. However, further studies will be required on additional module level power electronic (MLPE) devices to optimize the stress testing for condensation to precipitate any weakness to short circuiting and other humidity/bias failure modes.

14 SOLAR ENERGY↗

Thermal and Mechanical Design of a High-Voltage Power Electronics Package: Preprint

Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that placing the devices closer to the direct-bond-copper substrate as opposed to a centered approach in the proposed double-sided-cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

27 ARPA - Advanced Research Projects Agency-Energy↗

Thermal and Mechanical Design of a High-Voltage Power Electronics Package

This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

electronic packaging↗

Thermal Management and Reliability of Automotive Power Electronics and Electric Machines

Low-cost, high-performance thermal management technologies are helping meet aggressive power density, specific power, cost, and reliability targets for power electronics and electric machines. The National Renewable Energy Laboratory is working closely with numerous industry and research partners to help influence development of components that meet aggressive performance and cost targets through development and characterization of cooling technologies, and thermal characterization and improvements of passive stack materials and interfaces. Thermomechanical reliability and lifetime estimation models are important enablers for industry in cost-and time-effective design.

30 DIRECT ENERGY CONVERSION↗