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At least 163 records · Page 9

Fluctuations and Pinning for Individually Manipulated Skyrmions

We numerically examine the dynamics of individually dragged skyrmions interacting simultaneously with an array of other skyrmions and quenched disorder. For drives just above depinning, we observe a broadband noise signal with a 1/ f characteristic, while at higher drives, narrowband or white noise appears. Even in the absence of quenched disorder, the threshold force that must be applied to translate the driven skyrmion is finite due to elastic interactions with other skyrmions. The depinning threshold increases as the strength of the quenched disorder is raised. Above the depinning force, the skyrmion moves faster in the presence of quenched disorder than in a disorder-free system since the pinning sites prevent other skyrmions from being dragged along with the driven skyrmion. For strong pinning, we find a stick-slip motion of the driven skyrmion which produces a telegraph noise signature. The depinning threshold increases monotonically with skyrmion density in the absence of quenched disorder, but when pinning is present, the depinning threshold changes nonmonotonically with skyrmion density, and there are reentrant pinned phases due to a competition between pinning induced by the quenched disorder and that produced by the elastic interactions of the skyrmion lattice.

36 MATERIALS SCIENCE↗

Results of a preliminary experimental investigation of a vapor transport fuel pin

In-Pile experimental tests were conducted on two fuel pins mounted side-by-side in a holder assembly. The fuel pins consisted of stacked fully enriched UO2 pellets enclosed in a type 316 stainless steel clad 1/2 inch outside diameter and 3 inches in length. Each fuel pin contained four pellets for a total of 22 grams of fuel weight. The experiment was operated to maintain the maximum clad temperature at 395 K corresponding to a fuel temperature at the central void surface of 2350 K. Total primary coolant water flow past the pin holder was calculated to be 110 gallons per minute. Forty-four gallons per minute at a velocity of 36.5 feet per second flowed around each fuel pin. Calculations indicated the maximum heat flux was at the point of the highest temperature and was equal to 0.24 kW/sq cm or 7.62 Btu/hr sq ft. A series of high resolution neutron radiographs of the nuclear fueled vapor transport capsule was taken. The thermal neutrons emitted from the core of the 60 megawatt Plum Brook reactor facility were used.

Lanzo, C. D.↗

Irradiation of TZM: Uranium dioxide fuel pin at 1700 K

A fuel pin clad with TZM and containing solid pellets of uranium dioxide was fission heated in a static helium-cooled capsule at a maximum surface temperature of 1700 K for approximately 1000 hr and to a total burnup of 2.0 percent of the uranium-235. The results of the postirradiation examination indicated: (1) A transverse, intergranular failure of the fuel pin occurred when the fuel pin reached 2.0-percent burnup. This corresponds to 1330 kW-hr/cu cm, where the volume is the sum of the fuel, clad, and void volumes in the fuel region. (2) The maximum swelling of the fuel pin was less than 1.5 percent on the fuel-pin diameter. (3) There was no visible interaction between the TZM clad and the UO2. (4) Irradiation at 1700 K produced a course-grained structure, with an average grain diameter of 0.02 centimeter and with some of the grains extending one-half of the thickness of the clad. (5) Below approximately 1500 K, the irradiation of the clad produced a moderately fine-grained structure, with an average grain diameter of 0.004 centimeter.

Mcdonald, G. E.↗

Examination of T-111 clad uranium nitride fuel pins irradiated up to 13,000 hours at a clad temperature of 990 C

The examination of 27 fuel pins irradiated for up to 13,000 hours at 990 C is described. The fuel pin clad was a tantalum alloy with uranium nitride as the nuclear fuel. Two nominal fuel pin diameters were tested with a maximum burnup of 2.34 atom percent. Twenty-two fuel pins were tested for fission gas leaks; thirteen pins leaked. Clad ductility tests indicated clad embrittlement. The embrittlement is attributed to hydrogen from an n,p reaction in the fuel. Fuel swelling was burnup dependent, and the amount of fission gas release was low, generally less than 0.5 percent. No incompatibilities between fuel, liner, and clad were in evidence.

Slaby, J. G.↗

Stepped-Pin Clevis Resists Jamming

Pin modification allows pyrotechnic release devices to operate more smoothly. New clevis pin has stepped diameters to prevent bending as it exits yoke. In contrast, conventional unstepped clevis pin bends and jams as it is withdrawn. Stepped pin design suitable for explosive and possible hammer driven pin sullers.

Killgrove, T. O.↗

Stresses around holes in pin-loaded orthotropic plates

The effects of pin elasticity, pin/hole friction, and pin/hole clearance on the stresses around a hole in a pin-loaded orthotropic plate were studied. The problem was modeled as a planar problem, the pin and plate being two elastic bodies interacting through contact. Complex variable elasticity, a collocation scheme to enforce the pin/hole boundary conditions, and an iteration procedure to find the contact, slip, and no-slip regions were used to obtain numerical results. The results indicate that pin elasticity is not as important a variable as friction and clearance are. A rigid pin assumption, as opposed to the popular cosinusoidal radial traction, can be used without much error but clearance and friction should not be ignored.

Hyer, M. W.↗

Pin-loaded holes in large orthotropic plates

Pin-loaded holes commonly occur in engineering structures. However, accurate analysis of such holes presents formidable difficulties because of the load-dependent contact of the pin with the plate. Significant progress has recently been achieved in the analysis of holes in isotropic plates. This paper develops a simple and accurate method for the partial contact analysis of pin-loaded holes in composites. The method is based on an inverse formulation that seeks to determine loads in a given contact-separation configuration. A unified approach for all types of fit was used. Continuum solutions were obtained for infinitely large plates of various typical orthotropic properties with holes loaded by smooth rigid pins. These solutions were then compared with those for isotropic plates. The effects of orthotropy and the type of fit were studied through load-contact relationships, distribution of stresses and displacements, and their variation with load. The results are of direct relevance to the analysis and design of pin joints in composite plates.

Mangalgiri, P. D.↗

A technique for evaluating the application of the pin-level stuck-at fault model to VLSI circuits

Accurate fault models are required to conduct the experiments defined in validation methodologies for highly reliable fault-tolerant computers (e.g., computers with a probability of failure of 10 to the -9 for a 10-hour mission). Described is a technique by which a researcher can evaluate the capability of the pin-level stuck-at fault model to simulate true error behavior symptoms in very large scale integrated (VLSI) digital circuits. The technique is based on a statistical comparison of the error behavior resulting from faults applied at the pin-level of and internal to a VLSI circuit. As an example of an application of the technique, the error behavior of a microprocessor simulation subjected to internal stuck-at faults is compared with the error behavior which results from pin-level stuck-at faults. The error behavior is characterized by the time between errors and the duration of errors. Based on this example data, the pin-level stuck-at fault model is found to deliver less than ideal performance. However, with respect to the class of faults which cause a system crash, the pin-level, stuck-at fault model is found to provide a good modeling capability.

Palumbo, Daniel L.↗

Flux pinning characteristics and irreversibility line in high temperature superconductors

The flux pinning properties in high temperature superconductors are strongly influenced by thermally activated flux motion. The scaling relation of the pinning force density and the irreversibility line in various high temperature superconductors are numerically analyzed in terms of the flux creep model. The effect of two factors, i.e., the flux pinning strength and the dimensionality of the material, on these properties are investigated. It is speculated that the irreversibility line in Bi-2212 superconductors is one order of magnitude smaller than that in Y-123, even if the flux pinning strength in Bi-2212 is improved up to the level of Y-123. It is concluded that these two factors are equally important in determination of the flux pinning characteristics at high temperatures.

Matsushita, T.↗

Monolithically Integrated SiGe/Si PIN-HBT Front-End Transimpedance Photoreceivers

The demand for monolithically integrated photoreceivers based on Si-based technology keeps increasing as low cost and high reliability products are required for the expanding commercial market. Higher speed and wider operating frequency range are expected when SiGe/Si heterojunction is introduced to the circuit design. In this paper, a monolithic SiGe/Si PIN-HBT front-end transimpedance photoreceiver is demonstrated for the first time. For this purpose, mesa-type SiGe/Si PIN-HBT technology was developed. Fabricated HBTs exhibit f(sub max) of 34 GHz with DC gain of 25. SiGe/Si PIN photodiodes, which share base and collector layers of HBTs, demonstrate responsivity of 0.3 A/W at lambda=850 nm and bandwidth of 450 MHz. Based on these devices, single- and dual-feedback transimpedance amplifiers were fabricated and they exhibited the bandwidth of 3.2 GHz and 3.3 GHz with the transimpedance gain of 45.2 dB(Omega) and 47.4 dB(Omega) respectively. Monolithically integrated single-feedback PIN-HBT photoreceivers were implemented and the bandwidth was measured to be approx. 0.5 GHz, which is limited by the bandwidth of PIN photodiodes.

Rieh, J.-S.↗

Investigating the Effects of Pin Tool Design on Friction Stir Welded Ti-6Al-4V

Friction stir welding (FSWing), a solid state joining technique, uses a non-consumable rotating pin tool to thermomechanically join materials. Heating of the weldment caused by friction and deformation is a function of the interaction between the pin tool and the work piece. Therefore, the geometry of the pin tool is in part responsible for the resulting microstructure and mechanical properties. In this study microwave sintered tungsten carbide (WC) pin tools with tapers and flats were used to FSW Ti-6Al-4V. Transverse sections of welds were mechanically tested, and the microstructure was characterized using optical microscopy (OM) and scanning election microscopy (SEM). X-ray diffraction (XRD) and electron back-scatter diffraction (EBSD) were used to characterize the texture within the welds produced from the different pin tool designs.

Rubisoff, H. A.↗

A Flux-Pinning Mechanism for Segment Assembly and Alignment

Currently, the most compelling astrophysics questions include how planets and the first stars formed and whether there are protostellar disks that contain large organic molecules. Although answering these questions requires space telescopes with apertures of at least 10 meters, such large primaries are challenging to construct by scaling up previous designs; the limited capacity of a launch vehicle bounds the maximum diameter of a monolithic primary, and beyond a certain size, deployable telescopes cannot fit in current launch vehicle fairings. One potential solution is connecting the primary mirror segments edgewise using flux-pinning mechanisms, which are analogous to non-contacting damped springs. In the baseline design, a flux-pinning mechanism consists of a magnet and a superconductor separated by a predetermined gap, with the damping adjusted by placing aluminum near the interface. Since flux pinning is possible only when the superconductor is cooled below a critical temperature, flux-pinning mechanisms are uniquely suited for cryogenic space telescopes. By placing these mechanisms along the edges of the mirror segments, a primary can be built up over time. Since flux pinning requires no mechanical deployments, the assembly process could be robotic or use some other non-contacting scheme. Advantages of this approach include scalability and passive stability.

Gersh-Range, Jessica A.↗

Practical Challenges and Failure Modes During Fabrication of Haynes 230 Micro-Pin Solar Receivers for High Temperature Supercritical Carbon Dioxide Operation

Printed circuit heat exchangers (PCHX) fabricated from high nickel alloys have shown promise as primary heat exchangers, recuperators, and solar receivers for high temperature and pressure supercritical carbon dioxide power cycles. There are numerous challenges in fabricating these devices including forming channel features, joining via diffusion or transient liquid phase bonding, and brazing/welding of headers. Commercial entities are understandably hesitant to share propriety best practices, and both commercial and non-commercial entities working on these components tend not to publically share failures and mistakes. However, sharing of this information could prevent similar costly errors and further the understanding of the coupled manufacturing, materials and mechanics issues in creating these components. Thus, in this paper, we document the challenges, failures, and mitigation methods uncovered in fabrication of prototype micro-pin based solar thermal receivers constructed of Haynes 230 and fabricated through a combination of photochemical machining (PCM), wire electrical discharge machining (EDM), transient liquid phase (TLP) bonding, vacuum brazing, and gas tungsten arc welding (GTAW). The receiver is designed to absorb concentrated solar fluxes greater than 140 W cm-2, while heating supercritical carbon dioxide from 550 °C to 720 °C at a pressure of 20 MPa to 25 MPa. The prototype receiver consists of a thin (~ 450 µm), Haynes 230 coversheet bonded to a 15 cm × 15 cm Haynes 230 micro-pin plate. The pieces are joined using a TLP bonding process with a nickel-phosphorus interlayer. Prior to bonding, micro-pins with height ~150 µm and diameter 300 µm are fabricated using PCM in the plate, and through slot features are made using wire EDM. Finally, flow headers are joined to the microchannel plate through a combination of vacuum brazing and GTAW. During hydrostatic proof testing, the prototype device failed when the coversheet delaminated from the pin array at a pressure of 290 bar. A failure analysis including scanning electron microscopy (SEM) to view failure sites and energy-dispersive X-ray spectroscopy (EDS) to evaluate elemental analysis of the failed areas was conducted. The failure modes can be broadly categorized as (1) failures potentially relating to reliquification of the transient liquid phase bonds between the micro-pins plate and coversheet during post-processing, (2) failures related to manufacturing defects, and (3) failures attributed to design.

14 SOLAR ENERGY↗

Effects of thread interruptions on tool pins in friction stir welding of AA6061

In this paper, effects of pin thread and thread interruptions (flats) on weld quality and process response parameters during friction stir welding (FSW) of 6061 aluminium alloy were quantified. Otherwise, identical smooth and threaded pins with zero to four flats were adopted for FSW. Weldability and process response variables were examined. Results showed that threads with flats significantly improved weld quality and reduced in-plane forces. A three-flat threaded pin led to production of defect-free welds under all examined welding conditions. Spectral analyses of in-plane forces and weld cross-sectional analysis were performed to establish correlation among pin flats, force dynamics and defect formation. Finally, the lowest in-plane force spectra amplitudes were consistently observed for defect-free welds.

42 ENGINEERING↗

Strong-pinning regimes by spherical inclusions in anisotropic type-II superconductors

The current-carrying capacity of type-II superconductors is decisively determined by how well material defect structures can immobilize vortex lines. In order to gain deeper insights into intrinsic pinning mechanisms, we have explored the case of vortex trapping by randomly distributed spherical inclusions using large-scale simulations of the time-dependent Ginzburg-Landau equations. We find that for a small density of particles having diameters of two coherence lengths, the vortex lattice preserves its structure and the critical current j c decays with the magnetic field following a power-law B -a with a ≈ 0.66, which is consistent with predictions of strong pinning theory. For higher density of particles and/or larger inclusions, the lattice becomes progressively more disordered and the exponent smoothly decreases down to a ≈ 0.3. At high magnetic fields, all inclusions capture a vortex and the critical current decays faster than B -1 as would be expected by theory. In the case of larger inclusions with diameter of four coherence length, the magnetic-field dependence of the critical current is strongly affected by the ability of inclusions to capture multiple vortex lines. We found that at small densities, the fraction of inclusions trapping two vortex lines rapidly grows within narrow field range leading to a shallow peak in j c (B)-dependence within this range. With increasing inclusion density, this peak transforms into a plateau, which then smooths out. Using the insights gained from simulations, we determine the limits of applicability of strong pinning theory and provide different routes to describe vortex pinning beyond those bounds.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Small scale mechanical characterization of thin foil materials via pin load microtesting

In situ scanning electron microscope (SEM) experiments, where small-scale mechanical tests are conducted on micro- and nanosized specimens, allow direct visualization of elastic and plastic responses over the entirety of the volume being deformed. This enables precise spatial and temporal correlation of slip events contributing to the plastic flow evidenced in a stress–strain curve. A new pin-loading methodology has been employed, in situ within the SEM, to conduct microtensile tests on thin polycrystalline metal foils. This approach can be tailored to a specific foil whose particular grain size may range from microns to tens of microns. Manufacture of the specialized pin grip was accomplished via silicon photolithography-based processing followed by subsequent focused ion beam finishing. Microtensile specimen preparation was achieved by combining a stencil mask methodology employing broad ion beam sputtering along with focused ion beam milling in the study of several metallic foil materials. Finite-element analyses were performed to characterize the stress and strain distributions in the pin grip and micro-specimen under load. Furthermore, under appropriately conceived test conditions, uniaxial stress–strain responses measured within these foils by pin-load microtensile testing exhibit properties consistent with larger scale tests.

36 MATERIALS SCIENCE↗

Breakdown characteristics analysis of kV-class vertical GaN PIN rectifiers by wafer-level sub-bandgap photoluminescence mapping

This work reports analysis of the reverse-bias breakdown characteristics of homojunction gallium nitride (GaN) p–i–n (PIN) rectifiers fabricated on bulk GaN substrates. Sub-bandgap photoluminescence mapping at room temperature as a contactless, non-destructive wafer inspection method was performed to analyze the impact of material properties on grown GaN PIN diodes and to study the correlation between defect types and breakdown characteristics of vertical GaN PIN rectifiers. Under the sub-bandgap excitation, yellow luminescence is dominant. The premature breakdown characteristics of the fabricated kV-class vertical GaN PIN rectifiers with nitrogen-implanted floating guard rings are found to be associated with material defects and deep level complexes. Photoluminescence mapping has demonstrated its effectiveness in quantitative analysis of dislocations and other types of defects.

42 ENGINEERING↗

Targeted evolution of pinning landscapes for large superconducting critical currents

The ability of type II superconductors to carry large amounts of current at high magnetic fields is a key requirement for future design innovations in high-field magnets for accelerators and compact fusion reactors, and largely depends on the vortex pinning landscape comprised of material defects. The complex interaction of vortices with defects that can be grown chemically, e.g., self-assembled nanoparticles and nanorods, or introduced by postsynthesis particle irradiation precludes a priori prediction of the critical current and can result in highly nontrivial effects on the critical current. Here, we borrow concepts from biological evolution to create a vortex pinning genome based on a genetic algorithm, naturally evolving the pinning landscape to accommodate vortex pinning and determine the best possible configuration of inclusions for two different scenarios: a natural evolution process initiating from a pristine system and one starting with preexisting defects to demonstrate the potential for a postprocessing approach to enhance critical currents. Furthermore, the presented approach is even more general and can be adapted to address various other targeted material optimization problems.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗