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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS2011

Deep Space Networking Experiments on the EPOXI Spacecraft

NASA's Space Communications & Navigation Program within the Space Operations Directorate is operating a program to develop and deploy Disruption Tolerant Networking [DTN] technology for a wide variety of mission types by the end of 2011. DTN is an enabling element of the Interplanetary Internet where terrestrial networking protocols are generally unsuitable because they rely on timely and continuous end-to-end delivery of data and acknowledgments. In fall of 2008 and 2009 and 2011 the Jet Propulsion Laboratory installed and tested essential elements of DTN technology on the Deep Impact spacecraft. These experiments, called Deep Impact Network Experiment (DINET 1) were performed in close cooperation with the EPOXI project which has responsibility for the spacecraft. The DINET 1 software was installed on the backup software partition on the backup flight computer for DINET 1. For DINET 1, the spacecraft was at a distance of about 15 million miles (24 million kilometers) from Earth. During DINET 1 300 images were transmitted from the JPL nodes to the spacecraft. Then, they were automatically forwarded from the spacecraft back to the JPL nodes, exercising DTN's bundle origination, transmission, acquisition, dynamic route computation, congestion control, prioritization, custody transfer, and automatic retransmission procedures, both on the spacecraft and on the ground, over a period of 27 days. The first DINET 1 experiment successfully validated many of the essential elements of the DTN protocols. DINET 2 demonstrated: 1) additional DTN functionality, 2) automated certain tasks which were manually implemented in DINET 1 and 3) installed the ION SW on nodes outside of JPL. DINET 3 plans to: 1) upgrade the LTP convergence-layer adapter to conform to the international LTP CL specification, 2) add convergence-layer "stewardship" procedures and 3) add the BSP security elements [PIB & PCB]. This paper describes the planning and execution of the flight experiment and the validation results.

automated data communication↗
NASA NTRS2013

Preparation of a Bimetal Using Mechanical Alloying for Environmental or Industrial Use

Following the 1976 Toxic Substances Control Act ban on their manufacture, PCBs remain an environmental threat. PCBs are known to bio-accumulate and concentrate in fatty tissues. Further complications arise from the potential for contamination of commercial mixtures with other more toxic chlorinated compounds such as polychlorinated dibenzodioxins (PCDDs) and polychlorinated dibenzofurans (PCDFs). Until recently, only one option was available for the treatment of PCB-contaminated materials: incineration. This may prove to be more detrimental to the environment than the PCBs themselves due to the potential for formation of PCDDs. Metals have been used for the past ten years for the remediation of halogenated solvents and other contaminants in the environment; however, zero-valent metals alone do not possess the activity required to dehalogenate PCBs. Palladium has been shown to act as an excellent catalyst for the dechlorination of PCBs with active metals. This invention is a method for the production of a palladium/magnesium bimetal capable of dechlorinating PCBs using mechanical milling/mechanical alloying. Other base metals and catalysts may also be alloyed together (e.g., nickel or zinc) to create a similarly functioning catalyst system. Several bimetal catalyst systems currently can be used for processes such as hydrogen peroxide synthesis, oxidation of ethane, selective oxidation, hydrogenation, and production of syngas for further conversion to clean fuels. The processes for making these bimetal catalysts often involve vapor deposition. This technology provides an alternative to vapor deposition that may provide equally active catalysts. A hydrogenation catalyst including a base material coated with a catalytic metal is made using mechanical milling techniques. The hydrogenation catalysts are used as an excellent catalyst for the dehalogenation of contaminated compounds and the remediation of other industrial compounds. The mechanical milling technique is simpler and cheaper than previously used methods for producing hydrogenation catalysts. Preferably, the hydrogenation catalyst is a bimetallic particle formed from a zero-valent iron or zero-valent magnesium particle coated with palladium that is impregnated onto a high-surface-area graphite support. The zero-valent metal particles should be microscale or nanoscale zero-valent magnesium or zero-valent iron particles. Other zero-valent metal particles and combinations may be used. Additionally, the base material may be selected from a variety of minerals including, but not limited to, alumina and zeolites. The catalytic metal is preferably selected from the group consisting of noble metals and transition metals, preferably palladium. The mechanical milling process includes milling the base material with a catalytic metal impregnated into a high-surface-area support to form the hydrogenation catalyst. In a preferred mechanical milling process, a zero-valent metal particle is provided as the base material, preferably having a particle size of less than about 10 microns, preferably 0.1 to 10 microns or smaller, prior to milling. The catalytic metal is supported on a conductive carbon support structure prior to milling. For example, palladium may be impregnated on a graphite support. Other support structures such as semiconductive metal oxides may also be used.

Quinn, Jacqueline↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRS2013

Demonstrating the Effect of Particle Impact Dampers on the Random Vibration Response and Fatigue Life of Printed Wiring Assemblies

In a recent experimental study, small Particle Impact Dampers (PID) were bonded directly to the surface of printed circuit board (PCB) or printed wiring assemblies (PWA), reducing the random vibration response and increasing the fatigue life. This study provides data verifying practicality of this approach. The measured peak strain and acceleration response of the fundamental out of plane bending mode was significantly attenuated by adding a PID device. Attenuation of this mode is most relevant to the fatigue life of a PWA because the local relative displacements between the board and the supported components, which ultimately cause fatigue failures of the electrical leads of the board-mounted components are dominated by this mode. Applying PID damping at the board-level of assembly provides mitigation with a very small mass impact, especially as compared to isolation at an avionics box or shelf level of assembly. When compared with other mitigation techniques at the PWA level (board thickness, stiffeners, constrained layer damping), a compact PID device has the additional advantage of not needing to be an integral part of the design. A PID can simply be bonded to heritage or commercial off the shelf (COTS) hardware to facilitate its use in environments beyond which it was originally qualified. Finite element analysis and test results show that the beneficial effect is not localized and that the attenuation is not due to the simple addition of mass. No significant, detrimental reduction in frequency was observed. Side-by-side life testing of damped and un-damped boards at two different thicknesses (0.070" and 0.090") has shown that the addition of a PID was much more significant to the fatigue life than increasing the thickness. High speed video, accelerometer, and strain measurements have been collected to correlate with analytical results.

Knight, Brent↗
NASA NTRS2013

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗
NASA NTRS2013

NASA Tech Briefs, October 2013

Topics include: A Short-Range Distance Sensor with Exceptional Linearity; Miniature Trace Gas Detector Based on Microfabricated Optical Resonators; Commercial Non-Dispersive Infrared Spectroscopy Sensors for Sub-Ambient Carbon Dioxide Detection; Fast, Large-Area, Wide-Bandgap UV Photodetector for Cherenkov Light Detection; Mission Data System Java Edition Version 7; Adaptive Distributed Environment for Procedure Training (ADEPT); LEGEND, a LEO-to-GEO Environment Debris Model; Electronics/Computers; Millimeter-Wave Localizers for Aircraft-to-Aircraft Approach Navigation; Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces; SpaceCube Version 1.5; High-Pressure Lightweight Thrusters; Non-Magnetic, Tough, Corrosion- and Wear-Resistant Knives From Bulk Metallic Glasses and Composites; Ambient Dried Aerogels; Applications for Gradient Metal Alloys Fabricated Using Additive Manufacturing; Passivation of Flexible YBCO Superconducting Current Lead With Amorphous SiO2 Layer; Propellant-Flow-Actuated Rocket Engine Igniter; Lightweight Liquid Helium Dewar for High-Altitude Balloon Payloads; Method to Increase Performance of Foil Bearings Through Passive Thermal Management; Unibody Composite Pressurized Structure; JWST Integrated Science Instrument Module Alignment Optimization Tool; Radar Range Sidelobe Reduction Using Adaptive Pulse Compression Technique; Digitally Calibrated TR Modules Enabling Real-Time Beamforming SweepSAR Architectures; Electro-Optic Time-to-Space Converter for Optical Detector Jitter Mitigation; Partially Transparent Petaled Mask/Occulter for Visible-Range Spectrum; Educational NASA Computational and Scientific Studies (enCOMPASS); Coarse-Grain Bandwidth Estimation Scheme for Large-Scale Network; Detection of Moving Targets Using Soliton Resonance Effect; High-Efficiency Nested Hall Thrusters for Robotic Solar System Exploration; High-Voltage Clock Driver for Photon-Counting CCD Characterization; Development of the Code RITRACKS; and Enabling Microliquid Chromatography by Microbead Packing of Microchannels.

Source record↗
NASA NTRS2012

Wind Noise Reduction in a Non-Porous Subsurface Windscreen

Measurements of wind noise reduction were conducted on a box-shaped, subsurface windscreen made of closed cell polyurethane foam. The windscreen was installed in the ground with the lid flush with the ground surface. The wind was generated by means of a fan, situated on the ground, and the wind speed was measured at the center of the windscreen lid with an ultrasonic anemometer. The wind speed was controlled by moving the fan to selected distances from the windscreen. The wind noise was measured on a PCB Piezotronics 3†electret microphone. Wind noise spectra were measured with the microphone exposed directly to the wind (atop the windscreen lid) and with the microphone installed inside the windscreen. The difference between the two spectra comprises the wind noise reduction. At wind speeds of 3, 5, and 7 m/s, the wind noise reduction is typically 15 dB over the frequency range of 0.1-20 Hz.

Zuckerwar, Allan J.↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS2014

KSC Press Site Transformer Bldg. (K7-1205c) SWMU 074 Interim Measure Work Plan

This document presents and discusses the Interim Measure (IM) Work Plan for the Press Site Transformer Building (K7-1205C). The purpose of the proposed IM activities is to remove soil affected with polychlorinated biphenyls (PCBs) greater than the Florida Department of Environmental Protection (FDEP) residential direct-exposure Soil Cleanup Target Level (R-SCTL) of 0.5 milligrams per kilogram and encapsulate concrete exhibiting PCB concentration greater than the Toxic Substance Control Act (TSCA) threshold of 50 milligrams per kilogram.

Remediation↗
NASA NTRS2015

Boundary Layer Instabilities Generated by Freestream Laser Perturbations

A controlled, laser-generated, freestream perturbation was created in the freestream of the Boeing/AFOSR Mach-6 Quiet Tunnel (BAM6QT). The freestream perturbation convected downstream in the Mach-6 wind tunnel to interact with a flared cone model. The geometry of the flared cone is a body of revolution bounded by a circular arc with a 3-meter radius. Fourteen PCB 132A31 pressure transducers were used to measure a wave packet generated in the cone boundary layer by the freestream perturbation. This wave packet grew large and became nonlinear before experiencing natural transition in quiet flow. Breakdown of this wave packet occurred when the amplitude of the pressure fluctuations was approximately 10% of the surface pressure for a nominally sharp nosetip. The initial amplitude of the second mode instability on the blunt flared cone is estimated to be on the order of 10 −6 times the freestream static pressure. The freestream laser-generated perturbation was positioned upstream of the model in three different configurations: on the centerline, offset from the centerline by 1.5 mm, and offset from the centerline by 3.0 mm. When the perturbation was offset from the centerline of a blunt flared cone, a larger wave packet was generated on the side toward which the perturbation was offset. The offset perturbation did not show as much of an effect on the wave packet on a sharp flared cone as it did on a blunt flared cone.

Chou, Amanda↗
NASA NTRS2010

Controlling Precision Stepper Motors in Flight Using (Almost) No Parts

This concept allows control of high-performance stepper motors with minimal parts count and minimal flight software complexity. Although it uses a small number of common flight-qualified parts and simple control algorithms, it is capable enough to meet demanding system requirements. Its programmable nature makes it trivial to implement changes to control algorithms both during integration & test and in flight. Enhancements such as microstepping, half stepping, back-emf compensation, and jitter reduction can be tailored to the requirements of a large variety of stepper motor based applications including filter wheels, focus mechanisms, antenna tracking subsystems, pointing and mobility. The hardware design (using an H-bridge motor controller IC) was adapted from JPL's MER mission, still operating on Mars. This concept has been fully developed and incorporated into the MCS instrument on MRO, currently operating in Mars orbit. It has been incorporated into the filter wheel mechanism and linear stage (focus) mechanism for the AMT instrument. On MCS/MRO, two of these circuits control the elevation and azimuth of the MCS telescope/radiometer assembly, allowing the instrument to continuously monitor the limb of the Martian atmosphere. Implementation on MCS/MRO resulted in a 4:1 reduction in the volume and mass required for the motor driver electronics (100:25 square inches of PCB space), producing a very compact instrument. In fact, all of the electronics for the MCS instrument are packaged within the movable instrument structure. It also saved approximately 3 Watts of power. Most importantly, the design enabled MCS to meet very its stringent maximum allowable torque disturbance requirements.

Randall, David↗
NASA NTRS2015

Wideband Array for C, X, and Ku-Band Applications with 5.3:1 Bandwidth

Satellite communication has largely been accomplished using reflector antennas. However, such antennas are inherently bulky, and rely on mechanical steering. For this reason, ultra-wideband (UWB) and beam forming arrays have received strong interest. These lower weight, size,and cost arrays can combine many satellite applicationsspread throughout the C–Ka bands (4–40 GHz).To this end, we seek to develop an UWB Tightly-Coupled Dipole Array (TCDA) with the following attributes: UWB band operation (3.5–18.5 GHz) with low loss; 45˚ or more scanning in all planes; Low-cost Printed Circuit Board (PCB) fabrication; Scalable to Ka-band and above.

Wideband Array↗
NASA NTRS2015

Wideband Array for C, X, and Ku-Band Applications with 5.3:1 Bandwidth

Planar arrays that exploit strong intentional coupling between elements have allowed for very wide bandwidths in low-profile configurations. However, such designs also require complex impedance matching networks that must also be very compact. For many space applications, typically occurring at C-, X-, Ku-, and most recently at Ka-band, such designs require specialized and expensive fabrication techniques. To address this issue, a novel ultra-wideband array is presented, using a simplified feed network to reduce fabrication cost. The array operates from 3.5-18.5 GHz with VSWR less than 2.4 at broadside, and is of very low profile, having a total height of lambda/10 at the lowest frequency of operation. Validation is provided using a 64-element prototype array, fabricated using common Printed Circuit Board (PCB) technology. The low size, weight, and cost of this array make it attractive for space-borne applications.

X-↗
NASA NTRS2015

Conformal and Spectrally Agile Ultra Wideband Phased Array Antenna for Communication and Sensing

There is a continuing need for reducing size and weight of satellite systems, and is also strong interest to increase the functional role of small- and nano-satellites (for instance SmallSats and CubeSats). To this end, a family of arrays is presented, demonstrating ultra-wideband operation across the numerous satellite communications and sensing frequencies up to the Ku-, Ka-, and Millimeter-Wave bands. An example design is demonstrated to operate from 3.5-18.5 GHz with VSWR2 at broadside, and validated through fabrication of an 8 x 8 prototype. This design is optimized for low cost, using Printed Circuit Board (PCB) fabrication. With the same fabrication technology, scaling is shown to be feasible up to a 9-49 GHz band. Further designs are discussed, which extend this wideband operation beyond the Ka-band, for instance from 20-80 GHz. Finally we will discuss recent efforts in the direct integration of such arrays with digital beamforming back-ends. It will be shown that using a novel on-site coding architecture, orders of magnitude reduction in hardware size, power, and cost is accomplished in this transceiver.

Ultra Wideband antenna↗
NASA NTRS2015

Kennedy Space Center Press Site (SWMU 074) Interim Measure Report

This report summarizes the Interim Measure (IM) activities conducted at the Kennedy Space Center (KSC) Press Site ("the Press Site"). This facility has been designated as Solid Waste Management Unit 074 under KSC's Resource Conservation and Recovery Act Corrective Action program. The activities were completed as part of the Vehicle Assembly Building (VAB) Area Land Use Controls Implementation Plan (LUCIP) Elimination Project. The purpose of the VAB Area LUCIP Elimination Project was to delineate and remove soil affected with constituents of concern (COCs) that historically resulted in Land Use Controls (LUCs). The goal of the project was to eliminate the LUCs on soil. LUCs for groundwater were not addressed as part of the project and are not discussed in this report. This report is intended to meet the Florida Department of Environmental Protection (FDEP) Corrective Action Management Plan requirement as part of the KSC Hazardous and Solid Waste Amendments permit and the U.S. Environmental Protection Agency's (USEPA's) Toxic Substance Control Act (TSCA) self-implementing polychlorinated biphenyl (PCB) cleanup requirements of 40 Code of Federal Regulations (CFR) 761.61(a).

Measures↗
NASA NTRS2016

Ultra-Wideband Phased Array for Millimeter-Wave 5G and ISM

Growing mobile data consumption has prompted the exploration of the millimeter-wave spectrum for large bandwidth, high speed communications. However, the allocated bands are spread across a wide swath of spectrum: fifth generation mobile architecture (5G): 28, 38, 39, 64-71 GHz, as well as Industrial, Scientific, and Medical bands (ISM): 24 and 60 GHz. Moreover, high gain phased arrays are required to overcome the significant path loss associated with these frequencies. Further, it is necessary to incorporate several of these applications in a single, small size and low cost platform. To this end, we have developed a scanning, Ultra-Wideband (UWB) array which covers all 5G, ISM, and other mm-W bands from 24-72 GHz. Critically, this is accomplished using mass-production Printed Circuit Board (PCB) fabrication.

Ultra-wide band phased array↗
NASA NTRS2017

A Comparison of Combustion Dynamics for Multiple 7-Point Lean Direct Injection Combustor Configurations

The combustion dynamics of two 7-point lean direct injection (LDI) combustor configurations are compared. This 7-point LDI configuration has a circular cross section, with a center ("pilot") fuel-air mixer surrounded by six outer ("main") fuel-air mixers. Each fuel-air mixer consists of an axial air swirler followed by a converging-diverging venturi. A simplex fuel injector is inserted through the center of the air swirler, with the fuel injector tip located near the venturi throat. All 7 fuel-air mixers are identical except for the swirler blade angle. In the 'all-60' configuration, the swirler blade angle was 60 deg for all fuel-air mixers. In the '45-60' configuration, the swirler blade angle was 60 deg on the center and 45 deg on the outer fuel-air mixers. Testing was done in a 5-atm flame tube with inlet air temperatures from 630 to 830 F and equivalence ratios from 0.2 to 0.7. Combustion dynamics were measured using a cooled PCB pressure transducer flush-mounted in the wall of the combustor test section. Both configurations had large pressure fluctuations (greater than 2 psi peak-peak) near 730 Hz, the quarter-wave frequency. The all-60 configuration also had large pressure fluctuations near 1170 Hz; the 45-60 configuration did not. The 45-60 configuration had large pressure fluctuations near 480 Hz; the all-60 configuration did not.

combustion dynamics↗
NASA NTRS2017

A Comparison of Combustion Dynamics for Multiple 7-Point Lean Direct Injection Combustor Configurations

The combustion dynamics of multiple 7-point lean direct injection (LDI) combustor configurations are compared. LDI is a fuel-lean combustor concept for aero gas turbine engines in which multiple small fuel-air mixers replace one traditionally-sized fuel-air mixer. This 7-point LDI configuration has a circular cross section, with a center (pilot) fuel-air mixer surrounded by six outer (main) fuel-air mixers. Each fuel-air mixer consists of an axial air swirler followed by a converging-diverging venturi. A simplex fuel injector is inserted through the center of the air swirler, with the fuel injector tip located near the venturi throat. All 7 fuel-air mixers are identical except for the swirler blade angle, which varies with the configuration. Testing was done in a 5-atm flame tube with inlet air temperatures from 600 to 800 F and equivalence ratios from 0.4 to 0.7. Combustion dynamics were measured using a cooled PCB pressure transducer flush-mounted in the wall of the combustor test section.

lean direct injection↗