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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.
Proton-induced fission of high-Z (Atomic Number) materials can produce high fluxes of high-LET (Linear Energy Transfer) ions in microelectronics. We develop methods to evaluate risks for a range of destructive and nondestructive SEE (Single-Event Effects) modes caused by this threat.
A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.
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Microcircuit development at MSFC for conversion of Saturn launch vehicle electronics
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This roadmap introduces current technologies, related strategic issues, and research reccomendations for space applications.
This roadmap introduces current technologies in use, related strategic issues and trends, and research recommendations for space applications.
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