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At least 163 records · Page 9

Modeling Creep-Induced Stress Relaxation at the Leading Edge of SiC/SiC Airfoils

Anticipating the implementation of advanced SiC/SiC composites into internally cooled airfoil components within the turbine section of future aero-propulsion engines, the primary objective of this study was to develop physics-based analytical and finite-element modeling tools to predict the effects of composite creep and stress relaxation at the airfoil leading edges, which will generally experience large thermal gradients at high temperatures. A second objective was to examine how some advanced NASA-developed SiC/SiC systems coated with typical EBC materials would behave as leading edge materials in terms of long-term steady-state operating temperatures. Because of the complexities introduced by mechanical stresses inherent in internally cooled airfoils, a simple cylindrical thin-walled tube model subjected to thermal stresses only is employed for the leading edge, thereby obtaining a best-case scenario for the material behavior. In addition, the SiC/SiC composite materials are assumed to behave as isotropic materials with temperature-dependent viscoelastic creep behavior as measured in-plane on thin-walled panels. Key findings include: (1) without mechanical stresses and for typical airfoil geometries, as heat flux is increased through the leading edge, life-limiting tensile crack formation will occur first in the hoop direction on the inside wall of the leading edge; (2) thermal gradients through all current SiC/SiC systems should be kept below approx.300 F at high temperatures to avoid this cracking; (3) at temperatures near the maximum operating temperatures of advanced SiC/SiC systems, thermal stresses induced by the thermal gradients will beneficially relax with time due to creep; (4) although stress relaxation occurs, the maximum gradient should still not exceed 300oF because of residual tensile stress buildup on the airfoil outer wall during cool-down; and (5) without film cooling and mechanical stresses, the NASA-developed N26 SiC/SiC system with thru-thickness Sylramic-iBN fiber reinforcement and a typical EBC coating has the potential of offering a maximum long-term steady-state operating temperature of approx.3100 F at the surface of the EBC.

Lang, Jerry

Metallic Concepts for Repair of Reinforced Carbon-Carbon Space Shuttle Leading Edges

The Columbia accident has focused attention on the critical need for on-orbit repair concepts for wing leading edges in the event that potentially catastrophic damage is incurred during Space Shuttle Orbiter flight. The leading edge of the space shuttle wings consists of a series of eleven panels on each side of the orbiter. These panels are fabricated from reinforced carbon-carbon (RCC) which is a light weight composite with attractive strength at very high temperatures. The damage that was responsible for the loss of the Colombia space shuttle was deemed due to formation of a large hole in one these RCC leading edge panels produced by the impact of a large piece of foam. However, even small cracks in the RCC are considered as potentially catastrophic because of the high temperature re-entry environment. After the Columbia accident, NASA has explored various means to perform on-orbit repairs in the event that damage is sustained in future shuttle flights. Although large areas of damage, such as that which doomed Columbia, are not anticipated to re-occur due to various improvements to the shuttle, especially the foam attachment, NASA has also explored various options for both small and large area repair. This paper reports one large area repair concept referred to as the "metallic over-wrap." Environmental conditions during re-entry of the orbiter impose extreme requirements on the RCC leading edges as well as on any repair concepts. These requirements include temperatures up to 3000 F (1650 C) for up to 15 minutes in the presence of an extremely oxidizing plasma environment. Figure 1 shows the temperature profile across one panel (#9) which is subject to the highest temperatures during re-entry. Although the RCC possesses adequate mechanical strength at these temperatures, it lacks oxidation resistance. Oxidation protection is afforded by converting the outer layers of the RCC to SiC by chemical vapor deposition (CVD). At high temperatures in an oxidizing environment, the SiC layer forms a protective SiO2 scale. However, CVD processing to form the SiC layer can result in the formation of small cracks in the outer surface. Hence, as a final fabrication step, a sodium silicate glass, known as "Type A," is applied as a sealant to fill any surface porosity and/or cracks in the coating and the outer portions of the RCC[1]. At relatively low temperatures, the Type A glass melts and flows into the cracks providing oxidation protection at the higher temperatures. In addition, the Type A coating, provides a "dark" coating with a high emissivity. This high emissivity allows the RCC to transfer heat by radiating outward to space as well as dispersing heat within the leading edge cavity. Lastly, the Type A possesses low catalycity which reduces surface temperatures by limiting oxygen recombination on the surface during re-entry.

Ritzert, Frank

Acoustic Receptivity of Mach 4.5 Boundary Layer with Leading- Edge Bluntness

Boundary layer receptivity to two-dimensional slow and fast acoustic waves is investigated by solving Navier-Stokes equations for Mach 4.5 flow over a flat plate with a finite-thickness leading edge. Higher order spatial and temporal schemes are employed to obtain the solution whereby the flat-plate leading edge region is resolved by providing a sufficiently refined grid. The results show that the instability waves are generated in the leading edge region and that the boundary-layer is much more receptive to slow acoustic waves (by almost a factor of 20) as compared to the fast waves. Hence, this leading-edge receptivity mechanism is expected to be more relevant in the transition process for high Mach number flows where second mode instability is dominant. Computations are performed to investigate the effect of leading-edge thickness and it is found that bluntness tends to stabilize the boundary layer. Furthermore, the relative significance of fast acoustic waves is enhanced in the presence of bluntness. The effect of acoustic wave incidence angle is also studied and it is found that the receptivity of the boundary layer on the windward side (with respect to the acoustic forcing) decreases by more than a factor of 4 when the incidence angle is increased from 0 to 45 deg. However, the receptivity coefficient for the leeward side is found to vary relatively weakly with the incidence angle.

Malik, Mujeeb R.

NASA-DoD Lead-Free Electronics Project: Vibration Test

Vibration testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is a follow-on to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project which was the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/miLItary community. Twenty seven test vehicles were subjected to the vibration test conditions (in two batches). The random vibration Power Spectral Density (PSD) input was increased during the test every 60 minutes in an effort to fail as many components as possible within the time allotted for the test. The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The number of test minutes required to fail a given component attached with SnPb solder was then compared to the number of test minutes required to fail the same component attached with lead-free solder. A complete modal analysis was conducted on one test vehicle using a laser vibrometer system which measured velocities, accelerations, and displacements at one . hundred points. The laser vibrometer data was used to determine the frequencies of the major modes of the test vehicle and the shapes of the modes. In addition, laser vibrometer data collected during the vibration test was used to calculate the strains generated by the first mode (using custom software). After completion of the testing, all of the test vehicles were visually inspected and cross sections were made. Broken component leads and other unwanted failure modes were documented.

Woodrow, Thomas A.

NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report

The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.

Kessel, Kurt

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Kessel, Kurt

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.

Wall-Modeled Large-Eddy Simulations of a Swept Wing with Leading-Edge Ice

The aerodynamic performance of a swept wing derived from the Common Research Model wing with high-fidelity and smooth leading-edge ice shapes is evaluated using wall-modeled large-eddy simulations. Two mesh paradigms are considered within the Launch, Ascent, and Vehicle Aerodynamics framework: structured hybrid curvilinear body-fitted/immersed-boundary and unstructured Voronoi. The curvilinear approach models the effect of the ice on the flow through penalty terms and the Voronoi strategy includes the ice representation directly in the mesh.Aerodynamic loads, surface pressure profiles, and skin-friction streamlines are compared against experimental results collected at the Wichita State University wind tunnel at a Mach number of 0.18 and a Reynolds number per mean aerodynamic chord of 1.6 million. For the curvilinear simulations with high-fidelity ice, results are sensitive to spanwise mesh resolution near the leading edge, where insufficient spanwise resolution leads to a spanwise running vortexaft of the high-fidelity ice, which is partially removed with increasing spanwise resolution. For the Voronoi simulations with high-fidelity ice, refining the mesh led to good convergence towards the experimental results with the best case demonstrating a maximum discrepancy of three lift counts relative to the experiment across a range of angles of attack from about 5 to 24 degrees, validating the shrink-wrapping procedure used for the ice. For the smooth ice, the curvilinear approach consistently under-predicted the upper surface suction leading to an under-prediction in lift, but did not demonstrate the pronounced over-prediction in upper surface suction near the leading edge observed in the Voronoi simulations.

AATT

Hi-rel lead-free printed wiring assemblies

The use of lead in electronics has come under increasing scrutiny. Given the trends in both Japan and Europe, it is highly likely that the U.S. will be driven by commercial interests to phase out of lead in electronics usage. This paper presents data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The first phase of this project dealt with determining the most feasible candidates to replace tin-lead and to determine suitable processing operations in assemblies printed wiring boards.

lead tin-lead wiring-boards solder pastes

NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

electronics

Bromine Incorporation Affects Phase Transformations and Thermal Stability of Lead Halide Perovskites

Mixed-cation and mixed-halide lead halide perovskites show great potential for their application in photovoltaics. Many of the high-performance compositions are made of cesium, formamidinium, lead, iodine, and bromine. However, incorporating bromine in iodine-rich compositions and its effects on the thermal stability of the perovskite structure has not been thoroughly studied. In this work, we study how replacing iodine with bromine in the state-of-the-art Cs 0.17 FA 0.83 PbI 3 perovskite composition leads to different dynamics in the phase transformations as a function of temperature. Through a combination of structural characterization, cathodoluminescence mapping, X-ray photoelectron spectroscopy, and first-principles calculations, we reveal that the incorporation of bromine reduces the thermodynamic phase stability of the films and shifts the products of phase transformations. Our results suggest that bromine-driven vacancy formation during high temperature exposure leads to irreversible transformations into PbI 2 , whereas materials with only iodine go through transformations into hexagonal polytypes, such as the 4H-FAPbI 3 phase. This work sheds light on the structural impacts of adding bromine on thermodynamic phase stability and provides new insights into the importance of understanding the complexity of phase transformations and secondary phases in mixed-cation and mixed-halide systems.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH

Causes of Degradation of Organ Pipes with Very Low Lead Content

This study investigates the causes of degradation in organ pipes with low lead content. Using light This study investigates the causes of degradation in organ pipes with low lead content. Using light optical microscopy, SEM/EDS, and TEM/EDS, intermetallic Cu6Sn5, FeSn2, Sn4As3, and Pb particles were observed in the structure of SnPb alloys. Degradation of the low-Pb organ metal, which is primarily caused by the selective corrosion of lead occurring due to the effect of volatile organic compounds (VOCs). Another factor leading to degradation is the structural transformation of tin occurring at low temperatures (tin pest). TEM/EDS allowed the unique observation of α-tin particles found in a β-tin matrix at room temperature. The presence of particles of α‑tin in historical organ pipes has not previously been reported, and it is the first presented observation of all.

alloy SnPb

Strain-induced lead-free morphotropic phase boundary

Enhanced susceptibilities in ferroelectrics often arise near phase boundaries between competing ground states. While chemically-induced phase boundaries have enabled ultrahigh electrical and electromechanical responses in lead-based ferroelectrics, precise chemical tuning in lead-free alternatives, such as (K,Na)NbO 3 thin films, remains challenging due to the high volatility of alkali metals. Here, we demonstrate strain-induced morphotropic phase boundary-like polymorphic nanodomain structures in chemically simple, lead-free, epitaxial NaNbO 3 thin films. Combining ab initio simulations, thin-film epitaxy, scanning probe microscopy, synchrotron X-ray diffraction, and electron ptychography, we reveal a labyrinthine structure comprising coexisting monoclinic and bridging triclinic phases near a strain-induced phase boundary. The coexistence of energetically competing phases facilitates field-driven polarization rotation and phase transitions, giving rise to a multi-state polarization switching pathway and large enhancements in dielectric susceptibility and tunability across a broad frequency range. Our results open new possibilities for engineering lead-free thin films with enhanced functionalities for next-generation applications.

Electronic properties and materials

Demonstration of collinear factorization breaking due to collinear-to-soft Glauber exchanges for a 2 → 3 exclusive process at leading twist

We exhibit an exclusive process, namely the photoproduction of a π 0 γ pair with large invariant mass, which violates collinear factorization. We explicitly demonstrate that this is due to the fact that there exists diagrams with gluon exchange in t channel, contributing at the leading power, for which are . This is caused by the pinching of the contour integration of the plus and minus light-cone components of the Glauber gluon momentum. We argue that this leads to the observed “end pointlike” divergence of the convolution integral at leading order and leading power when collinear factorization is naïvely assumed. Published by the American Physical Society 2025

73 NUCLEAR PHYSICS AND RADIATION PHYSICS

Unexpected Breakdown of Collinear Factorisation at Leading Twist in Exclusive π 0 γ Photoproduction Due to Glauber Pinch

We demonstrate the breakdown of collinear factorisation for the exclusive photoproduction at leading twist of a pair, sensitive to both quark and gluon GPD channels. For the very first time in the case of an exclusive process, we demonstrate the breakdown of collinear factorisation through soft-to-collinear Glauber exchanges. We show that the amplitude fails to factorise due to the presence of a Glauber pinch, which has the same power counting as the standard collinear pinch. The Glauber pinch that occurs here is peculiar, since the mechanism that produces it involves two-loop integrals. This is corroborated by an explicit calculation of the gluon GPD channel to pair photoproduction, which leads to a divergent amplitude already at leading twist-2 and at leading order in . On the other hand, for processes where the gluon GPD channel is forbidden, for example when the outgoing meson is a charged pion or a rho meson, collinear factorisation works without any issues.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS

Effects of increased leading-edge thickness on performance of a transonic rotor blade

A single-stage transonic compressor was tested with two rotor blade leading-edge configurations to investigate the effect of increased leading-edge thickness on the performance of a transonic blade row. The original rotor blade configuration was modified by cutting back the leading edge sufficiently to double the blade leading-edge thickness and thus the blade gap blockage in the tip region. At design speed this modification resulted in a decrease in rotor overall peak efficiency of four points. The major portion of this decrement in rotor overall peak efficienty was attributed to the flow conditions in the outer 30 percent of the blade span. At 70 and 90 percent of design speed, the modification had very little effect on rotor overall performance.

Reid, L.

Effect of spanwise blowing on leading-edge vortex bursting of a highly swept aspect ratio 1.18 delta wing

An investigation was conducted in the Langley 1/8-scale V/STOL model tunnel on a semispan delta wing with a leading-edge sweep of 74 deg, to determine the effectiveness of various locations of upper surface and reflection plane blowing on leading-edge vortex bursting. Constant area nozzles were located on the wing upper surface along a ray swept 79 deg, which was beneath the leading-edge vortex core. The bursting and reformation of the leading-edge vortex was viewed by injecting helium into the vortex core, and employing a schlieren system.

Scantling, W. L.