NASA NTRS2010
Recently, there has been significant interest in using bismuth metal as a propellant in Hall Thrusters [1, 2]. Bismuth offers some considerable cost, weight, and space savings over the traditional propellant--xenon. Quantifying the performance of liquid metal-fed Hall thrusters requires a very precise measure of the low propellant flow rates [1, 2]. The low flow rates (~10 mg/sec) and the temperature at which free flowing liquid bismuth exists (above 300 C) preclude the use of off-the-shelf flow sensing equipment [3]. Therefore a new type of sensor is required. The hotspot bismuth flow sensor, described in Refs. [1-5] is designed to perform a flow rate measurement by measuring the velocity at which a thermal feature moves through a flow chamber. The mass flow rate can be determined from the time of flight of the thermal peak, [4, 5]. Previous research and testing has been concerned mainly with the generation of the thermal peak and it's subsequent detection. In this paper, we present design improvements to the sensor concept; and the results of testing conducted to verify the functionality of these improvements. A ceramic material is required for the sensor body (see Fig. 1), which must allow for active heating of the bismuth flow channel to keep the propellant in a liquid state. The material must be compatible with bismuth and must be bonded to conductive elements to allow for conduction of current into the liquid metal and measurement of the temperature in the flow. The new sensor requires fabrication techniques that will allow for a very small diameter flow chamber, which is required to produce useful measurements. Testing of various materials has revealed several that are potentially compatible with liquid bismuth. Of primary concern in the fabrication and testing of a robust, working prototype, is the compatibility of the selected materials with one another. Specifically, the thermal expansion rates of the materials relative to the ceramic body cannot expand so much as to cause cracks in the body or cause the bond between parts to delaminate. Those parts that will carry the current pulse must be electrically conductive while the sensor body must be an electrical insulator. Generally, the material choices as well as the sensor design must aid to preserve the integrity of the thermal feature to obtain accurate measurements. The present aim is to also incorporate, into the sensor body, an active heating arrangement based on ceramic heater technology similar to that used in semiconductor manufacturing.