DOE OSTI2021
Work in the project was spread across 4 main themes:1) Improved Understanding of Why Cracks Form and Cause Degradation in Solar Cells: We developed a finite element model which correlated well with experimental determined deflection vs load profiles and which predicted stress profiles vs load level and temperature. These profiles helped to guide brace designs and showed the high stress levels seen in the silicon near the interconnect wire locations as the temperature is cooled below -30C, likely forming "invisible" microcracks. Experiments showed how for polymer backsheet modules, a brief exposure to such low temperatures made modules extremely sensitive to propagation of these microcracks at relatively low load levels, and how thicker and softer encapsulant helped to reduce this crack sensitivity. We showed for some modules that most cracks that are seen under loading had their origin at short, hard to see, V-cracks from soldering damage, and how the shunting from cells with high densities of cracks reduces energy delivery more than Pmax. 2) Improved Durability Testing Methods With Respect to Cracked Cells: We lobbied the PV community throughout the project that IEC 61215 was insufficient to probe the sensitivity of module Pmax degradation due to cracks in that in did not have a test leg that included a crack creation step (static loading) followed by a crack opening step (cyclic loading and/or thermal cycling). We published extensively on how pre- existing cracks opened up with cyclic loading. The new IEC TS 63209-1 ED1 test sequence now include our recommendations, and this should lead to improved module designs and reduced risk for investors. We also published recommendations for a new "Cold Climate Test" sequence to probe the sensitivity of modules to degradation from short microcracks formed when modules see temperatures below -30C followed by front side loading. We participated in several USTAG meetings related to cracked cells, EL testing, and mechanical load testing and provided input to the group to improve new standards under consideration. We also showed how the act of performing an EL test can affect the test results due to heating from the injected current. 3) New Module Designs and Related Manufacturing Methods & Equipment: We demonstrated reduced crack sensitivity on encapsulated cell coupons the benefits of building protective compressive stress into the cells by laminating them in a bent state and then allowing the coupon to flatten out after lamination. Our attempts to scale this to the module level with a more manufacturable sequence did not demonstrate the same positive effects, but we hope that others will follow up with other variations on this bent lamination or bent cooling concept to make more durable modules. 4) New Module Mounting Designs: We explored a range of bracing concepts which pressed on the backsheet to slightly bow the glass outward and place cells in a state of protective compressive stress and to reduce the deflection under front side loads. These successfully reduced cell cracking and crack opening, but high static loads permanently deformed cost-effective braces, after which they provided little benefit. We settled on an elegant & effective solution – the RailPad, where lightweight bracing elements are placed between the mounting rail(s) and the backsheet, and the existing strength of the rails is used to prevent module deflection under load. New construction and retrofit designs were made, and test sites were implemented in FL and MA. We applied for RailPad patent protection.