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At least 163 records · Page 9

Effect of copper impurity on polycrystalline silicon solar cells

The presence of copper impurity, up to 10 to the 15th atoms/cc, in single crystal silicon has been shown to have no deleterious effect on the p-n junction solar cell performance. However, in polycrystalline silicon, copper atoms tend to migrate to the defect sites because of the structural sensitive properties of copper. This study was undertaken to investigate the influence of this behavior of copper impurity on the performance of p-n junction solar cells fabricated from structurally imperfect silicon. Two sets of polycrystalline silicon substrates containing copper were examined. In one set of samples, copper was incorporated during growth, whereas in the other, copper was diffused. Solar cells were fabricated on both the sets of substrates by a standard process. Dark and light I-V and spectral response characteristics of the cells were measured and compared with copper-free polycrystalline silicon solar cells. The results and the model are discussed.

Daud, T.↗

Thin film strain transducer

A strain transducer system and process for making the same is disclosed. A beryllium copper ring having four strain gages is electrically connected in Wheatstone bridge fashion to the output instrumentation. Tabs are bonded to a balloon or like surface with strain on the surface causing bending of a ring which provides an electrical signal through the gages proportional to the surface strain. A photographic pattern of a one half ring segment as placed on a sheet of beryllium copper for chem-mill etch formation is illustrated.

Rand, J. L.↗

Effect of current ripple on cathode erosion in 30 kWe class arcjets

An investigation was conducted to study the effect of current ripple on cathode erosion in 30 kWe class arcjets to determine the change in the cathode erosion rate for high (11 percent) and low (4 percent) current ripple. The measurements were conducted using a copper-tungsten cathode material to accelerate the cathode erosion process. It is shown that the high ripple erosion rate was initially higher than the low ripple erosion rate, but decreased asymptotically with time to a level less than half that of the low ripple value. Results suggest that high ripple extends the cathode lifetime for long duration operation, and improves arc stability by increasing the cathode attachment area.

Harris, William J.↗

Molecular cloning and characterization of a tumor-associated, growth-related, and time-keeping hydroquinone (NADH) oxidase (tNOX) of the HeLa cell surface

NOX proteins are growth-related cell surface proteins that catalyze both hydroquinone or NADH oxidation and protein disulfide interchange and exhibit prion-like properties. The two enzymatic activities alternate to generate a regular period length of about 24 min. Here we report the expression, cloning, and characterization of a tumor-associated NADH oxidase (tNOX). The cDNA sequence of 1830 bp is located on gene Xq25-26 with an open reading frame encoding 610 amino acids. The activities of the bacterially expressed tNOX oscillate with a period length of 22 min as is characteristic of tNOX activities in situ. The activities are inhibited completely by capsaicin, which represents a defining characteristic of tNOX activity. Functional motifs identified by site-directed mutagenesis within the C-terminal portion of the tNOX protein corresponding to the processed plasma membrane-associated form include quinone (capsaicin), copper and adenine nucleotide binding domains, and two cysteines essential for catalytic activity. Four of the six cysteine to alanine replacements retained enzymatic activity, but the period lengths of the oscillations were increased. A single protein with two alternating enzymatic activities indicative of a time-keeping function is unprecedented in the biochemical literature.

NASA Discipline Cell Biology↗

Water Based Phase Change Material Heat Exchanger Development

In a cyclical heat load environment such as low Lunar orbit, a spacecraft’s radiators are not sized to reject the full heat load requirement. Traditionally, a supplemental heat rejection device (SHReD) such as an evaporator or sublimator is used to act as a “topper” to meet the additional heat rejection demands. Utilizing a Phase Change Material (PCM) heat exchanger (HX) as a SHReD provides an attractive alternative to evaporators and sublimators as PCM HXs do not use a consumable, thereby leading to reduced launch mass and volume requirements. Studies conducted in this paper investigate utilizing water’s high latent heat of formation as a PCM, as opposed to traditional waxes, and corresponding complications surrounding freezing water in an enclosed volume. Work highlighted in this study is primarily visual and includes understanding ice formation, freeze front propagation, and the solidification process of water/ice. Various test coupons were constructed of copper to emulate the interstitial pin configuration (to aid in conduction) of the proposed water PCM HX design. Construction of a prototypic HX was also completed in which a flexible bladder material and interstitial pin configurations were tested. Additionally, a microgravity flight was conducted where three copper test articles were frozen continuously during microgravity and 2-g periods and individual water droplets were frozen during microgravity.

Hansen, Scott W.↗

Lead-Free Double-Base Propellant for the 2.75 Inch Rocket Motor

The current MK 66 2.75 inch Rocket Motor double-base propellant contains the lead-based ballistic modifier LC-12-15 to achieve the desired plateau and mesa burning rate characteristics. The use of lead compounds poses a concern for the environment and for personal safety due to the metal's toxic nature when introduced into the atmosphere by propellant manufacture, rocket motor firing, and disposal. Copper beta-resorcylate (copper 2,4-di-hydroxy-benzoate) was successfully used in propellant as a simple modifier in the mid 1970's. This and other compounds have also been mixed with lead salts to obtain more beneficial ballistic results. Synthesized complexes of lead and copper compounds soon replaced the mixtures. The complexes incorporate the lead, copper lack of organic liquids, which allows for easier propellant processing. About ten years ago, the Indian Head Division, Naval Surface Warfare Center (NSWC), initiated an effort to develop a lead-free propellant for use in missile systems. Several lead-free propellant candidate formulations were developed. About five years ago, NSWC, in conjunction with Alliant Techsystems, Radford Army Ammunition Plant, continued ballistic modifier investigations. A four component ballistic modifier system without lead for double-base propellants that provide adequate plateau and mesa burn rate characteristics was developed and patented. The ballistic modifier's system contains bismuth subsalicylate, 1.5 percent; copper salicylate, 1.0 percent, copper stannate, 0.77 percent; and carbon black, 0.1 percent. Action time and impulse data obtained through multiple static firings indicate that the new lead-free double-base propellant, while not a match for NOSIH-AA-2, will be a very suitable replacement in the 2.75 inch Rocket Motor. Accelerated aging of the double-base propellant containing the lead-free ballistic modifier showed that it had a much higher rate of stabilizer depletion than the AA-2. A comprehensive study showed that an increased rate of stabilizer depletion occurred in propellants containing monobasic copper salicylate. The study also showed that propellants containing a mixture of bismuth subsalicylate and copper salicylate, had only about one-half the stabilizer depletion rate than those with copper salicylate alone. The copper salicylate catalyzes the decomposition of nitroglycerin, which triggers a chain of events leading to the increased rate of stabilizer depletion. A program has been initiated to coat the ballistic modifier, thus isolating it from the nitroglycerin.

Magill, B. T.↗

Transforming E-Waste Into Strategic Resources: Techno-Economic Analysis of Gallium and By-products Recovery from LEDs via Bioleaching

The growing demand for gallium in optoelectronics and renewable energy applications raises concerns about supply security and production sustainability. This study evaluates the techno-economic feasibility of recovering gallium and by-products (copper and nickel) from waste GaN-based LEDs via bioleaching. A process flowsheet encompassing transportation, robotic disassembly, ball milling, bioleaching, solvent extraction/electrowinning, and refining was modeled. Based on mass balance analysis, more than 53 tons of LED waste are required annually to yield 1 kg of gallium alongside substantial copper and nickel co-products. Preliminary techno-economic analysis (TEA) shows an average total cost (ATC) of 6.84 USD/kg metal when costs are allocated by mass-weighted economic value (market price) fraction, corresponding to 6.75 USD/kg for copper, 15.91 USD/kg for nickel, and 470.95 USD/kg for gallium. For gallium, direct operational costs account for more than 70% of the cost. Monte Carlo simulations further quantify cost uncertainties under market price fluctuations. This work represents the first TEA of gallium recovery from GaN-based LEDs and highlights potential pathways for future cost reduction.

36 MATERIALS SCIENCE↗

Having a Come-Apart: Lessons Learned from Additively Manufactured Hardware Failures

NASA has been engaged with additively manufactured (AM) process and component development since the 2000’s. AM offers various technical advantages, such as enhanced hardware design complexity, part consolidation, and processing of novel alloys in addition to programmatic advantages for reduction in processing time and cost. The focus of much of the AM development at NASA has been to mature the various processes, characterize material properties, develop standards, produce demonstrator parts, and integrate AM hardware in liquid rocket engines. These aspects have been demonstrated through process and design iterations using a methodical characterization, test-fail-fix cycles, as well as application and dissemination of lessons learned. In addition to these fundamental demonstrations of the AM process and hardware development, alloys that provide performance advantages in the high temperature and high-pressure environments have been matured for use in rocket engines. These environments are challenging for any alloy and any design, and the AM process is required to fully meet the intended design requirements. The importance of proper AM process was made evident in the failure of a Laser Powder Bed Fusion (L-PBF) copper-alloy combustion chamber during a hot-fire test due to a degraded material quality resulted from an AM process issue. The hot-fire test aimed to demonstrate high duty cycle under a risk-tolerant development project, where consequences of component failure would be minimal. However, the unintentional component failure emphasized the necessity of robust material characterization and rigorous process control procedures for the safe use of AM components in critical applications. In part, such concerns motivate the AM certification approach that NASA has recently adopted in NASA-STD-6030 “Additive Manufacturing Requirements for Spaceflight Systems”. This presentation provides an overview of the previously mentioned failure, a discussion on the evaluation of the failed chamber and supplemental chambers produced at the same time, a representative material samples that included intentional build witness lines, and a summary of the key results and recommendations from the evaluations. NASA continues to approach AM processes and designs with a level of risk and acceptance of failures that is appropriate for the project objectives, with the overall goal of safe implementation of AM technology and transferring AM technology into commercial space applications. The objective of this presentation is to provide awareness to the community working critical and non-critical AM components and the lessons learned on proper implementation of AM.

Additive Manufacturing↗

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗

Through‐Plane Conductive Hydrophobic Electrodes for CO 2 Electrolysis to Ethylene

Copper catalyst gas diffusion electrodes (GDEs) have demonstrated unique electrochemical selectivity converting CO 2 to C 2 -hydrocarbons such as ethylene and ethanol but have been challenged by their hydrophobic chemical stability and internal electrical resistance leading to low energy efficiency. Carbon-supported GDEs have low electrical resistance but lack sufficient stability at industrially relevant current densities. While polymer-supported GDEs have improved hydrophobicity, they also display high in-plane electrical resistance, particularly at industrial scales. Here, in this work, we demonstrate a composite gas diffusion layer that combines hydrophobic porous polymers with an electrically conductive backbone addressing these core gas diffusion electrode (GDE) scaling challenges. We investigate the material properties of standalone porous perfluoropolyether (PFPE) polymers, including porosity and surface morphology, under varying processing conditions and then incorporate these polymers into a porous copper foam. This composite enhances the mechanical rigidity necessary for cell assembly and provides a through-plane electrical conduction path to reduce electrical resistive losses. This enhanced PFPE composite GDE displays efficient CO 2 reduction, achieving 15% ethylene energy efficiency at 100 cm 2 . These findings contribute to the development of advanced catalyst materials and electrode architectures and promote scalable strategies for electrochemical conversion of CO 2 into high-value carbon products.

Chemistry↗

Secondary electron emission characteristics of molybdenum-masked, ion-textured OFHC copper

A method for producing a uniform, highly textured surface on oxygen-free, high conductivity (OFHC) copper by ion bombardment using sputtered molybdenum as a texture-inducing masking film was developed and used to provide samples for study. The purpose was to develop a basically OFHC copper surface having very low secondary electron emission characteristics. Surfaces having low secondary electron emission are a requirement for the electrodes of very high efficiency multistage depressed collectors (MDC's). Such MDC's are used in microwave amplifier traveling wave tubes for space communications and other applications. OFHC copper is the material most commonly used for MDC electrodes because it has high thermal conductivity, it is easy to machine, and its fabrication and brazing procedures are well established. However, its untreated surface displays relatively very high levels of secondary electron emissions. Textured OFHC copper samples were tested for true secondary electron emission and relative reflected primary electron yield at primary electron beam energy levels from 200 to 2000 eV and at direct (0 deg) to oblique (60 deg) beam impingement angles. The test results for three of the samples, each of which was processed in a slightly different way, are compared with each other and with test results for a machined OFHC copper sample. Although the textured samples are not represented here as having been processed optimally, their measured secondary electron emission characteristics are significantly lower than those of the untreated OFHC copper sample over the range of conditions studied. Importantly, the relative reflected primary electron yield of one of the textured samples is conspicuously lower than that of the others. Clearly, with further development, the molybdenum-masked ion-textured OFHC copper surface will be a promising material for high-efficiency MDC electrodes.

Curren, Arthur N.↗

Friction Stir Weld Tooling Development for Application on the 2195 Al-Cu-Li Space Transportation System External Tank

Friction Stir Welding (FSW) is a new and innovative solid-state joining process which can be applied to difficult-to- weld aluminum alloys. However, the large forces involved with the process have posed a production tooling challenge. Lockheed Martin Michoud Space Systems has overcome many of these challenges on the Super Lightweight External Tank (ET) program. Utilizing Aluminum-Copper-Lithium alloy 2195 in the form of plate and extrusions, investigations of FSW process parameters have been completed. Major loading mechanisms are discussed in conjunction with deflection measurements. Since the ET program is a cryogenic application, a brief comparison of cryogenic material properties with room temperature material properties is offered for both FSW and fusion welds. Finally, a new approach to controlling the FSW process from a load perspective is introduced. Emphasis will be put on tooling development, as well as the impact of tooling design and philosophy on Friction Stir Weld success probability.

Loftus, Zachary↗

Development of low cost contacts to silicon solar cells

The results of the second phase of the program of developing low cost contacts to silicon solar cells using copper are presented. Phase 1 yielded the development of a plated Pd-Cr-Cu contact system. This process produced cells with shunting problems when they were heated to 400 C for 5 minutes. Means of stopping the identified copper diffusion which caused the shunting were investigated. A contact heat treatment study was conducted with Pd-Ag, Ci-Ag, Pd-Cu, Cu-Cr, and Ci-Ni-Cu. Nickel is shown to be an effective diffusion barrier to copper.

Tanner, D. P.↗

Design, fabrication, and performance of brazed, graphite electrode, multistage depressed collectors with 500-W, continuous wave, 4.8- to 9.6-GHz traveling-wave tubes

A small, isotropic graphite electrode, multistage depressed collector (MDC) was designed, fabricated, and evaluated in conjunction with a 500-W, continuous wave (CW), 4.8- to 9.6-GHz traveling-wave tube (TWT). The carbon electrode surfaces were used to improve the TWT overall efficiency by minimizing the secondary electron emission losses in the MDC. The design and fabrication of the brazed graphite MDC assembly are described. The brazing technique, which used copper braze filler metal, is compatible with both vacuum and the more commonly available hydrogen atmosphere brazing furnaces. The TWT and graphite electrode MCC bakeout, processing, and outgassing characteristics were evaluated and found to be comparable to TWT's equipped with copper electrode MDC's. The TWT and MDC performance was optimized for broadband CW operation at saturation. The average radiofrequency (RF), overall, and MDC efficiencies were 14.9, 46.4, and 83.6 percent, respectively, across the octave operating band. A 1500-hr CW test, conducted without the use of an appendage ion pump, showed no gas buildup and excellent stability of the electrode surfaces.

Ramins, Peter↗

Metafusion: A breakthrough in metallurgy

The Metafuse Process is a patented development in the field of thin film coatings utilizing cold fusion which results in a true inter-dispersion of dissimilar materials along a gradual transition gradient through a boundary of several hundred atomic layers. The process is performed at ambient temperatures and pressures requiring relatively little energy and creating little or no heat. The process permits a remarkable range of material combinations and joining of materials which are normally incompatible. Initial applications include titanium carbide into and onto the copper resistance welding electrodes and tungsten carbide onto the cutting edges of tool steel blades. The process is achieved through application of an RF signal of low power and is based on the theory of vacancy fusion.

Joseph, Adrian A.↗

Zero-G processing of magnets. Experiment MA-070

The magnetic compounds under study, manganese-bismuth (MnBi) copper-cobalt-cerium (Cu,Co)5Ce, are representative of magnetic alloy systems that have the potential for the development of high coercive strength and a high energy product. The samples of 50 at. % bismuth and 50 at. % manganese solidified in the low-g environment demonstrated a substantial improvement in the macroscopic chemical homogeneity. The bismuth/manganese-bismuth directionally solidified eutectic flight samples exhibited marked superior magnetic properties. Intrinsic coercive strengths in excess of 185 Koe have been measured in the low-g processed samples at 77 K. The average value of inductance was improved by 76 percent, and the energy product was improved by 57 percent. Additional results indicate that, in the near-absence of the gravitational body force, contained fluids will assume a lowest energy configuration that differs significantly from that found terrestrially.

Larson, D. J., Jr.↗

Thin film strain transducer

A strain transducer system and process for making same is disclosed wherein a beryllium-copper ring having four strain gages disposed thereon is electrically connected in Wheatstone bridge fashion to output instrumentation. Tabs are bonded to a balloon or like surface with strain on the surface causing bending of the ring and providing an electrical signal through the gages proportional to the surface strain. A figure is provided which illustrates a pattern of a one-half ring segment as placed on a sheet of beryllium-copper for chem-mill etch formation, prior to bending and welding of a pair of the segments to form a ring structure.

Rand, J. L.↗