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At least 163 records · Page 9

High-Temperature SiC Cladding End Plug Irradiation Design and HFIR Readiness

This report documents the design of a High Flux Isotope Reactor (HFIR) irradiation experiment intended to evaluate irradiation effects on the hermeticity of silicon carbide (SiC) end plug specimens under a radial fast neutron flux gradient at representative light-water reactor (LWR) temperatures of approximately 300 °C. The overarching goal of this work is to statistically evaluate SiC end plug hermeticity and mechanical properties following irradiation using the high-throughput irradiation capability discussed here. Each specimen consists of a short section of SiC fiber–reinforced SiC (SiC/SiC) tube with a single monolithic SiC end plug joined to one end. The experiment allows up to 66 specimens to be irradiated in six different stacks within a dry, sealed irradiation capsule derived from the previously developed high-temperature SiC/SiC cladding bowing experiment. The neutronics basis, thermal analysis, and HFIR readiness of the experiment are discussed in this report for two possible design cases. The first design case is based on existing approval documentation and components that are on hand and approved for use, so the experiment insertion would require only specimen receipt, specimen pre-irradiation characterization, experiment assembly, and final fabrication package approval. The second design case provides improved thermal robustness and the preferred end plug geometry but requires fabrication of a modified holder and revisions to the HFIR approval documentation, in addition to the other activities required for the first design case, before insertion.

Hott, Daniel [Oak Ridge National Laboratory (ORNL)↗

Comments on ""Contact Diffusion Interaction of Materials with Cladding''

A Russian paper by A. A. Babad-Zakhryapina contributes much to the understanding of fuel, clad interactions, and thus to nuclear thermionic technology. In that publication the basic diffusion expression is a simple one. A more general but complicated equation for this mass transport results from the present work. With appropriate assumptions, however, the new relation reduces to Babad-Zakhryapina's version.

Morris, J. F.↗

Four- and five-layer silicon-clad dielectric waveguides

Computer modeling studies conducted on four-layer silicon-clad dielectric waveguides indicate that the attenuation (alpha) and mode index (beta/K) behave as exponentially damped sinusoids as the silicon thickness is increased. The observed effect can be explained quite simply as a periodic coupling between the guided modes of the lossless structure and the lossy modes supported by the high-refractive index silicon. The attenuation and mode index are significantly altered by conductivity changes in the silicon; an amplitude modulator and an intensity modulator were proposed using these results. Predicted high attenuations in the device may be reduced significantly with a silicon dioxide buffer layer between the semiconductor and the polystyrene guide. Experimental confirmation of the predicted characteristics is still necessary. A number of thin-silicon film waveguides have been RF sputtered but attenuation measurements to verify the damped oscillatory behavior are forthcoming. Conductivity variations of the silicon should demonstrate the modulation capabilities.

Mcwright, G.↗

Fabrication and evaluation of brazed titanium-clad borsic/aluminum skin-stringer panels

A successful brazing process was developed and evaluated for fabricating full-scale titanium-clad Borsic/aluminum skin-stringer panels. A panel design was developed consisting of a hybrid composite skin reinforced with capped honeycomb-core stringers. Six panels were fabricated for inclusion in the program which included laboratory testing of panels at ambient temperatures and 533 K (500 F) and flight service evaluation on the NASA Mach 3 YF-12 airplane. All panels tested met or exceeded stringent design requirements and no deleterious effects on panel properties were detected followng flight service evaluation on the YF-12 airplane.

Bales, T. T.↗

Effect of Interfacial characteristics of metal clad polymeric substrates on electrical high frequency interconnection performance

Etched metallic conductor lines on metal clad polymeric substrates are used for electronic component interconnections. Significant signal losses are observed for microstrip conductor lines used for interconnecting high frequency devices. At these frequencies, the electronic signal travels closer to the metal-polymer interface due to the skin effect. Copper-teflon interfaces were characterized by scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) to determine the interfacial properties. Data relating roughness of the copper film to signal losses was compared to theory. Films used to enhance adhesion are found, to contribute to these losses.

Bhasin, K. B.↗