Development of qualification test program for microelectronic devices Final report, 1 Nov. 1968 - 3 Jul. 1969
Qualification test program for digital monolithic integrated circuit devices
Binelli, W. D.↗
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Design and fabrication of an analog voltage to duty cycle generator Final report
Analog voltage to duty generator design and fabrication based on four silicon integrated circuit chips in single package assembly
Source record↗
Voltage controlled monolithic oscillator Final report, Jun. 1967 - Mar. 1969
Solid state voltage controlled oscillator using two silicon integrated circuit chips and thin film resistor chip
Colvson, L. V.↗
Custom metallized multigate array, section 2 Interim technical report
Reliability engineering processes for custom metallized multigate integrated circuit array design
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Custom metallized multigate array, section 1 Interim technical report
Custom metallized multigate integrated circuit array design
Source record↗
A versatile, low cost, fabrication technique for flight hardware
Wiring technique for spacecraft electronic equipment using integrated circuits
Chernikoff, H.↗
Fast multipliers
Parallel multiplier design with carry-save scheme and constructed from series integrated circuits, discussing speed, complexity and cost
Habibi, A.↗
Complementary MOS and bipolar make it together on a single chip
Complementary metal oxide semiconductor and bipolar transistors fabrication on same integrated circuit chip by C-squared technology
Cook, R.↗
Electromagnetic simulation of microwave backscatter from the ocean surface - A feasibility study
Photochemical etching is most successful method for obtaining simulated microwave backscatter pattern from ocean surface. Process is adaptable to integrated circuit and thin film semiconductor fabrications. The attained horizontal resolution of 10 should improve with equipment refinement.
Ward, R. B.↗
Design and development of a fast scan infrared detection and measurement instrument
Infrared microscope instrument measures and plots the infrared profile of semiconductor chips, transistors and integrated circuits. Infrared analyses yields information on electrical and physical properties, enabling manufacturing improvements in semiconductor performance and reliability. Operational performance and main sections of the instrument are given.
Dostoomian, A. S.↗
Precision calibration and reference voltage source for data acquisition systems
Hybrid integrated circuit operational amplifiers, which have inherent characteristics of low quiescent power dissipation and extended operational lifetime with high reliability, are source for digital systems. Amplifiers are coupled to Zener reference diode in current control and buffer configuration.
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Nonvolatile read/write memory element - A concept
Memory, with limited number of programming cycles, is achieved by using verticle, fusible links in series with oxide breakthrough elements. Memory elements are fabricated with integrated circuit technology and are ideal for low power digital computer application.
Cricchi, J. R.↗
Television multiplexing system
System with single, standard, wideband line transmits ten or more real time TV video data displays over hard wire to recorders more than 22.5 km from source. Digital logic and integrated circuits ensure high reliability and low maintenance. System is adaptable for video sampling applications.
Simpkins, L. G.↗
Plasma Probe C, D and E, volume 2 Final engineering report
Integrated circuits for digital applications in high dc noise systems
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Feedback integrator with grounded capacitor Patent
Feedback integrating circuit with grounded capacitor for signal processing
Deboo, G. J.↗
Nondestructive testing of microtab welds
Introduction of sinusoidal signal across welded structure to determine reliability of integrated circuit connections is discussed. In-phase frequencies and quadrature frequency functions are used to evaluate weld reliability. Schematic diagram of test equipment and components is provided.
Feinstein, L.↗
Microminiature gas chromatographic column
Techniques commonly used for fabrication of integrated circuits are utilized to produce long capillary tubes for microminiature chromatographs. Method involves bonding of flat silicon plate to top of spirally grooved silicon chip to close groove and form capillary column.
Donaldson, R. W., Jr.↗
Redundancy approaches in bubble domain memories
Fabrication of integrated circuit chips to compensate for faulty memory elements is discussed. Procedure for testing chips to determine extent of redundancy and faults is described. Mathematical model to define operation is presented. Schematic circuit diagram of test equipment is provided.
Almasi, G. S.↗