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At least 1,531 records · Page 85

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NASA NTRS2001

Obstacle Detection Algorithms for Rotorcraft Navigation

In this research we addressed the problem of obstacle detection for low altitude rotorcraft flight. In particular, the problem of detecting thin wires in the presence of image clutter and noise was studied. Wires present a serious hazard to rotorcrafts. Since they are very thin, their detection early enough so that the pilot has enough time to take evasive action is difficult, as their images can be less than one or two pixels wide. After reviewing the line detection literature, an algorithm for sub-pixel edge detection proposed by Steger was identified as having good potential to solve the considered task. The algorithm was tested using a set of images synthetically generated by combining real outdoor images with computer generated wire images. The performance of the algorithm was evaluated both, at the pixel and the wire levels. It was observed that the algorithm performs well, provided that the wires are not too thin (or distant) and that some post processing is performed to remove false alarms due to clutter.

Kasturi, Rangachar↗

NASA NTRS2005

Technology That's Ready and Able to Inspect Those Cables

Attempting to locate a malfunctioning wire in a complex bundle of wires or in a cable that is concealed behind a wall is as difficult as trying to find a needle in a haystack. The result of such an effort can also be costly, time-consuming, and frustrating, whether it is the tedious process of examining cable connections for the Space Shuttle or troubleshooting a cable television hookup. Furthermore, other maintenance restrictions can compound the effort required to locate and repair a particular wiring problem. For example, on the Space Shuttle, once a repair is completed, all systems that have a wire passing through any of the connectors that were disconnected during troubleshooting are affected and, therefore, must undergo retesting, an arduous task that is completely unrelated to the original problem. In an effort to streamline wire inspection and maintenance, two contractors supporting NASA's Kennedy Space Center invented the Standing Wave Reflectometer (SWR) in 1999. In doing so, they leveraged technology that was first developed to detect problems that could lead to aircraft accidents, such as the one that resulted in the catastrophic failure of TWA flight 800 in 1996. The SWR performs a non-intrusive inspection that verifies the condition of electrical power and signal-distribution systems inside the Space Shuttle orbiters. Such testing reduces processing delays and ensures safe operation of these systems.

Source record↗

NASA NTRS2006

Electrical Arc Ignition Testing of Spacesuit Materials

A viewgraph presentation on electrical arc ignition testing of spacesuit materials is shown. The topics include: 1) Background; 2) Test Objectives; 3) Test Sample Materials; 4) Test Methods; 5) Scratch Test Objectives; 6) Cotton Scratch Test Video; 7) Scratch Test Results; 8) Entire Date Plot; 9) Closeup Data Plot; 10) Scratch Test Problems; 11) Poke Test Objectives; 12) Poke Test Results; 13) Poke Test Problems; 14) Wire-break Test Objectives; 15) Cotton Wire-Break Test Video; 16) High Speed Cotton Wire-break Test Video; 17) Typical Data Plot; 18) Closeup Data Plot; 19) Wire-break Test Results; 20) Wire-break Tests vs. Scratch Tests; 21) Urethane-coated Nylon; and 22) Moleskin.

Smith, Sarah↗

NASA NTRS2007

"Fly-by-Wireless": A Revolution in Aerospace Vehicle Architecture for Instrumentation and Control

Aerospace vehicle programs have always counted on the cables and connectors to provide power, grounding, data and time synchronization throughout a vehicle's life-cycle. Even with numerous improvements, wiring and connector problems and sensors continue to be key failure points, causing many hours of troubleshooting and replacement. Costly flight delays have been precipitated by the need to troubleshoot cables/connections, and/or repair a sensor. Wiring continues to be too expensive to remove once it is installed, even with the weight penalties. Miles of test instrumentation and low flight sensor wires still plague the aerospace industry. New technology options for data connectivity, processing and micro/nano manufacturing are making it possible to retrofit existing vehicles, like the Space Shuttle. New vehicles can now develop architectures that provide for and take advantage of alternatives to wired connectivity. This project motivates the aerospace industry and technology providers to establish: (1) A new emphasis for system engineering approaches to reduce cables and connectors. (2) Provisions for modularity and accessibility in the vehicle architecture. (3) A set of technologies that support alternatives to wired connectivity.

Studor, George↗

NASA NTRS1991

Large constraint length high speed viterbi decoder based on a modular hierarchial decomposition of the deBruijn graph

A method of formulating and packaging decision-making elements into a long constraint length Viterbi decoder which involves formulating the decision-making processors as individual Viterbi butterfly processors that are interconnected in a deBruijn graph configuration. A fully distributed architecture, which achieves high decoding speeds, is made feasible by novel wiring and partitioning of the state diagram. This partitioning defines universal modules, which can be used to build any size decoder, such that a large number of wires is contained inside each module, and a small number of wires is needed to connect modules. The total system is modular and hierarchical, and it implements a large proportion of the required wiring internally within modules and may include some external wiring to fully complete the deBruijn graph. pg,14.

Collins, Oliver↗

NASA NTRS1985

Trace water sensor

A solid electrolytic type hygrometer is described, which operates with high reliability while providing rapid and sensitive response. A gold foil electrode (16) is wrapped about a hollow glass cylinder (18), a sheet (12) of hygroscopic-electrolytic material is wrapped about the foil, and a wire (14) is wound around the outside of the electrolytic sheet. Moisture passing between wire turns can be absorbed by the electrolytic material (12), and then dissociated by current passed by the electrodes (14, 16) through the electrolytic material. The cylinder has a slit (20) extending along its length, to allow resilient expansion to press the sheet of electrolytic material firmly against the electrodes. The wire turns lie against one another to cause rapid dissociation of moisture throughout the electrolytic material. Additional guard wires (42,44, FIG. 2) lie at opposite ends of the electrolytic sheet, and currents pass through them to avoid moisture buildup at the ends of the main wire coil. The electrical current through the sheet or membrane is proportional to the partial pressure of the water-vapor.

Stephens, James B.↗

NASA NTRS2007

Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

The advance of new detector technologies combined with enhanced fabrication methods has resulted in an increase in development of large format arrays. The next generation of scientific instruments will utilize detectors containing hundreds to thousands of elements providing a more efficient means to conduct large area sky surveys. Some notable detectors include a 32x32 x-ray microcalorimeter for Constellation-X, an infrared bolometer called SAFIRE to fly on the airborne observatory SOFIA, and the sub-millimeter bolometer SCUBA-2 to be deployed at the JCMT which will use more than 10,000 elements for two colors, each color using four 32x40 arrays. Of these detectors, SCUBA-2 is farthest along in development and uses indium hybridization to multiplexers for readout of the large number of elements, a technology that will be required to enable the next generation of large format arrays. Our current efforts in working toward large format arrays have produced GISMO, the Goddard IRAM Superconducting 2-Millimeter observer. GISMO is a far infrared instrument to be field tested later this year at the IRAM 30 meter telescope in Spain. GISMO utilizes transition edge sensor (TES) technology in an 8x16 filled array format that allows for typical fan-out wiring and wire-bonding to four 1x32 NIST multiplexers. GISMO'S electrical wiring is routed along the tops of 30 micron walls which also serve as the mechanical framework for the array. This architecture works well for the 128 element array, but is approaching the limit for routing the necessary wires along the surface while maintaining a high fill factor. Larger format arrays will benefit greatly from making electrical connections through the wafer to the backside, where they can be hybridized to a read-out substrate tailored to handling the wiring scheme. The next generation array we are developing is a 32x40 element array on a pitch of 1135 microns that conforms to the NIST multiplexer, already developed for the SCUBA-2 instrument This architecture will utilize electrical connections that route from the TES to the support frame and through the wafer. The detector chip will then be hybridized to the NIST multiplexer via indium bump bonding. In our development scheme we are using substrates that allow for diagnostic testing of electrical continuity across the entire array and we are testing our process to minimize or eliminate any contact resistance at metal interfaces. Our goal is hybridizing a fully functional 32x40 array of TES bolometers to a NIST multiplexer. The following work presents our current progress toward enabling this technology.

Miller, Timothy M.↗

NASA NTRS2008

Coaxial Electric Heaters

Coaxial electric heaters have been conceived for use in highly sensitive instruments in which there are requirements for compact heaters but stray magnetic fields associated with heater electric currents would adversely affect operation. Such instruments include atomic clocks and magnetometers that utilize heated atomic-sample cells, wherein stray magnetic fields at picotesla levels could introduce systematic errors into instrument readings. A coaxial electric heater is essentially an axisymmetric coaxial cable, the outer conductor of which is deliberately made highly electrically resistive so that it can serve as a heating element. As in the cases of other axisymmetric coaxial cables, the equal magnitude electric currents flowing in opposite directions along the inner and outer conductors give rise to zero net magnetic field outside the outer conductor. Hence, a coaxial electric heater can be placed near an atomic-sample cell or other sensitive device. A coaxial electric heater can be fabricated from an insulated copper wire, the copper core of which serves as the inner conductor. For example, in one approach, the insulated wire is dipped in a colloidal graphite emulsion, then the emulsion-coated wire is dried to form a thin, uniform, highly electrically resistive film that serves as the outer conductor. Then the film is coated with a protective layer of high-temperature epoxy except at the end to be electrically connected to the power supply. Next, the insulation is stripped from the wire at that end. Finally, electrical leads from the heater power supply are attached to the exposed portions of the wire and the resistive film. The resistance of the graphite film can be tailored via its thickness. Alternatively, the film can be made from an electrically conductive paint, other than a colloidal graphite emulsion, chosen to impart the desired resistance. Yet another alternative is to tailor the resistance of a graphite film by exploiting the fact that its resistance can be changed permanently within about 10 percent by heating it to a temperature above 300 C. A coaxial heater, with electrical leads attached, that has been bent into an almost full circle for edge heating of a circular window is shown. (In the specific application, there is a requirement for a heated cell window, through which an optical beam enters the cell.)

Strekalov, Dmitry↗

NASA NTRS2008

Sixty-four-Channel Inline Cable Tester

Faults in wiring are a serious concern for the aerospace and aeronautics (commercial, military, and civil) industries. A number of accidents have occurred because faulty wiring created shorts or opens that resulted in the loss of control of the aircraft or because arcing led to fires and explosions. Some of these accidents have resulted in the massive loss of lives (such as in the TWA Flight 800 accident). Circuits on the Space Shuttle have also failed because of faulty insulation on wiring. STS-93 lost power when a primary power circuit in one engine failed and a second engine had a backup power circuit fault. Cables are usually tested on the ground after the crew reports a fault encountered during flight. Often such failures result from vibration and cannot be replicated while the aircraft is stationary. It is therefore important to monitor faults while the aircraft is in operation, when cables are more likely to fail. Work is in progress to develop a cable fault tester capable of monitoring up to 64 individual wires simultaneously. Faults can be monitored either inline or offline. In the inline mode of operation, the monitoring is performed without disturbing the normal operation of the wires under test. That is, the operations are performed unintrusively and are essentially undetectable for the test signal levels are below the noise floor. A cable can be monitored several times per second in the offline mode and once a second in the inline mode. The 64-channel inline cable tester not only detects the occurrence of a fault, but also determines the type of fault (short/open) and the location of the fault. This will enable the detection of intermittent faults that can be repaired before they become serious problems.

Source record↗

NASA NTRS2006

Magnetic-Field-Response Measurement-Acquisition System

A measurement-acquisition system uses magnetic fields to power sensors and to acquire measurements from sensors. The system alleviates many shortcomings of traditional measurement-acquisition systems, which include a finite number of measurement channels, weight penalty associated with wires, use limited to a single type of measurement, wire degradation due to wear or chemical decay, and the logistics needed to add new sensors. Eliminating wiring for acquiring measurements can alleviate potential hazards associated with wires, such as damaged wires becoming ignition sources due to arcing. The sensors are designed as electrically passive inductive-capacitive or passive inductive-capacitive-resistive circuits that produce magnetic-field-responses. One or more electrical parameters (inductance, capacitance, and resistance) of each sensor can be variable and corresponds to a measured physical state of interest. The magnetic-field- response attributes (frequency, amplitude, and bandwidth) of the inductor correspond to the states of physical properties for which each sensor measures. For each sensor, the measurement-acquisition system produces a series of increasing magnetic-field harmonics within a frequency range dedicated to that sensor. For each harmonic, an antenna electrically coupled to an oscillating current (the frequency of which is that of the harmonic) produces an oscillating magnetic field. Faraday induction via the harmonic magnetic fields produces an electromotive force and therefore a current in the sensor. Once electrically active, the sensor produces its own harmonic magnetic field as the inductor stores and releases magnetic energy. The antenna of the measurement- acquisition system is switched from a transmitting to a receiving mode to acquire the magnetic-field response of the sensor. The rectified amplitude of the received response is compared to previous responses to prior transmitted harmonics, to ascertain if the measurement system has detected a response inflection. The "transmit-receive-compare" of sequential harmonics is repeated until the inflection is identified. The harmonic producing the amplitude inflection is the sensor resonant frequency. Resonant frequency and response amplitude are stored and then correlated to calibration data.

Woodward, Stanley E.↗

NASA NTRS2010

The Application of Ultrasonic Inspection to Crimped Electrical Connections

The development of a new ultrasonic measurement technique to quantitatively assess wire crimp terminations is discussed. The development of a prototype instrument, based on a modified, commercially available, crimp tool, is demonstrated for applying this technique when wire crimps are installed. The crimp tool has three separate crimping locations that accommodate the three different ferrule diameters. The crimp tool in this study is capable of crimping wire diameters ranging from 12 to 26 American Wire Gauge (AWG). A transducer design is presented that allows for interrogation of each of the three crimp locations on the crimp tool without reconfiguring the device. An analysis methodology, based on transmitted ultrasonic energy and timing of the first received pulse is shown to correlate to both crimp location in the tool and the AWG of the crimp/ferrule combination. The detectability of a number of the crimp failure pathologies, such as missing strands, partially inserted wires and incomplete crimp compression, is discussed. A wave propagation model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process.

Cramer, K. Elliott↗

NASA NTRS2010

Polymer Chemistry

This viewgraph presentation describes new technologies in polymer and material chemistry that benefits NASA programs and missions. The topics include: 1) What are Polymers?; 2) History of Polymer Chemistry; 3) Composites/Materials Development at KSC; 4) Why Wiring; 5) Next Generation Wiring Materials; 6) Wire System Materials and Integration; 7) Self-Healing Wire Repair; 8) Smart Wiring Summary; 9) Fire and Polymers; 10) Aerogel Technology; 11) Aerogel Composites; 12) Aerogels for Oil Remediation; 13) KSC's Solution; 14) Chemochromic Hydrogen Sensors; 15) STS-130 and 131 Operations; 16) HyperPigment; 17) Antimicrobial Materials; 18) Conductive Inks Formulations for Multiple Applications; and 19) Testing and Processing Equipment.

Williams, Martha↗

NASA NTRS2011

High field superconducting magnets

A superconducting magnet includes an insulating layer disposed about the surface of a mandrel; a superconducting wire wound in adjacent turns about the mandrel to form the superconducting magnet, wherein the superconducting wire is in thermal communication with the mandrel, and the superconducting magnet has a field-to-current ratio equal to or greater than 1.1 Tesla per Ampere; a thermally conductive potting material configured to fill interstices between the adjacent turns, wherein the thermally conductive potting material and the superconducting wire provide a path for dissipation of heat; and a voltage limiting device disposed across each end of the superconducting wire, wherein the voltage limiting device is configured to prevent a voltage excursion across the superconducting wire during quench of the superconducting magnet.

Hait, Thomas P.↗

NASA NTRS2011

Nanogenerator comprising piezoelectric semiconducting nanostructures and Schottky conductive contacts

A semiconducting device includes a substrate, a piezoelectric wire, a structure, a first electrode and a second electrode. The piezoelectric wire has a first end and an opposite second end and is disposed on the substrate. The structure causes the piezoelectric wire to bend in a predetermined manner between the first end and the second end so that the piezoelectric wire enters a first semiconducting state. The first electrode is coupled to the first end and the second electrode is coupled to the second end so that when the piezoelectric wire is in the first semiconducting state, an electrical characteristic will be exhibited between the first electrode and the second electrode.

Wang, Zhong L.↗

NASA NTRS2003

Fabricating Composite-Material Structures Containing SMA Ribbons

An improved method of designing and fabricating laminated composite-material (matrix/fiber) structures containing embedded shape-memory-alloy (SMA) actuators has been devised. Structures made by this method have repeatable, predictable properties, and fabrication processes can readily be automated. Such structures, denoted as shape-memory-alloy hybrid composite (SMAHC) structures, have been investigated for their potential to satisfy requirements to control the shapes or thermoelastic responses of themselves or of other structures into which they might be incorporated, or to control noise and vibrations. Much of the prior work on SMAHC structures has involved the use SMA wires embedded within matrices or within sleeves through parent structures. The disadvantages of using SMA wires as the embedded actuators include (1) complexity of fabrication procedures because of the relatively large numbers of actuators usually needed; (2) sensitivity to actuator/ matrix interface flaws because voids can be of significant size, relative to wires; (3) relatively high rates of breakage of actuators during curing of matrix materials because of sensitivity to stress concentrations at mechanical restraints; and (4) difficulty of achieving desirable overall volume fractions of SMA wires when trying to optimize the integration of the wires by placing them in selected layers only.

Turner, Travis L.↗

NASA NTRS2003

Eroding Potentiometers

Eroding potentiometers have been devised for measuring the time-dependent positions of char fronts advancing through layers of insulating material subject to intense heating from one side. In the original application, the material layers of interest are thermal insulators in rocket motors and the heat comes from firing of the motors, but the principle of operation is equally applicable to other insulating materials subject to intense heating (e.g., ablative fire-retardant materials). Measuring the thickness decrement of propellant (in hybrid motors in particular) is another possible application of this transducer. Telemetry informs mission control of the propellant left after each burn. An eroding potentiometer could be characterized, more precisely, as an eroding two-wire resistor. It includes a twisted pair of thin, insulated wires oriented along the thickness of, and embedded in, the layer of thermal-insulation material to be tested (see figure). The electrical insulation material on the wires should be one for which the charring temperature is about the same as (or perhaps slightly less than) that of the thermal- insulation material to be tested. In the original rocket-motor application, the wires have a diameter of 0.003 in. (.0.08 mm), are made of manganin, and are coated with polyimide for electrical insulation. Outside the thermal insulation on the cold side, the wire leads are connected to a Wheatstone bridge circuit for measurement of electrical resistance change.

Eggett, Mark↗

NASA NTRS2003

Integrated Electrode Arrays for Neuro-Prosthetic Implants

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Brandon, Erik↗

NASA NTRS2003

Compact Interconnection Networks Based on Quantum Dots

Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary-signal wires described in the cited prior article. One of these advances would be the development of QCA-based wires capable of bidirectional transmission of signals. The other advance would be the development of QCA circuits capable of high-impedance state outputs. The high-impedance states would be utilized along with the 0- and 1-state outputs of QCA.

Fijany, Amir↗