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At least 1,513 records · Page 84

Rapid Corner Detection Using FPGAs

In order to perform precision landings for space missions, a control system must be accurate to within ten meters. Feature detection applied against images taken during descent and correlated against the provided base image is computationally expensive and requires tens of seconds of processing time to do just one image while the goal is to process multiple images per second. To solve this problem, this algorithm takes that processing load from the central processing unit (CPU) and gives it to a reconfigurable field programmable gate array (FPGA), which is able to compute data in parallel at very high clock speeds. The workload of the processor then becomes simpler; to read an image from a camera, it is transferred into the FPGA, and the results are read back from the FPGA. The Harris Corner Detector uses the determinant and trace to find a corner score, with each step of the computation occurring on independent clock cycles. Essentially, the image is converted into an x and y derivative map. Once three lines of pixel information have been queued up, valid pixel derivatives are clocked into the product and averaging phase of the pipeline. Each x and y derivative is squared against itself, as well as the product of the ix and iy derivative, and each value is stored in a WxN size buffer, where W represents the size of the integration window and N is the width of the image. In this particular case, a window size of 5 was chosen, and the image is 640 480. Over a WxN size window, an equidistance Gaussian is applied (to bring out the stronger corners), and then each value in the entire window is summed and stored. The required components of the equation are in place, and it is just a matter of taking the determinant and trace. It should be noted that the trace is being weighted by a constant k, a value that is found empirically to be within 0.04 to 0.15 (and in this implementation is 0.05). The constant k determines the number of corners available to be compared against a threshold sigma to mark a valid corner. After a fixed delay from when the first pixel is clocked in (to fill the pipeline), a score is achieved after each successive clock. This score corresponds with an (x,y) location within the image. If the score is higher than the predetermined threshold sigma, then a flag is set high and the location is recorded.

Morfopoulos, Arin C.↗

Enhancement of the MODIS Daily Snow Albedo Product

The MODIS daily snow albedo product is a data layer in the MOD10A1 snow-cover product that includes snow-covered area and fractional snow cover as well as quality information and other metadata. It was developed to augment the MODIS BRDF/Albedo algorithm (MCD43) that provides 16-day maps of albedo globally at 500-m resolution. But many modelers require daily snow albedo, especially during the snowmelt season when the snow albedo is changing rapidly. Many models have an unrealistic snow albedo feedback in both estimated albedo and change in albedo over the seasonal cycle context, Rapid changes in snow cover extent or brightness challenge the MCD43 algorithm; over a 16-day period, MCD43 determines whether the majority of clear observations was snow-covered or snow-free then only calculates albedo for the majority condition. Thus changes in snow albedo and snow cover are not portrayed accurately during times of rapid change, therefore the current MCD43 product is not ideal for snow work. The MODIS daily snow albedo from the MOD10 product provides more frequent, though less robust maps for pixels defined as "snow" by the MODIS snow-cover algorithm. Though useful, the daily snow albedo product can be improved using a daily version of the MCD43 product as described in this paper. There are important limitations to the MOD10A1 daily snow albedo product, some of which can be mitigated. Utilizing the appropriate per-pixel Bidirectional Reflectance Distribution Functions (BRDFs) can be problematic, and correction for anisotropic scattering must be included. The BRDF describes how the reflectance varies with view and illumination geometry. Also, narrow-to-broadband conversion specific for snow on different surfaces must be calculated and this can be difficult. In consideration of these limitations of MOD10A1, we are planning to improve the daily snow albedo algorithm by coupling the periodic per-pixel snow albedo from MCD43, with daily surface ref|outanoom, In this paper, we compare a daily version of MCD43B3 with the daily albedo from MOD10A1. and MCD43B3 with a 16-day average of MOD10A1, over Greenland. We also discuss some near-future planned enhancements to MOD10A1.

Hall, Dorothy K.↗

Rapid Response Flood Water Mapping

Since the beginning of operation of the MODIS instrument on the NASA Terra satellite at the end of 1999, an exceptionally useful sensor and public data stream have been available for many applications including the rapid and precise characterization of terrestrial surface water changes. One practical application of such capability is the near-real time mapping of river flood inundation. We have developed a surface water mapping methodology based on using only bands 1 (620-672 nm) and 2 (841-890 nm). These are the two bands at 250 m, and the use of only these bands maximizes the resulting map detail. In this regard, most water bodies are strong absorbers of incoming solar radiation at the band 2 wavelength: it could be used alone, via a thresholding procedure, to separate water (dark, low radiance or reflectance pixels) from land (much brighter pixels) (1, 2). Some previous water mapping procedures have in fact used such single band data from this and other sensors that include similar wavelength channels. Adding the second channel of data (band 1), however, allows a band ratio approach which permits sediment-laden water, often relatively light at band 2 wavelengths, to still be discriminated, and, as well, provides some removal of error by reducing the number of cloud shadow pixels that would otherwise be misclassified as water.

Fritz Policelli↗

CMOS Imager Has Better Cross-Talk and Full-Well Performance

A complementary metal oxide/semiconductor (CMOS) image detector now undergoing development is designed to exhibit less cross-talk and greater full-well capacity than do prior CMOS image detectors of the same type. Imagers of the type in question are designed to operate from low-voltage power supplies and are fabricated by processes that yield device features having dimensions in the deep submicron range. Because of the use of low supply potentials, maximum internal electric fields and depletion widths are correspondingly limited. In turn, these limitations are responsible for increases in cross-talk and decreases in charge-handling capacities. Moreover, for small pixels, lateral depletion cannot be extended. These adverse effects are even more accentuated in a back-illuminated CMOS imager, in which photogenerated charge carriers must travel across the entire thickness of the device. The figure shows a partial cross section of the structure in the device layer of the present developmental CMOS imager. (In a practical imager, the device layer would sit atop either a heavily doped silicon substrate or a thin silicon oxide layer on a silicon substrate, not shown here.) The imager chip is divided into two areas: area C, which contains readout circuits and other electronic circuits; and area I, which contains the imaging (photodetector and photogenerated-charge-collecting) pixel structures. Areas C and I are electrically isolated from each other by means of a trench filled with silicon oxide. The electrical isolation between areas C and I makes it possible to apply different supply potentials to these areas, thereby enabling optimization of the supply potential and associated design features for each area. More specifically, metal oxide semiconductor field-effect transistors (MOSFETs) that are typically included in CMOS imagers now reside in area C and can remain unchanged from established designs and operated at supply potentials prescribed for those designs, while the dopings and the lower supply potentials in area I can be tailored to optimize imager performance. In area I, the device layer includes an n+ -doped silicon layer on which is grown an n-doped silicon layer. A p-doped silicon layer is grown on top of the n -doped layer. The total imaging device thickness is the sum of the thickness of the n+, n, and p layers. A pixel photodiode is formed between a surface n+ implant, a p implant underneath it, the aforementioned p layer, and the n and n+ layers. Adjacent to the diode is a gate for transferring photogenerated charges out of the photodiode and into a floating diffusion formed by an implanted p+ layer on an implanted n-doped region. Metal contact pads are added to the back-side for providing back-side bias.

Pain, Bedabrata↗

Simulation and Measurement of Absorbed Dose from 137 Cs Gammas Using a Si Timepix Detector

The TimePix readout chip is a hybrid pixel detector with over 65k independent pixel elements. Each pixel contains its own circuitry for charge collection, counting logic, and readout. When coupled with a Silicon detector layer, the Timepix chip is capable of measuring the charge, and thus energy, deposited in the Silicon. Measurements using a NIST traceable 137Cs gamma source have been made at Johnson Space Center using such a Si Timepix detector, and this data is compared to simulations of energy deposition in the Si layer carried out using FLUKA.

Stoffle, Nicholas↗

Study of the Dependence on Magnetic Field and Bias Voltage of an AC-Biased TES Microcalorimeter

At SRON we are studying the performance of a Goddard Space Flight Center single pixel TES microcalorimeter operated in the AC bias configuration. For x-ray photons at 6keV the AC biased pixel shows a best energy resolution of 3.7eV, which is about a factor of 2 worse than the energy resolution observed in identical DC-biased pixels. To better understand the reasons of this discrepancy, we investigated the detector performance as a function of temperature, bias working point and applied magnetic field. A strong periodic dependence of the detector noise on the TES AC bias voltage is measured. We discuss the results in the framework of the recent weak-link behaviour observed inTES microcalorimeters.

Bandler, Simon↗

PixelLearn

PixelLearn is an integrated user-interface computer program for classifying pixels in scientific images. Heretofore, training a machine-learning algorithm to classify pixels in images has been tedious and difficult. PixelLearn provides a graphical user interface that makes it faster and more intuitive, leading to more interactive exploration of image data sets. PixelLearn also provides image-enhancement controls to make it easier to see subtle details in images. PixelLearn opens images or sets of images in a variety of common scientific file formats and enables the user to interact with several supervised or unsupervised machine-learning pixel-classifying algorithms while the user continues to browse through the images. The machinelearning algorithms in PixelLearn use advanced clustering and classification methods that enable accuracy much higher than is achievable by most other software previously available for this purpose. PixelLearn is written in portable C++ and runs natively on computers running Linux, Windows, or Mac OS X.

Mazzoni, Dominic↗

Advanced Three-Dimensional Display System

A desktop-scale, computer-controlled display system, initially developed for NASA and now known as the VolumeViewer(TradeMark), generates three-dimensional (3D) images of 3D objects in a display volume. This system differs fundamentally from stereoscopic and holographic display systems: The images generated by this system are truly 3D in that they can be viewed from almost any angle, without the aid of special eyeglasses. It is possible to walk around the system while gazing at its display volume to see a displayed object from a changing perspective, and multiple observers standing at different positions around the display can view the object simultaneously from their individual perspectives, as though the displayed object were a real 3D object. At the time of writing this article, only partial information on the design and principle of operation of the system was available. It is known that the system includes a high-speed, silicon-backplane, ferroelectric-liquid-crystal spatial light modulator (SLM), multiple high-power lasers for projecting images in multiple colors, a rotating helix that serves as a moving screen for displaying voxels [volume cells or volume elements, in analogy to pixels (picture cells or picture elements) in two-dimensional (2D) images], and a host computer. The rotating helix and its motor drive are the only moving parts. Under control by the host computer, a stream of 2D image patterns is generated on the SLM and projected through optics onto the surface of the rotating helix. The system utilizes a parallel pixel/voxel-addressing scheme: All the pixels of the 2D pattern on the SLM are addressed simultaneously by laser beams. This parallel addressing scheme overcomes the difficulty of achieving both high resolution and a high frame rate in a raster scanning or serial addressing scheme. It has been reported that the structure of the system is simple and easy to build, that the optical design and alignment are not difficult, and that the system can be built by use of commercial off-the-shelf products. A prototype of the system displays an image of 1,024 by 768 by 170 (=133,693,440) voxels. In future designs, the resolution could be increased. The maximum number of voxels that can be generated depends upon the spatial resolution of SLM and the speed of rotation of the helix. For example, one could use an available SLM that has 1,024 by 1,024 pixels. Incidentally, this SLM is capable of operation at a switching speed of 300,000 frames per second. Implementation of full-color displays in future versions of the system would be straightforward: One could use three SLMs for red, green, and blue, respectively, and the colors of the voxels could be automatically controlled. An optically simpler alternative would be to use a single red/green/ blue light projector and synchronize the projection of each color with the generation of patterns for that color on a single SLM.

Geng, Jason↗

Hybrid UV Imager Containing Face-Up AlGaN/GaN Photodiodes

A proposed hybrid ultraviolet (UV) image sensor would comprise a planar membrane array of face-up AlGaN/GaN photodiodes integrated with a complementary metal oxide/semiconductor (CMOS) readout-circuit chip. Each pixel in the hybrid image sensor would contain a UV photodiode on the AlGaN/GaN membrane, metal oxide/semiconductor field-effect transistor (MOSFET) readout circuitry on the CMOS chip underneath the photodiode, and a metal via connection between the photodiode and the readout circuitry (see figure). The proposed sensor design would offer all the advantages of comparable prior CMOS active-pixel sensors and AlGaN UV detectors while overcoming some of the limitations of prior (AlGaN/sapphire)/CMOS hybrid image sensors that have been designed and fabricated according to the methodology of flip-chip integration. AlGaN is a nearly ideal UV-detector material because its bandgap is wide and adjustable and it offers the potential to attain extremely low dark current. Integration of AlGaN with CMOS is necessary because at present there are no practical means of realizing readout circuitry in the AlGaN/GaN material system, whereas the means of realizing readout circuitry in CMOS are well established. In one variant of the flip-chip approach to integration, an AlGaN chip on a sapphire substrate is inverted (flipped) and then bump-bonded to a CMOS readout circuit chip; this variant results in poor quantum efficiency. In another variant of the flip-chip approach, an AlGaN chip on a crystalline AlN substrate would be bonded to a CMOS readout circuit chip; this variant is expected to result in narrow spectral response, which would be undesirable in many applications. Two other major disadvantages of flip-chip integration are large pixel size (a consequence of the need to devote sufficient area to each bump bond) and severe restriction on the photodetector structure. The membrane array of AlGaN/GaN photodiodes and the CMOS readout circuit for the proposed image sensor would be fabricated separately.

Zheng, Xinyu↗

Coastal Research Imaging Spectrometer

The Coastal Research Imaging Spectrometer (CRIS) is an airborne remote sensing system designed specifically for research on the physical, chemical, and biological characteristics of coastal waters. The CRIS includes a visible-light hyperspectral imaging subsystem for measuring the color of water, which contains information on the biota, sediment, and nutrient contents of the water. The CRIS also includes an infrared imaging subsystem, which provides information on the temperature of the water. The combination of measurements enables investigation of biological effects of both natural and artificial flows of water from land into the ocean, including diffuse and point-source flows that may contain biological and/or chemical pollutants. Temperature is an important element of such measurements because temperature contrasts can often be used to distinguish among flows from different sources: for example, a sewage outflow could manifest itself in spectral images as a local high-temperature anomaly. Both the visible and infrared subsystems scan in pushbroom mode: that is, an aircraft carrying the system moves along a ground track, the system is aimed downward, and image data are acquired in across-track linear arrays of pixels. Both subsystems operate at a frame rate of 30 Hz. The infrared and visible-light optics are adjusted so that both subsystems are aimed at the same moving swath, which has across-track angular width of 15 . Data from the infrared and visible imaging subsystems are stored in the same file along with aircraft- position data acquired by a Global Positioning System receiver. The combination of the three sets of data is used to construct infrared and hyperspectral maps of scanned areas (see figure). The visible subsystem is based on a grating spectrograph and a rapid-readout charge-coupled-device camera. Images of the swatch are acquired in 256 spectral bands at wavelengths from 400 to 800 nm. The infrared subsystem, which is sensitive in a single wavelength band of 8 to 10 m, is based on a focal-plane array of HgCdTe photodetectors that are cooled to an operating temperature of 77 K by use of a closed-Stirling-cycle mechanical cooler. The nonuniformities of the HgCdTe photodetector array are small enough that the raw pixel data from the infrared subsystem can be used to recognize temperature differences on the order of 1 C. By use of a built-in blackbody calibration source that can be switched into the field of view, one can obtain bias and gain offset terms for individual pixels, making it possible to offset the effects of nonuniformities sufficiently to enable the measurement of temperature differences as small as 0.1 C.

Lucey, Paul G.↗

Rapid Chemometric Filtering of Spectral Data

A method of rapid, programmable filtering of spectral transmittance, reflectance, or fluorescence data to measure the concentrations of chemical species has been proposed. By programmable is meant that a variety of spectral analyses can readily be performed and modified in software, firmware, and/or electronic hardware, without need to change optical filters or other optical hardware of the associated spectrometers. The method is intended to enable real-time identification of single or multiple target chemical species in applications that involve high-throughput screening of multiple samples. Examples of such applications include (but are not limited to) combinatorial chemistry, flow cytometry, bead assays, testing drugs, remote sensing, and identification of targets. The basic concept of the proposed method is to perform real-time crosscorrelations of a measured spectrum with one or more analytical function(s) of wavelength that could be, for example, the known spectra of target species. Assuming that measured spectral intensities are proportional to concentrations of target species plus background spectral intensities, then after subtraction of background levels, it should be possible to determine target species concentrations from cross-correlation values. Of course, the problem of determining the concentrations is more complex when spectra of different species overlap, but the problem can be solved by use of multiple analytical functions in combination with computational techniques that have been developed previously for analyses of this type. The method is applicable to the design and operation of a spectrometer in which spectrally dispersed light is measured by means of an active-pixel sensor (APS) array. The row or column dimension of such an array is generally chosen to be aligned along the spectral-dispersion dimension, so that each pixel intercepts light in a narrow spectral band centered on a wavelength that is a known function of the pixel position. The proposed method admits of two hardware implementations for computing cross-correlations in real time.

Beaman, Gregory↗

Reconciling Simulated and Observed Views of Clouds: MODIS, ISCCP, and the Limits or Instrument Simulators

The properties of clouds that may be observed by satellite instruments, such as optical depth and cloud top pressure, are only loosely related to the way clouds m-e represented in models of the atmosphere. One way to bridge this gap is through "instrument simulators," diagnostic tools that map the model representation to synthetic observations so that differences between simulator output and observations can be interpreted unambiguously as model error. But simulators may themselves be restricted by limited information available from the host model or by internal assumptions. This paper considers the extent to which instrument simulators are able to capture essential differences between MODIS and ISCCP, two similar but independent estimates of cloud properties. The authors review the measurements and algorithms underlying these two cloud climatologies, introduce a MODIS simulator, and detail data sets developed for comparison with global models using ISCCP and MODIS simulators, In nature MODIS observes less mid-level doudines!> than ISCCP, consistent with the different methods used to determine cloud top pressure; aspects of this difference are reproduced by the simulators running in a climate modeL But stark differences between MODIS and ISCCP observations of total cloudiness and the distribution of cloud optical thickness can be traced to different approaches to marginal pixels, which MODIS excludes and ISCCP treats as homogeneous. These pixels, which likely contain broken clouds, cover about 15 k of the planet and contain almost all of the optically thinnest clouds observed by either instrument. Instrument simulators can not reproduce these differences because the host model does not consider unresolved spatial scales and so can not produce broken pixels. Nonetheless, MODIS and ISCCP observation are consistent for all but the optically-thinnest clouds, and models can be robustly evaluated using instrument simulators by excluding ambiguous observations.

Ackerman, Steven A.↗

The Preflight Calibration of the Thermal Infrared Sensor (TIRS) on the Landsat Data Continuity Mission

The preflight calibration testing of TIRS evaluates the performance of the instrument at the component, subsystem and system level, The overall objective is to provide an instrument that is well calibrated and well characterized with specification compliant data that will ensure the data continuity of Landsat from the previous missions to the LDCM, The TIRS flight build unit and the flight instrument were assessed through a series of calibration tests at NASA Goddard Space Flight Center. Instrument-level requirements played a strong role in defining the test equipment and procedures used for the calibration in the thermal/vacuum chamber. The calibration ground support equipment (CGSE), manufactured by MEI and ATK Corporation, was used to measure the optical, radiometric and geometric characteristics of TIRS, The CGSE operates in three test configurations: GeoRad (geometric, radiometric and spatial), flood source and spectral, TIRS was evaluated though the following tests: bright target recovery, radiometry, spectral response, spatial shape, scatter, stray light, focus, and uniformity, Data were obtained for the instrument and various subsystems under conditions simulating those on orbit In the spectral configuration, a monochromator system with a blackbody source is used for in-band and out-of-band relative spectral response characterization, In the flood source configuration the entire focal plane array is illuminated simultaneously to investigate pixel-to-pixel uniformity and dead or inoperable pixels, The remaining tests were executed in the GeoRad configuration and use a NIST calibrated cavity blackbody source, The NIST calibration is transferred to the TIRS sensor and to the blackbody source on-board TIRS, The onboard calibrator will be the primary calibration source for the TIRS sensor on orbit.

Smith, Ramsey↗

Surface-Micromachined Planar Arrays of Thermopiles

Planar two-dimensional arrays of thermopiles intended for use as thermal-imaging detectors are to be fabricated by a process that includes surface micromachining. These thermopile arrays are designed to perform better than do prior two-dimensional thermopile arrays. The lower performance of prior two-dimensional thermopile arrays is attributed to the following causes: The thermopiles are made from low-performance thermoelectric materials. The devices contain dielectric supporting structures, the thermal conductances of which give rise to parasitic losses of heat from detectors to substrates. The bulk-micromachining processes sometimes used to remove substrate material under the pixels, making it difficult to incorporate low-noise readout electronic circuitry. The thermoelectric lines are on the same level as the infrared absorbers, thereby reducing fill factor. The improved pixel design of a thermopile array of the type under development is expected to afford enhanced performance by virtue of the following combination of features: Surface-micromachined detectors are thermally isolated through suspension above readout circuitry. The thermopiles are made of such high-performance thermoelectric materials as Bi-Te and Bi-Sb-Te alloys. Pixel structures are supported only by the thermoelectric materials: there are no supporting dielectric structures that could leak heat by conduction to the substrate.

Foote, Marc C.↗

Scanning Microscopes Using X Rays and Microchannels

Scanning microscopes that would be based on microchannel filters and advanced electronic image sensors and that utilize x-ray illumination have been proposed. Because the finest resolution attainable in a microscope is determined by the wavelength of the illumination, the xray illumination in the proposed microscopes would make it possible, in principle, to achieve resolutions of the order of nanometers about a thousand times as fine as the resolution of a visible-light microscope. Heretofore, it has been necessary to use scanning electron microscopes to obtain such fine resolution. In comparison with scanning electron microscopes, the proposed microscopes would likely be smaller, less massive, and less expensive. Moreover, unlike in scanning electron microscopes, it would not be necessary to place specimens under vacuum. The proposed microscopes are closely related to the ones described in several prior NASA Tech Briefs articles; namely, Miniature Microscope Without Lenses (NPO-20218), NASA Tech Briefs, Vol. 22, No. 8 (August 1998), page 43; and Reflective Variants of Miniature Microscope Without Lenses (NPO-20610), NASA Tech Briefs, Vol. 26, No. 9 (September 2002) page 6a. In all of these microscopes, the basic principle of design and operation is the same: The focusing optics of a conventional visible-light microscope are replaced by a combination of a microchannel filter and a charge-coupled-device (CCD) image detector. A microchannel plate containing parallel, microscopic-cross-section holes much longer than they are wide is placed between a specimen and an image sensor, which is typically the CCD. The microchannel plate must be made of a material that absorbs the illuminating radiation reflected or scattered from the specimen. The microchannels must be positioned and dimensioned so that each one is registered with a pixel on the image sensor. Because most of the radiation incident on the microchannel walls becomes absorbed, the radiation that reaches the image sensor consists predominantly of radiation that was launched along the longitudinal direction of the microchannels. Therefore, most of the radiation arriving at each pixel on the sensor must have traveled along a straight line from a corresponding location on the specimen. Thus, there is a one-to-one mapping from a point on a specimen to a pixel in the image sensor, so that the output of the image sensor contains image information equivalent to that from a microscope.

Wang, Yu↗

Silicon Membrane Mirrors with Electrostatic Shape Actuators

Efforts are under way to develop deformable mirrors equipped with microscopic electrostatic actuators that would be used to maintain their reflective surfaces in precise shapes required for their intended applications. Unlike actuators that depend on properties of materials (e.g., piezoelectric and electrostrictive actuators), electrostatic actuators are effective over a wide temperature range. A mirror of the present type would be denoted a MEMSDM (for microelectromechanical system deformable mirror). The reflective surface of such a mirror would be formed on a single-crystal silicon membrane that would be attached by posts to a silicon actuator membrane that would, in turn, be attached by posts to a rigid silicon base (see figure). The actuator membrane would serve as the upper electrode of a capacitor. Multiple lower electrodes, each occupying a conveniently small fraction of the total area, would be formed on an electrically insulating oxide layer on the base, thereby defining a multiplicity of actuator pixels. The actuator membrane would be corrugated in a pattern that would impart mechanical compliance needed for relaxation of operational and fabrication-induced stresses and to minimize the degree of nonlinearity of deformations. The compliance afforded by the corrugations would also help to minimize the undesired coupling of deformations between adjacent pixels (a practical goal being to keep the influence coefficient between adjacent pixels below 10 percent).

Yang, Eui-Hyeok↗

Metal Side Reflectors for Trapping Light in QWIPs

Focal-plane arrays of quantum-well infrared photodetectors (QWIPs) equipped with both light-coupling diffraction gratings and metal side reflectors have been proposed, and prototypes are expected to be fabricated soon. The purpose served by the metal side reflectors is to increase quantum efficiency by helping to trap light in the photosensitive material of each pixel. The reasons for using diffraction gratings were discussed in several prior NASA Tech Briefs articles. To recapitulate: In an array of QWIPs, the quantum-well layers are typically oriented parallel to the focal plane and therefore perpendicular or nearly perpendicular to the direction of incidence of infrared light. By virtue of the applicable quantum selection rules, light polarized parallel to the focal plane (as normally incident light is) cannot excite charge carriers and, hence, cannot be detected. Diffraction gratings scatter normally or nearly normally incident light into directions more nearly parallel to the focal plane, so that a significant portion of the light attains a component of polarization normal to the focal plane and, hence, can excite charge carriers. Unfortunately, light scattered in directions parallel or nearly parallel to the focal plane can escape sideways from the QWIP of a given pixel, as illustrated in Figure 1. The escaped light has made only a single pass through the interior photosensitive volume of the QWIP. The quantum efficiency of the QWIP would be increased by trapping light so that it makes multiple passes through the photosensitive volume. As shown in Figure 2, the sides of the QWIP of each pixel would be coated with gold to reflect escaping light back into the interior.

Gunapala, Sarath↗

Geometric registration of images by similarity transformation using two reference points

A method for registering a first image to a second image using a similarity transformation. The each image includes a plurality of pixels. The first image pixels are mapped to a set of first image coordinates and the second image pixels are mapped to a set of second image coordinates. The first image coordinates of two reference points in the first image are determined. The second image coordinates of these reference points in the second image are determined. A Cartesian translation of the set of second image coordinates is performed such that the second image coordinates of the first reference point match its first image coordinates. A similarity transformation of the translated set of second image coordinates is performed. This transformation scales and rotates the second image coordinates about the first reference point such that the second image coordinates of the second reference point match its first image coordinates.

Kang, Yong Q.↗