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At least 1,513 records · Page 84

Prevention of cracking of soldered joints in electronic assemblies

Printed circuit board design allows for thermal stressing of the soldered joints during many thermal cycles. Components' leads should be cleaned, tinned, and freed of particles that prevent solder adherence, have a thin conformal coating, and have an air space between the coating and the body of the component.

Beasley, B.↗

Vacuum-jacketed rotary joints for pipelines

Joint absorbs all significant torque, is as rugged as heavy metallic pipe, and has thermal insulation comparable to length of flexible pipe. Design is adaptable to any pipes transporting gases or liquids, including those which are noxious or corrosive.

Mursinna, R. C.↗

Parallel-gap welding for joints between copper conductors and Kovar

Welding technique produces more reliable joints than soldering. Investigation used different sizes of copper conductors and component lead ribbons, corrosion protection platings, and melting points of metals being joined. Optimum combination is gold-plated component lead ribbons and solder-plated copper conductors.

Mc Daniel, G. E.↗