Evaluation of a novel thermoplastic polyimide for bonding titanium
A novel hot-melt processable polyimide has been synthesized and characterized as an adhesive for a titanium alloy. This system shows potential for applications with service temperatures near 200 C. A bonding cycle was developed from preliminary processing studies. The bonded specimens were tested at room temperature, 177 C and 204 C both before and after aging in air at 204 C for times up to 1000 hours. There was no appreciable change in strength after aging. Bonded specimens were exposed to boiling water continuously for a 72 hour period. These specimens exhibited some loss in strength due to this rather severe exposure.