Effect of production processes on the fracture strength of silicon solar cells
Fracture of Czochralski silicon wafers during processing is an important factor in solar cell yield and cost. A fracture-mechanics test and analysis program was developed to evaluate fracture strength changes in the in-process wafer-to-cell processing at different stages on a manufacturer's production line. The strength data were described by Weibull statistical analysis and can be interpreted with the surface-flaw distribution of each of the process steps.