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At least 145 records · Page 8

Temperature Tolerant Evolvable Systems Utilizing FPGA Boards and Bias-Controlled Amplifiers

Space missions often require radiation and extreme-temperature hardened electronics to survive the harsh environments beyond Earth's atmosphere. Traditional approaches to preserve electronics incorporate shielding, insulation and redundancy at the expense of power and weight. However, a novel way of bypassing these problems is the concept of evolutionary hardware. A reconfigurable device, consisting of several switches interconnected with analog/digital parts, is controlled by an evolutionary processor (EP). When the EP detects degradation in the circuit it sends signals to reconfigure the switches, thus forming a new circuit with the desired output. This concept has been developed since the mid-l990s, but one problem remains-the EP cannot degrade substantially. For this reason, extensive testing at extreme temperatures (-180 to 120 C) has been done on devices found on FPGA boards (taking the role of the EP), such as the Analog to Digital and the Digital to Analog Converter. The EP is used in conjunction with a bias-controlled amplifier and a new prototype relay board, which is interconnected with 6 G4-FETs, a tri-input transistor-like element developed at JPL. The greatest improvements to be made lie in the reconfigurable device, so future design and testing of the G4-FET chip is required.

Kumar, Nikhil R.↗

Lightweight Modular Instrumentation for Planetary Applications

An instrumentation, called Space Active Modular Materials ExperimentS (SAMMES), is developed for monitoring the spacecraft environment and for accurately measuring the degradation of space materials in low earth orbit (LEO). The SAMMES architecture concept can be extended to instrumentation for planetary exploration, both on spacecraft and in situ. The operating environment for planetary application will be substantially different, with temperature extremes and harsh solar wind and cosmic ray flux on lunar surfaces and temperature extremes and high winds on venusian and Martian surfaces. Moreover, instruments for surface deployment, which will be packaged in a small lander/rover (as in MESUR, for example), must be extremely compact with ultralow power and weight. With these requirements in mind, the SAMMES concept was extended to a sensor/instrumentation scheme for the lunar and Martian surface environment.

Joshi, P. B.↗

Fatigue and fracture

The effects of the load/temperature environment of the shuttle on the fatigue life of the body-flap were investigated by conducting real time and accelerated flight-by-flight tests up to 500 flights on coupons containing holes. On the fracture side, much is known about the sensitivity of the tensile strengths of composites to holes and other flaws, predominantly at room temperature. The effects of notches were assessed for graphite/polyimides at the expected temperature extremes of the body-flap: 117K (-250 F) to 589K (600 F). Results indicate that the shuttle temperature extremes may affect fatigue properties HTS/PMR-15. There is no significant effect of temperature on notch-strength. Tensile strengths for specimens with holes and slots are equal.

Illg, W.↗

Application of fiber optics in spacecraft

The unique requirements placed on an optical fiber data system in space are briefly reviewed in this paper. These include temperature extremes, particle radiation, and, in some cases, a stringent electrical power budget. An overriding need is for the best possible reliability. Results related to the power consumption of a fiber terminal pair are reported, with the conclusion that a 32-port transmission star bus configuration could be operated error-free at 10 Mbits/s on 1/8 watt per transmitting terminal. The design of a transmitter terminal optimized for low idling power consumption is discussed. Although the electronic elements on a spacecraft are protected, the fiber cable may be subjected to large temperature extremes. Measured effects of temperature on fibers and cables are discussed and related to bus design. Radiation effects are briefly reviewed, with special reference to the long-duration low dose rate environment of a spacecraft.

Johnston, A. R.↗

Effects of Temperature on the Performance and Stability of Recent COTS Silicon Oscillators

Silicon oscillators have lately emerged to serve as potential replacement for crystal and ceramic resonators to provide timing and clock signals in electronic systems. These semiconductor-based devices, including those that are based on MEMS technology, are reported to be resistant to vibration and shock (an important criteria for systems to be deployed in space), immune to EMI, consume very low current, require few or no external components, and cover a wide range of frequency for analog and digital circuits. In this work, the performance of five recently-developed COTS silicon oscillator chips from different manufacturers was determined within a temperature range that extended beyond the individual specified range of operation. In addition, restart capability at extreme temperatures, i.e. power switched on while the device was soaking at extreme (hot or cold) temperature, and the effects of thermal cycling under a wide temperature range on the operation of these silicon oscillators were also investigated. Performance characterization of each oscillator was obtained in terms of its output frequency, duty cycle, rise and fall times, and supply current at specific test temperatures. The five different oscillators tested operated beyond their specified temperature region, with some displaying excellent stability throughout the whole test temperature range. Others experienced some instability at certain temperature test points as evidenced by fluctuation in the output frequency. Recovery from temperature-induced changes took place when excessive temperatures were removed. It should also be pointed out that all oscillators were able to restart at the extreme test temperatures and to withstand the limited thermal cycling without undergoing any significant changes in their characteristics. In addition, no physical damage was observed in the packaging material of any of these silicon oscillators due to extreme temperature exposure and thermal cycling. It is recommended that additional and more comprehensive testing under long term cycling be carried out to fully establish the reliability of these devices and to determine their suitability for use in space exploration missions under extreme temperature conditions.

Patterson, Richard L.↗

Extended Temperature Operation of Isolated, Precision Gate Driver, ADuM4120

Electronics used in space missions encounter exposure to extreme temperatures and operation under wide thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and very little data exist on their performance outside their specified range of operation. Extending the temperature range at which electronic parts can operate reliably leads to potential benefits resulting in improving reliability, reducing mass/weight, and simplifying thermal design due to elimination of thermal control elements and fewer parts count. In this work, the performance of an isolated, precision gate driver for controlling power-level transistors, including gallium nitride (GaN) and silicon carbide (SiC) devices, was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Wide Bandgap Power Electronics↗

UV fluxes and effective temperatures of extreme helium stars

Low resolution IUE spectra of a complete ensemble of extreme helium stars are presented and their appearance in comparison with normal stars is discussed. Effective temperatures from these observations by means of line blanketed model atmospheres are determined. It is found that the temperatures are in accordance with earlier results from ground based observations.

Schoenberner, D.↗

Profiles of temperature and density based on extremes at 5, 10, 20, 30 and 40 km

Information on the vertical distribution of expected extremes of temperature and density are required for the design and operation of systems traversing the atmosphere. Such data are particularly important at altitudes from the surface to approximately 80 km for developing all types of airborne vehicles ranging from helicopters and airplanes to sophisticated aerospace systems. Vertical profiles of temperature and density have been developed based on 1- and 10-percent hot and cold temperatures and 1- and 10- percent high and low densities occurring during the most severe month at the worst locations for which reliable upper-air data are available. The model profiles, from the surface to 80 km, are based on extremes that occur at 5, 10, 20, 30, and 40 km. There are 20 profiles for extreme temperatures (5 levels by 4 percentiles) that include associated densities, and 20 analogous profiles for extreme densities including associated temperatures. Consequently, a set of realistic profiles (rather than envelopes) of temperature and density, associated with extremes at each of 5 specified levels in the troposphere and stratosphere, are now available for altitudes up to 80 km.

Kantor, A. J.↗

A Brief Overview of Silicon Carbide Based Smart Sensor System Technologies for Planetary and Aeronautics Applications

A range of aerospace application related to planetary exploration and aeronautic engine operations require Smart Sensor System technologies operational in harsh environments. A Smart Sensor System as described here implies the use of sensors combined with electronics and other supporting technologies. For example, missions to the surface of planets like Venus or Mercury are challenged by extreme temperatures and environments, e.g., extended Venus operation 465°C [1]. In response, NASA has been developing capabilities for a small lander that is designed to operate for months in the extreme temperatures. These capabilities span electronics, sensors, communications, and power. Such a lander would enable new revolutionary science. Similar game changing capabilities are enabled by the introduction of high temperature smart systems into aeronautic engine applications to enable distributed intelligence within the engine system [2]. Core to meeting these applications is operational harsh environment electronics, corresponding sensor systems, and their integration. This presentation concentrates on the status of Smart System technologies emphasizing the role of Silicon Carbide (SiC) electronics and sensors. For example, SiC integrated circuit (IC) electronics have matured to a state where a simple long-life scientific probe is feasible for extended Venus surface operations [1, 3]. Maturation of these high temperature electronics and other technologies has been part of NASA projects to provide an operational system for in situ exploration of the Venus surface for up to 60 days [1,3-4]. This is in parallel to work expanding the capabilities of the sensor technology to provide science measurements on the Venus surface. This technology development, as well as that for other planetary applications and intelligent high temperature engine operations, will be discussed.

engine monitoring↗

Long Duration Venus Probes and Landers

Planetary probes have long been a tool used by scientists to gain early clues on environments and systems of new planetary targets. This not only fueled the scientific process but also helped prepare for future missions, such as landers, and helped ensure their success. Venus, Earth's sister planet, has been the target of more probes and landers than any other body in our solar system except for Earth and yet many fundamental questions are unanswered. Challenge for Venus Surface Science: This lack of knowledge is a result of the challenging Venus environments. Remote sensing of the surface and portions of the atmosphere is difficult at best due to the thick layers of sulfuric acid clouds and the high pressure supercritical CO2 atmosphere below those clouds. This has hampered the ability of orbiting missions to provide us insight into surface features and processes and thus hides potential clues on interior process from our view. Surface probes and landers face an even more daunting challenge, which is the extreme temperature, pressure and unfriendly chemical composition of the near surface atmosphere. Over 10 assets have landed on the surface yet the longest surviving asset Venera-13 lasted only 127 minutes before succumbing to the extreme temperature. While this and other landers provided valuable new data, the short life impacted ability to understand any temporal processes, for example meteorology, seismic active, and therefore very little is known about the interior and surface atmosphere interactions. New Capability Offering Potential Solutions: Re-cent developments by NASA are offering hope of overcoming the technical challenges of surface operations and life with the use of high temperature electronics and systems. Wide band gap, SiC based electronics have been demonstrated to function successfully for extended periods of time both at 500C, Venus surface temperatures as well as when temperature is combined with the reactive chemistry of the surface atmosphere and the high pressures (over 90 bar pressure at the surface). In addition to electronics a number of other subsystems are in development including power in the form of high temperature batteries and power management devices, communications including antennas, transmitters and other components, materials, and structures and mechanisms. These are all activities under NASA's Long Lived In situ Solar System Exploration (LLISSE) project. Other activities are also funded under NASA's HOTTech program.

Kremic, T.↗

Performance of MEMS Silicon Oscillator, ASFLM1, under Wide Operating Temperature Range

Over the last few years, MEMS (Micro-Electro-Mechanical Systems) resonator-based oscillators began to be offered as commercial-off-the-shelf (COTS) parts by a few companies [1-2]. These quartz-free, miniature silicon devices could compete with the traditional crystal oscillators in providing the timing (clock function) for many digital and analog electronic circuits. They provide stable output frequency, offer great tolerance to shock and vibration, and are immune to electro-static discharge [1-2]. In addition, they are encapsulated in compact lead-free packages, cover a wide frequency range (1 MHz to 125 MHz), and are specified, depending on the grade, for extended temperature operation from -40 C to +85 C. The small size of the MEMS oscillators along with their reliability and thermal stability make them candidates for use in space exploration missions. Limited data, however, exist on the performance and reliability of these devices under operation in applications where extreme temperatures or thermal cycling swings, which are typical of space missions, are encountered. This report presents the results of the work obtained on the evaluation of an ABRACON Corporation MEMS silicon oscillator chip, type ASFLM1, under extreme temperatures.

Patterson, Richard L.↗

Performance Evaluation of an Automotive-Grade, High Speed Gate Driver for SiC FETs, Type UCC27531, Over a Wide Temperature Range

Silicon carbide (SiC) devices are becoming widely used in electronic power circuits as replacement for conventional silicon parts due to their attractive properties that include low on-state resistance, high temperature tolerance, and high frequency operation. These attributes have a significant impact by reducing system weight, saving board space, and conserving power. In this work, the performance of an automotive-grade high speed gate driver with potential use in controlling SiC FETs (field-Effect Transistors) in converters or motor control applications was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Transistor Gate Drive↗

Assessment of Operation of EMK21 MEMS Silicon Oscillator Over Wide Temperature Range

Electronic control systems, data-acquisition instrumentation, and microprocessors require accurate timing signals for proper operation. Traditionally, ceramic resonators and crystal oscillators provided this clock function for the majority of these systems. Over the last few years, MEMS (Micro-Electro-Mechanical Systems) resonator-based oscillators began to surface as commercial-off-the-shelf (COTS) parts by a few companies. These quartz-free, miniature silicon devices could easily replace the traditional crystal oscillators in providing the timing/clock function for many digital and analog circuits. They are reported to provide stable output frequency, offer great tolerance to shock and vibration, and are immune to electro-static discharge [ 1-2]. In addition, they are encapsulated in compact lead-free packages and cover a wide frequency range (1 MHz to 125 MHz). The small size of the MEMS oscillators along with their thermal stability make them ideal candidates for use in space exploration missions. Limited data, however, exist on the performance and reliability of these devices under operation in applications where extreme temperatures or thermal cycling swings, which are typical of space missions, are encountered. This report presents the results of the work obtained on the evaluation of an Ecliptek Corporation MEMS silicon oscillator chip under extreme temperatures.

Patterson, Richard L.↗

Method of making a flexible diaphragm

A diaphragm suitable for extreme temperature usage, such as encountered in critical aerospace applications, is fabricated by a unique method, and of a unique combination of materials, which include multilayered lay-ups of diaphragm materials sandwiched between layers of bleeder fabrics which, after being formed in the desired shape on a mold, are vacuum sealed and then cured under pressure, in a heated autoclave, to produce a bond capable of withstanding extreme temperatures.

Lerma, Guillermo↗

Motor Qualification for Long-Duration Mars Missions

Qualification of motors for deep space under extreme thermal environments to be encountered during the Mars Science Laboratory (MSL) mission is required to verify the reliability and validate mission assurance requirements. The motor assembly must survive all ground operations, plus the nominal 670 Martian-day (or sol) mission that includes summer and winter seasons of the Mars environment. The motor assembly was tested and characterized under extreme temperature conditions with reference to hardware requirements. The motor assembly has been proved to be remarkably robust and displayed no sign of degradation due to the 3 X (three times per JPL design principles) thermal environmental exposure to the punishing Mars surface operations cycles. The motor characteristics obtained before, during, and post-test comparisons for the surface operations cycles are within measurement error of one another. The motors withstood/survived 2,010 extreme temperature cycles with a Delta T of 190 C deep temperature cycles, representing three times the expected thermal cycling exposure during the MSL surface operations. The qualification test hardware elements (A200 motor assembly, encoders, and resolver) have not shown any signs of degradation due to the PQV (Package Qualification and Verification) testing. The test hardware has demonstrated sufficient life to survive the deep thermal cycles associated with MSL mission surface operations for three lives.

Ramesham, Rajeshuni↗

Environmental Conditions for Space Flight Hardware: A Survey

Interest in generalization of the physical environment experienced by NASA hardware from the natural Earth environment (on the launch pad), man-made environment on Earth (storage acceptance an d qualification testing), the launch environment, and the space environment, is ed to find commonality among our hardware in an effort to reduce cost and complexity. NASA is entering a period of increase in its number of planetary missions and it is important to understand how our qualification requirements will evolve with and track these new environments. Environmental conditions are described for NASA projects in several ways for the different periods of the mission life cycle. At the beginning, the mission manager defines survivability requirements based on the mission length, orbit, launch date, launch vehicle, and other factors . such as the use of reactor engines. Margins are then applied to these values (temperature extremes, vibration extremes, radiation tolerances, etc,) and a new set of conditions is generalized for design requirements. Mission assurance documents will then assign an additional margin for reliability, and a third set of values is provided for during testing. A fourth set of environmental condition values may evolve intermittently from heritage hardware that has been tested to a level beyond the actual mission requirement. These various sets of environment figures can make it quite confusing and difficult to capture common hardware environmental requirements. Environmental requirement information can be found in a wide variety of places. The most obvious is with the individual projects. We can easily get answers to questions about temperature extremes being used and radiation tolerance goals, but it is more difficult to map the answers to the process that created these requirements: for design, for qualification, and for actual environment with no margin applied. Not everyone assigned to a NASA project may have that kind of insight, as many have only the environmental requirement numbers needed to do their jobs but do not necessarily have a programmatic-level understanding of how all of the environmental requirements fit together.

Plante, Jeannette↗

Venus Landsailer Zephyr

Imagine sailing across the hot plains of Venus! A design for a craft to do just this was completed by the COncurrent Multidisciplinary Preliminary Assessment of Space Systems (COMPASS) Team for the NASA Innovative Advanced Concepts (NIAC) project. The robotic craft could explore over 30 kilometers of the surface of Venus, driven by the power of the wind. The Zephyr Venus Landsailer is a science mission concept for exploring the surface of Venus with a mobility and science capability roughly comparable to the Mars Exploration Rovers (MER) mission, but using the winds of the thick atmosphere of Venus for propulsion. It would explore the plains of Venus in the year 2025, near the Venera 10 landing site, where wind velocities in the range of 80 to 120 centimeters per second (cm/s) were measured by earlier Soviet landing missions. These winds are harnessed by a large wing/sail which would also carry the solar cells to generate power. At around 250 kilograms (kg), Zephyr would carry an 8 meter tall airfoil sail (12 square meters area), 25 kg of science equipment (mineralogy, grinder, and weather instruments) and return 2 gigabytes of science over a 30 day mission. Due to the extreme temperatures (450 degrees Centigrade) and pressures (90 bar) on Venus, Zephyr would have only basic control systems (based on high temperature silicon carbide (SiC)electronics) and actuators. Control would come from an orbiter which is in turn controlled from Earth. Due to the time delay from the Earth a robust control system would need to exist on the orbiter to keep Zephyr on course. Data return and control would be made using a 250 megahertz link with the orbiter with a maximum data rate of 2 kilobits per second. At the minimal wind speed required for mobility of 35 cm/s, the vehicle move at a slow but steady 4 cm/s by positioning the airfoil and use of one wheel that is steered for pointing control. Navigation commands from the orbiter will be based upon navigation cameras, simple accelerometers and stability sensors; Zephyr's stability is robust, using a wide wheel base along with controls to "feather" or "luff" the airfoil and apply brakes to stop the vehicle in the case of unexpected conditions. This would be the science gathering configuration. The vehicle itself would need to be made from titanium (Ti) as the structural material, with a corrosion-barrier overcoating due to extreme temperatures on the surface.

Wind Sailing↗

Investigating Laser Beam Welding as an In-Space Joining Technique via Thermal Vacuum and Microgravity and Vacuum Experiments

In-space joining technologies are crucial for stimulating an in-space economy and for enabling sustained space exploration by in-space manufacturing and repair of metallic structures. Compared to brazing or soldering, in-space welding (ISW) can provide highly hermetic, strong, and complex joints, potentially without introducing additional material. However, the influence of extreme temperatures, reduced pressure, and reduced gravity on ISW is not yet fully elucidated. Several efforts at NASA are investigating laser beam welding (LBW) as a joining and repair method in both thermal vacuum (TVAC) and combined vacuum & reduced gravity environments. NASA Marshall Space Flight Center (MSFC) shepherded several ISW projects in its past, including the 1973 electron beam welding on Skylab, the 1989 low-power LBW on parabolic flights, and the unflown 1990s-era In-Space Welding Experiment. Recent parabolic flights and 3 degree-of-freedom ground testing build upon this heritage. A collaboration with the Ohio State University using NASA Langley Research Center (LaRC) hardware retrofitted for LBW achieved the first high-powered laser welds under vacuum and low gravity and developed a workforce capable developing such experimental hardware. A ground testing campaign at the MSFC Flat Floor simulated fit-up and welding representative of ISW in 3 degrees of freedom to emulate microgravity effects on inertial systems. One ongoing effort is a NASA Early Career Initiative project – Lunar Assembly and Servicing by Autonomous Robotics (LASAR). Ruggedized LBW components were developed by an external partner for use in TVAC. A TVAC-rated robotic arm was procured by MSFC and used in the first known robotic laser weld where all components save the laser generator were under vacuum. NASA Johnson Space Center (JSC) is advancing supervised autonomy of ISW. NASA LaRC continues to adapt their unique snowflake joint geometry, suitable for connecting segments in trusses and other structures, to LBW. Upcoming TVAC campaigns will focus on testing extreme temperatures, proving out autonomous operations, and demonstrating weld repair. Weld inspection will occur via a non-contact nondestructive evaluation (NDE) technique – electromagnetic acoustic transduction (EMAT). Another ongoing effort based at MSFC is the DISCMAN -- DIsk-Shaped Configurable and Modular vAcuum uNit – which seeks to development a compact, modular payload that can provide a vacuum environment while in a reduced gravity condition. This payload could support multiple in-space manufacturing developmental efforts, with the first demonstration technology being LBW. Currently, the design is targeting operations in the pressurized volume of a space station, but the payload could readily be adapted to other flight platforms such as parabolic or even suborbital vehicles. LASAR elucidates the effects of temperature and vacuum on LBW while DISCMAN probes those of vacuum and gravity. Through these complementary efforts, NASA is addressing the primary challenges of ISW across the space environment while simultaneously developing and maturing technologies including robotic systems and inspection methodologies for future practical implementation on the Moon and beyond. This approach is timely, as upcoming missions requiring sustained human presence in space will depend on reliable ISW capabilities to create robust metallic joints currently unproven in the space environment and to perform repairs in situ .

hypogravity↗