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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS1986

Processes and process development in Taiwan

Silicon material research in the Republic of China (ROC) parallels its development in the electronic industry. A brief outline of the historical development in ROC silicon material research is given. Emphasis is placed on the recent Silane Project managed by the National Science Council, ROC, including project objectives, task forces, and recent accomplishments. An introduction is also given to industrialization of the key technologies developed in this project.

Hwang, H. L.↗
NASA NTRS1983

A probabilistic analysis of silicon cost

Silicon materials costs represent both a cost driver and an area where improvement can be made in the manufacture of photovoltaic modules. The cost from three processes for the production of low-cost silicon being developed under the U.S. Department of Energy's (DOE) National Photovoltaic Program is analyzed. The approach is based on probabilistic inputs and makes use of two models developed at the Jet Propulsion Laboratory: SIMRAND (SIMulation of Research ANd Development) and IPEG (Improved Price Estimating Guidelines). The approach, assumptions, and limitations are detailed along with a verification of the cost analyses methodology. Results, presented in the form of cumulative probability distributions for silicon cost, indicate that there is a 55% chance of reaching the DOE target of $16/kg for silicon material. This is a technically achievable cost based on expert forecasts of the results of ongoing research and development and do not imply any market prices for a given year.

Reiter, L. J.↗
DOE OSTI2024

On the cogent formulation of an elastomeric silicone ink material for direct ink write ( DIW ) 3D printing

Abstract Adhesives and sealants show fine rheology with good physical and mechanical properties as viscous pastes, a possible starting point for developing direct ink writing (DIW) 3D printing ink. However, many commercial adhesives and sealants take days or weeks to cure fully. DIW 3D‐printed parts made directly from these sealants are not designed for a scalable manufacturing process and high‐volume production. Moreover, most of these adhesives and sealants have volume shrinkage during cure. A systematic understanding of formulation methods and design principles for an elastomeric silicone DIW ink can overcome these issues. This study presents the cogent formulation development of a 3D printable thermoset elastomer silicone that gels and cures isotropically in minutes, reducing cycle time for rapid ink development with no shrinkage during cure. More specifically, we outline the principles of raw material selection of a formulation to achieve excellent rheology, printability, synchronized working, and gel time fitting requirements closer to scalable manufacturing. The reaction kinetics and their corresponding 3D‐printed structural properties are also described. Interest in future work is toward a rational DIW 3D printing ink material development protocol and use of machine learning (ML). Highlights Formulation method flexibility and design principle of DIW ink. Raw material selection principle to achieve optimal rheology for DIW printing. Ink gel kinetics for large‐scale DIW manufacturing. Hydrosilylation conversion over time at different ambient temperatures. Structural properties of DIW 3D printed parts.

36 MATERIALS SCIENCE↗
NASA NTRS1972

Development of a silicone ablator for high-heat-flux and high-shear-rate condition

A silicone material was developed which gives suitable ablative protection in the high heat flux, high shear environments encountered in severe reentry applications, such as nose cones for ballistic vehicles and protection of leading edges or other critical areas of a vehicle. In addition, the ease of handling, low application cost, and room temperature cure make such a silicon material suitable nozzles for the large rockets necessary for vehicle launching. The development of this product is traced from the selection of suitable polymers through the choice of fillers and the finalization of filler loadings.

Campbell, R. A.↗
NASA NTRS1978

Low-cost Solar Array (LSA) project

Progress made by the Low-Cost Silicon Solar Array Project during the period January through March 1978 is reported. It includes task reports on silicon material processing, large-area silicon sheet development, encapsulation materials testing and development, project engineering and operations, and manufacturing techniques, plus the steps taken to integrate these efforts.

Source record↗
NASA NTRS1978

LSA: Low-cost Solar Array project

Topics discussed include silicon material processing; large-area silicon sheet development; encapsulation materials testing and development; project engineering and operations activities, and manufacturing techniques. The steps taken to integrate these efforts, are described.

Source record↗
NASA NTRS1980

Low-cost solar array project and Proceedings of the 14th Project Integration Meeting

Activities are reported on the following areas: project analysis and integration; technology development in silicon material, large area sheet silicon, and encapsulation; production process and equipment development; and engineering and operations, and the steps taken to integrate these efforts. Visual materials presented at the project Integration Meeting are included.

Mcdonald, R. R.↗
NASA NTRS1976

Comparison of type A and C Fluorinated Ethylene Propylene (FEP) as cover materials for silicon solar cells

Fluorinated ethylene propylene film (FEP, 0.0127 cm thick) was heat and pressure laminated to silicon solar cells as a low cost substitute for quartz covers. The FEP-C, treated on one side for bonding, was compared to FEP-A, an untreated FEP. With FEP-A, a silane adhesion promoter was applied to the cells. The FEP-C covers delaminated during accelerated temperature-humidity testing and Earth environmental exposure testing; FEP-A covers were unchanged. No differences were observed in peel tests, but FEP-A is superior in its resistance to tearing and in retention of transmission properties after exposure to ultraviolet radiation.

Broder, J. D.↗
NASA NTRS1979

Proceedings of the 13th Project integration meeting

Progress made by the Low Cost Solar Array Project during the period April through August 1979 is presented. Reports are given on project analysis and integration; technology development in silicon material, large area sheet silicon, and encapsulation; production process and equipment development; engineering and operations, and a discussion of the steps taken to integrate these efforts. A report on, and copies of viewgraphs presented at the Project Integration Meeting held August 22-23, 1979 are presented.

Mcdonald, R. R.↗
NASA NTRS1981

The 17th Project Integration Meeting

Progress made by the Low-Cost Solar Array Project during the period September 1980 to February 1981 is described. Included are reports on project analysis and integration; technology development in silicon material, large-area silicon sheet and encapsulation; production process and equipment development; engineering, and operations. A report on and copies of visual presentations made at the Project Integration Meeting held at Pasadena, California on February 4 and 5, 1981 are also included.

Mcdonald, R. R.↗
NASA NTRS1981

EBIC/TEM investigations of defects in solar silicon ribbon materials

Transmission electron microscopy was used to investigate the defect structure of edge defined film growth (EFG) material, web dentritic ribbons (WEB), and ribbon to ribbon recrystallized material (RTR). The most common defects in all these materials are coherent first order twin boundaries. These coherent twins can be very thin, a few atomic layers. Bundles of the twins which contain odd numbers of twins will in optical images appear as a seemingly single first twin boundary. First-order coherent twin boundaries are not electrically active, except at locations where they contain intrinsic (grain boundary) dislocations. These dislocations take up small deviations from the ideal twin relation and play the same role in twin boundaries as conventional and play the some role in twin boundaries as conventional edge and screw dislocations in small angle tilt and twist boundaries.

Ast, D. G.↗
NASA NTRS1981

The 19th Project Integration Meeting

The Flat-Plate Solar Array Project is described. Project analysis and integration is discussed. Technology research in silicon material, large-area silicon sheet and environmental isolation; cell and module formation; engineering sciences, and module performance and failure analysis. It includes a report on, and copies of visual presentations made at, the 19th Project Integration Meeting held at Pasadena, California, on November 11, 1981.

Mcdonald, R. R.↗
NASA NTRS1982

Flat Plate Solar Array Project: Proceedings of the 20th Project Integration Meeting

Progress made by the Flat-Plate Solar Array Project during the period November 1981 to April 1982 is reported. Project analysis and integration, technology research in silicon material, large-area silicon sheet and environmental isolation, cell and module formation, engineering sciences, and module performance and failure analysis are covered.

Mcdonald, R. R.↗
NASA NTRS1985

Capsulation of moldings made from silicon ceramic material

Ceramic articles are potted for hot isostatic pressing by porous glass and/or ceramic coating which is sintered to a pressure-tight coating in vacuo. Thus, a powdered SiO2 glass mixture with saturated alcohol sterin is sprayed on a SI3N4 ceramic, dried, introduced into the press which is evacuated to less than 0.013 mbar and heated to approximately 1200 C to drive off the organic binder and leave a powdered glass coating on the ceramic. The coating is sintered by heating to approximately 1200 C for 0.5 to 2 hours and forms a tight gass-impermeable layer. The press is heated to approximately 1700 C at 1000-300 bar and isostatic pressing is performed in the conventional manner.

Rossmann, A.↗
NASA NTRS1988

Strength distribution in commercial silicon carbide materials

Four-point flexural strength testing has been conducted in order to establish the baseline strength and reliability of four different commercial SiC types, in conjunction with reliable Weibull modulus values. Average strength of the samples ranged from 380 to 482 MPa at room temperature and 307 to 470 MPa at 1370 C. The strength scatter reflects the effect of flaw variability, which must be minimized to improve reliability in sintered SiC.

Dutta, Sunil↗
NASA NTRS2015

High Temperature Joining and Characterization of Joint Properties in Silicon Carbide-Based Composite Materials

Advanced silicon carbide-based ceramics and composites are being developed for a wide variety of high temperature extreme environment applications. Robust high temperature joining and integration technologies are enabling for the fabrication and manufacturing of large and complex shaped components. The development of a new joining approach called SET (Single-step Elevated Temperature) joining will be described along with the overview of previously developed joining approaches including high temperature brazing, ARCJoinT (Affordable, Robust Ceramic Joining Technology), diffusion bonding, and REABOND (Refractory Eutectic Assisted Bonding). Unlike other approaches, SET joining does not have any lower temperature phases and will therefore have a use temperature above 1315C. Optimization of the composition for full conversion to silicon carbide will be discussed. The goal is to find a composition with no remaining carbon or free silicon. Green tape interlayers were developed for joining. Microstructural analysis and preliminary mechanical tests of the joints will be presented.

Joining↗