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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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131 records · Page 8

An Examination of Heavy Ion-Induced Persistent Visual Error Signatures in an Electronic Display Driver Integrated Circuit

Given the ubiquity of electronic displays integration in human-based systems, the impending mission critical, space-based applications of electronic displays will necessitate SEE assessment of components unique to electronic displays. A commercially available DDIC designed to drive a small form factor organic light emitting diode (OLED) was visually monitored during heavy ion irradiation to catalogue radiation induced persistent visual error signatures that require manual intervention (i.e., power cycling) to return to nominal function. These error signatures were able to be reproduced via modification of configuration register values utilizing the instruction set intended for interfacing a microcontroller with the DDIC. This approach to emulation of heavy-ion induced errors on a table-top assists with human perception-based criticality analysis as well as development of mitigation techniques.

Electronic Displays↗

Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics.

Mercury↗

Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics

Mercury↗

Final Technical Report for CMSC 838L

This paper describes Rahul Vishnoi’s final project supporting in his Graduate School curriculum CMSC 838L, Advanced Topics in Programming Languages and Computer Architecture. This project was selected to intersect with his work as a Pathways Intern supporting Code 583, the Ground Software Systems Branch, at NASA’s Goddard Space Flight Center (GSFC). In this project, Field Programmable Gate Array (FPGA) hardware from Xilinx is used to replace and offload processor and memory-intensive computations from a microcontroller/Processing System (PS) to the FPGA Programmable Logic (PL). An interface between the PL and PS in the form of a C library allows for this bridging of capability.

Microcontroller, FPGA, Embedded Development, Xilin↗