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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2012

PRTs and Their Bonding for Long-Duration, Extreme-Temperature Environments

Research was conducted on the qualification of Honeywell platinum resistance thermometer (PRT) bonding for use in the Mars Science Laboratory (MSL). This is the first time these sensors will be used for Mars-related projects. Different types of PRTs were employed for the Mars Exploration Rover (MER) project, and several reliability issues were experienced, even for a shortduration mission like MER compared to MSL. Therefore, the development of a qualification process for the Honeywell PRT bonding was needed for the MSL project. Reliability of the PRT sensors, and their bonding processes, is a key element to understand the health of the hardware during all stages of the project, and particularly during surface operations on Mars. Three extreme temperature summer season cycles and three winter season cycles (total: 1983 thermal cycles) were completed, and no Honeywell PRT failures associated with the bonding process were found. Seventy-eight PRTs were bonded onto six different substrate materials using four different adhesives during the thermal cycling, which included a planetary protection cycle to +125 C for two hours, three protoflight/qualification cycles (-135 to 70 C), 1,384 summer cycles (-105 to 40 C), and 599 winter cycles (-130 to 15 C). There were no observed changes in PRT resistances, bonding characteristics, or damage identified from the package evaluation as a result of the qualification tests.

Ramesham, Rajeshuni↗
NASA NTRS1990

Advanced fabrication technology for high speed aircraft structures

An overview of the development of the weld-brazing process for fabricating Ti-6Al-4V skin-stiffened panels, a brazing process for fabricating Bsc/Al titanium honeycomb core panels, and the enhanced diffusion bonding (EDB) process for fabricating Ti-14Al-21Nb titanium aluminide structural elements are presented. Data presented include the shear strengths of full-scale weldbrazed Ti-6Al-4V skin stiffened and Bsc/Al titanium honeycomb core sandwich panels designed to meet the requirements of an upper wing panel on the NASA YF-12. These results verified that the materials, fabrication processes, and structural concepts were qualified for Mach 3 flight. Shear strengths of each of the panel concepts following flight service evaluation are also reported. Comparisons made with the cost and weight of the original wing panel indicated that the weldbrazed titanium panels resulted in a 15-20 percent cost savings and the brazed Bsc/Al panel showed a 30 percent weight savings. It was also shown that the strengths of the EDB joints were sufficient to develop stresses in the Ti-14Al-21Nb face sheets of the sandwich structure which were above the yield strength of the material.

Bales, T. T.↗
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗
NASA NTRS1983

Sintering of reaction bonded silicon nitride

A process to produce sintered reaction-bonded Si3N4 (SRBSN) articles has been developed. This process consists of the addition of an appropriate sintering aid to reaction-bonded Si3N4 followed by sintering between 1780 and 2000 C, using an over pressure of nitrogen. The principal advantage of this process is the low sintering shrinkages of 5 to 10 percent. The properties and microstructure of two SRBSN systems sintered with MgO and Y2O3 additives are described and were found to be comparable to corresponding hot-pressed Si3N4 systems. Examples of applications of both systems are illustrated, demonstrating near net shape fabrication capability of the process.

Mangels, J. A.↗
NASA NTRSDate not supplied

TECHNO-ECONOMIC ANALYSIS OF A CRYOGENIC FLUX CAPACITOR FOR GRID STORAGE

The Cryogenic Flux Capacitor (CFC) is a cold, dense fluid storage core with integrated design features that afford the designer flexibility and provide new possibilities for the storage and discharge of energy. The stored energy, in this case, is represented by hydrogen physically bonded within the nanoscale pores within the aerogel composite blanket material, and the process of bonding or debonding is governed by principles of physical adsorption (physisorption) and thermodynamics. The large surface area afforded by the nanoporous aerogel (~1,000 m2/g) allows for storage densities close to, or in some cases exceeding, that of normal boiling point liquids. Its performance easily exceeds what can be achieved via ambient temperature, high-pressure gas storage for an equivalent volume. CFC storage is predicted to be easily scalable, is constructed from readily available commercial materials, lends itself to a range of pressure applications, and is geometry insensitive.

Joshua Schmitt↗
NASA NTRS1990

Evaluation of two bisimide additives in LARC-TPI adhesive

The processability of aromatic polyimides can be improved by the addition of bis (amide) acids or bisimides to LARC-TPI. These low molecular weight additives apparently lower the melt viscosity of aromatic polyimides without affecting the glass transition temperature. Well-consolidated, fiber reinforced composites were fabricated using this technology. LARC-TPI can be processed as a thermoplastic polyimide to form high strength bonds, however, this is generally accomplished by processing at relatively high bonding pressures. An adhesive investigation is presented on the effects of two bisimide additives to LARC-TPI in an attempt to improve the bonding process by lowering the viscosity of the material to achieve improved bond strength properties. Apparently, the high flow which is exhibited by the additives when they melt, tended to be masked by the more viscous LARC-TPI.

Progar, Donald J.↗
NASA NTRS1976

On a model of calculating bond strength

Diffusion bonding is a fabricating process to join the fibers and a matrix together forming a composite. The efficiency of the bonding process depends on temperature, time, and pressure. Based on a simplified pair potential model, an expression for the bond-energy at the fiber-matrix interface is formulated in terms of the above-mentioned three parameters. From this expression and the mean atomic distance, the bond-strength between the fibers and the matrix can be calculated.

Yue, A. S.↗
NASA NTRS1981

Integral glass encapsulation for solar arrays

Electrostatic bonding technology, an encapsulation technique for terrestrial solar array was developed. The process produces full integral, hermetic bonds with no adhesives or pottants. Panels of six solar cells on a simple glass superstrate were produced. Electrostatic bonding for making the cell front contact was also developed. A metal mesh is trapped into contact with the cell front during the bonding process. Six cell panels using the bonded mesh as the only cell front contact were produced. The possibility of using lower cost glass, with a higher thermal expansion mismatch to silicon, by making lower temperature bonds is developed. However, this requires a planar surface cell.

Landis, G. A.↗
DOE OSTI2025

Symmetrization of Strong Hydrogen Bond under High Pressure in Bihydroxide-Ion-Containing NaCu 2 (SO 4 ) 2 ·H 3 O 2 Revealed by Experimental Charge Density, Single-Crystal Electron Diffraction, and Neutron Diffraction Studies

In minerals and inorganic compounds, strong hydrogen bonding can lead to the formation of complex ionic species such as the H 3 O 2 – bihydroxide anion and Zundel cation H 5 O 2 + . We studied [NaCu 2 (SO 4 ) 2 ·H 3 O 2 ] natrochalcite, which contains bihydroxide anions and undergoes hydrogen bond symmetrization at the lowest pressure reported so far among inorganic compounds. Hydrogen bond symmetrization leads to changes in the bulk modulus, seismic wave velocities, and proton mobility and plays a primary role in high-temperature superconductivity, but its characteristics are not well understood due to a lack of systematic studies and limitations of experimental methods sensitive to this subtle change. In this work, we applied experimental charge density analysis based on in situ single-crystal X-ray diffraction data, along with the single-crystal neutron and electron diffraction experiments, to probe the behavior of hydrogen atoms during the hydrogen bond symmetrization process under high-pressure conditions. On the way to the symmetrical H-bonding, natrochalcite undergoes a series of complex redistributions of electron density, which we trace with multipole refinement and detailed analysis of changes in the Laplacian of electron density values. Additionally, we deconvoluted the equation of state (volume of the unit cell vs pressure relation) into the atomic equation of states describing dependencies of atomic charges or volumes vs pressure.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2024

Techno-Economic Analysis of Green Hydrogen Energy Storage in a Cryogenic Flux Capacitor

Abstract The Cryogenic Flux Capacitor (CFC) is a cold, dense energy storage core that is being studied in the cryo-compressed, about 300 bar and 80K, region of gaseous hydrogen (GH2) storage and liquid hydrogen (LH2) region near the normal boiling point. Hydrogen storage is improved by physically bonding the molecules within the nanoscale pores of the aerogel composite blanket material. The process of bonding or debonding is governed by principles of physical adsorption (physisorption) and thermodynamics. The large surface area afforded by the nanoporous aerogel (∼1,000 m2/g) allows its storage performance to easily exceed capacities of high-pressure GH2 storage for an equivalent volume. With the integrated aerogel, subscale tests have shown that storage is increased by about 36% over a simple tank filled with GH2 at the same operating temperature and pressure. For LH2 conditions, the CFC is shown to operate at improved densities, but testing is ongoing. For the techno-economic analysis (TEA), the source of hydrogen is compared between onsite steam methane reforming (SMR) and onsite solar photovoltaic (PV) panels providing power to electrolyzers to produce green GH2. The TEA compares pure hydrogen produced at a small scale for a 25 MW power system and at a large scale in a 500 MW power system. The system allowed for hydrogen imports and exports at a set price with a tank sized for 10 hours of power production. The two power producing technologies are a combined cycle gas turbine (CCGT) and hydrogen fuel cells. The SMR system uses natural gas as an input and includes a carbon capture and storage (CCS) system. The levelized cost of electricity (LCOE), levelized cost of hydrogen (LCOH), and levelized cost of storage (LCOS) are developed based on the capital cost and operating cost of the systems. The results are shown for current costs using a 2021 benchmark and DOE projections for cost improvements by 2030. The TEA showed that onsite hydrogen generation from SMR has an LCOH of about 1.4 to 2 USD per kg over the life of the plant and the PV hydrogen production LCOH is about 5.2 to 5.5 USD per kg. The LCOS of conventional GH2 systems is estimated to be $210/MWh and cost of storage for LH2 systems is $205/MWh for fuel cell systems and $249/MWh for CCGT systems. CFC improved the LCOS of all these systems to $198/MWh, $191/MWh and $233/MWh respectively. The LCOE also improved with conventional systems between $171/MWh and $228/MWh improved by CFC to between $167/MWh and $212/MWh. Using projections for improvement in costs following DOE’s goals by 2030, green hydrogen improved to as low as $78/MWh LCOS and LCOE for conventional cases. CFC improved over conventional storage with the lowest LCOS being $62/MWh and the lowest LCOE being $73/MWh. These results correspond to an LCOH of $2/kg. Finally, the TEA shows how LCOE is improved for hydrogen conditioning and storage over conventional systems and caverns in the 10 to 50 hour range.

08 HYDROGEN↗
NASA NTRSDate not supplied

Techno-Economic Analysis of Green Hydrogen Energy Storage in A Cryogenic Flux Capacitor

The Cryogenic Flux Capacitor (CFC) is a cold, dense energy storage core that is being studied in the cryo-compressed, about 300 bar and 80K, region of gaseous hydrogen (GH 2 ) storage and liquid hydrogen (LH 2 ) region near the normal boiling point. Hydrogen storage is improved by physically bonding the molecules within the nanoscale pores of the aerogel composite blanket material. The process of bonding or debonding is governed by principles of physical adsorption (physisorption) and thermodynamics. The large surface area afforded by the nanoporous aerogel (~1,000 m 2 /g) allows its storage performance to easily exceed capacities of high-pressure GH 2 storage for an equivalent volume. With the integrated aerogel, subscale tests have shown that storage is increased by about 36% over a simple tank filled with GH 2 at the same operating temperature and pressure. For LH 2 conditions, the CFC is shown to operate at improved densities, but testing is ongoing. For the techno-economic analysis (TEA), the source of hydrogen is compared between onsite steam methane reforming (SMR) and onsite solar photovoltaic (PV) panels providing power to electrolyzers to produce green GH 2 . The TEA compares pure hydrogen produced at a small scale for a 25 MW power system and at a large scale in a 500 MW power system. The system allowed for hydrogen imports and exports at a set price with a tank sized for 10 hours of power production. The two power producing technologies are a combined cycle gas turbine (CCGT) and hydrogen fuel cells. The SMR system uses natural gas as an input and includes a carbon capture and storage (CCS) system. The levelized cost of electricity (LCOE), levelized cost of hydrogen (LCOH), and levelized cost of storage (LCOS) are developed based on the capital cost and operating cost of the systems. The results are shown for current costs using a 2021 benchmark and DOE projections for cost improvements by 2030. The TEA showed that onsite hydrogen generation from SMR has an LCOH of about 1.4 to 2 USD per kg over the life of the plant and the PV hydrogen production LCOH is about 5.2 to 5.5 USD per kg. The LCOS of conventional GH 2 systems is estimated to be $210/MWh and cost of storage for LH 2 systems is $205/MWh for fuel cell systems and $249/MWh for CCGT systems. CFC improved the LCOS of all these systems to $198/MWh, $191/MWh and $233/MWh respectively. The LCOE also improved with conventional systems between $171/MWh and $228/MWh improved by CFC to between $167/MWh and $212/MWh. Using projections for improvement in costs following DOE’s goals by 2030, green hydrogen improved to as low as $78/MWh LCOS and LCOE for conventional cases. CFC improved over conventional storage with the lowest LCOS being $62/MWh and the lowest LCOE being $73/MWh. These results correspond to an LCOH of $2/kg. Finally, the TEA shows how LCOE is improved for hydrogen conditioning and storage over conventional systems and caverns in the 10 to 50 hour range.

Joshua Schmitt↗
NASA NTRS2012

Process for Patterning Indium for Bump Bonding

An innovation was created for the Cosmology Large Angular Scale Surveyor for integration of low-temperature detector chips with a silicon backshort and a silicon photonic choke through flipchip bonding. Indium bumps are typically patterned using liftoff processes, which require thick resist. In some applications, it is necessary to locate the bumps close to high-aspect-ratio structures such as wafer through-holes. In those cases, liftoff processes are challenging, and require complicated and time-consuming spray coating technology if the high-aspect-ratio structures are delineated prior to the indium bump process. Alternatively, processing the indium bumps first is limited by compatibility of the indium with subsequent processing. The present invention allows for locating bumps arbitrarily close to multiple-level high-aspect-ratio structures, and for indium bumps to be formed without liftoff resist. The process uses the poor step coverage of indium deposited on a silicon wafer that has been previously etched to delineate the location of the indium bumps. The silicon pattern can be processed through standard lithography prior to adding the high-aspect-ratio structures. Typically, high-aspectratio structures require a thick resist layer so this layer can easily cover the silicon topography. For multiple levels of topography, the silicon can be easily conformally coated through standard processes. A blanket layer of indium is then deposited onto the full wafer; bump bonding only occurs at the high points of the topography.

Denis, Kevin↗
DOE OSTI2026

Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation

Detecting internal defects in power electronics packages is critical for their performance and reliability, especially under extreme operating conditions, as these defects can lead to catastrophic failure if not properly addressed. Confocal scanning acoustic microscopy (C-SAM) plays a key role in the nondestructive evaluation of bond layer degradation within a power electronics package by detecting defects such as delamination, voids, and cracks. However, accurately quantifying and predicting these defects from C-SAM images remains a significant challenge due to the low noise-to-signal ratio, which typically arises from both imaging process and bond patterns itself. In this paper, we explore machine learning strategies for processing C-SAM images and providing predictive models of defect growth. We use C-SAM images of sintered copper and sintered silver samples, which are obtained under accelerated thermal experiments, as the representative dataset for our study. We investigate the effect of Fourier transforms and wavelet transforms on these datasets to remove high-frequency noise and address noise across multiple scales with histogram equalization to enhance the contrast and improve the visibility of defects. As a result, defect boundaries can be clearly distinguished, enabling more accurate tracking of their growth over time. We then employ different time-series forecasting algorithms on the denoised images to formulate an image-based lifetime prediction model. Statistical models and deep-learning techniques are trained on images obtained in the early stages of thermal shock, and defect growth in the later stages is predicted. Our work serves as a preliminary attempt to improve the accuracy of lifetime prediction models of power electronics packages, which is critical under extreme operating environments.

24 POWER TRANSMISSION AND DISTRIBUTION↗
NASA NTRSDate not supplied

Fabrication and Characterization of A Lunar Simulant-Based Sintered Construction Material

In-situ resource utilization (ISRU) is critical to enable future efforts to have a long-term human presence on the Moon as well as Mars. ISRU technologies are being developed for radiation protection, dust mitigation, thermal insulation, and other applications. One such ISRU technology for creating construction materials out of lunar and Martian regolith is sintering, which is a thermal-based construction process that bonds finely grained material together at temperatures below the melting point. However, the conditions employed during the sintering, such as temperature, atmospheric composition, duration of the process, and pressure, can have a significant impact on the quality and strength of the resulting materials. In parallel, the development of methods for characterizing the quality, porosity, density, and other properties of these materials is critical. X-ray computed tomography (X-ray CT) can image large changes in density within a material, such as the presence of pores throughout an otherwise uniform medium, with relatively high spatial resolution. Similarly, Terahertz time-domain spectroscopic (THz-TDS) imaging is sensitive to density variations within samples, but is restricted to non-conducting materials. Specifically, previous work has shown that the refractive index (n eff ) values obtained through the analysis of THz-TDS images increases with increasing density within plastic samples. Even further, this work showed that it is possible to create a calibration curve for a given material from samples of different, but known density, which can enable one to directly convert n eff to density for samples having the same composition, but unknown density. Here, we report on the fabrication of a lunar simulant-based sintered construction material using vacuum hot pressed (VHP) sintering, then show X-ray CT and THz-TDS imaging results of the sample, which show spatial variations in the material. This has important implications for efforts to improve these types of lunar construction material processes and verify the quality of these materials in terms of consolidation. To the best of our knowledge, there is no previous work utilizing VHP sintering to make lunar simulant-based construction materials or exploring the feasibility of THz imaging to spatially map the density variation through a lunar simulant-based construction material.

Terahertz time-domain spectroscopic imaging↗
NASA NTRS1996

Process for selective monoaddition to silanes containing two silicon-hydrogen bonds and products thereof

A process for the selective monoadditon of an olefin or acetylene to a siloxane which contains two reactive Si--H bonds to produce a product in which only one of the two Si--H functions has added across the olefin or acetylene is disclosed. A process for making unsymmetrical siloxanes from symmetrical dihydrosiloxanes and products of both of these processes are also disclosed. Products are represented by the formula I in which R.sup.1 and R.sup.4 are different: ##STR1##.

Crivello, James V.↗
NASA NTRS2007

Fabrication and Characterization of Diffusion Bonds for Silicon Carbide

Diffusion bonds of silicon carbide (SiC) were fabricated using several different types of titanium (Ti) based interlayers between the SiC substrates. The interlayers were an alloyed Ti foil, a pure Ti foil, and a physically vapor deposited (PVD) Ti coating. Microscopy was conducted to evaluate the cross-sections of the resulting bonds. Microprobe analysis identified reaction formed phases in the diffusion bonded region. Uniform and well adhered bonds were formed between the SiC substrates. In the case where the alloyed Ti foil or a thick Ti coating (i.e. 20 micron) was used as the interlayer, microcracks and several phases were present in the diffusion bonds. When a thinner interlayer was used (i.e. 10 micron PVD Ti), no microcracks were observed and only two reaction formed phases were present. The two phases were preferred and fully reacted phases that did not introduce thermal stresses or microcracks during the cool-down stage after processing. Diffusion bonded samples were evaluated with the non-destructive evaluation (NDE) methods of pulsed thermography and immersion ultrasonic testing. Joined SiC substrates that were fully bonded and that had simulated bond flaws in the interlayer were also evaluated using immersion ultrasound. Pull testing was conducted on the bonds to determine the tensile strength. To demonstrate the joining approach for a complex multilayered component for a low NOx injector application, the diffusion bonding approach was used to join three 4" diameter SiC discs that contained complex fuel and air flow channels.

Halbig, Michael↗
DOE OSTI2025

Alkali Metal Control of Triplet-Mediated C–H Activation in Iron-Mediated Coupling of Dinitrogen and Benzene

Direct coupling of N 2 with abundant feedstocks like benzene to form N-containing organic compounds is a promising strategy for N 2 fixation pathways. The challenge of coupling N 2 activation and C–H bond oxidative addition was recently solved by introducing a reversible benzene C–H bond activation process mediated by a low-valent Fe(0) complex, which gave an organometallic product that could couple with partially reduced N 2 . Interestingly, the energetics of the C–H oxidative addition/reductive elimination step depends on the choice of alkali metal. However, the reason why the alkali metal influences the C–H bond activation remained elusive. In this work, we present a comprehensive study on this Fe(0)-mediated reversible C–H activation. Through density functional theory combined with high-level coupled cluster calculations, we discovered that the intermediate-spin triplet (S = 1) controls the energy of the transition state for C–H cleavage, while the high-spin quintet (S = 2) controls the position of the equilibrium. Na + drives the equilibrium toward oxidative addition due to an electrostatic effect, while K + and Rb + are dominated by a steric effect that favors the iron(0) species. The key role played by nonbonding interactions in the Fe-mediated C–H activation provides a conceptual model for alkali control over organometallic transformations.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗