SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
We propose a method for the application of single event upset (SEU) data towards the analysis of complex systems using transformed reliability models (from the time domain to the particle fluence domain) and space environment data.
We propose a method for the application of single event upset (SEU) data towards the analysis of complex systems using transformed reliability models (from the time domain to the particle fluence domain) and space environment data.
NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of Trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.
NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.
Presently, there are many difficulties associated with implementing application specific custom or semi-custom (standard cell based) integrated circuits (ICs) into JPL flight projects. One of the primary difficulties is developing prototype semi-custom integrated circuits for use and evaluation in engineering prototype flight hardware. The prototype semi-custom ICs must be extremely cost-effective and yet still representative of flight qualifiable versions of the design. A second difficulty is encountered in the transport of the design from engineering prototype quality to flight quality. Normally, flight quality integrated circuits have stringent quality standards, must be radiation resistant and should consume minimal power. It is often not necessary or cost effective, however, to impose such stringent quality standards on engineering models developed for systems analysis in controlled lab environments. This article presents work originally initiated for ground based applications that also addresses these two problems. Furthermore, this article suggests a method that has been shown successful in prototyping flight quality semi-custom ICs through the Metal Oxide Semiconductor Implementation Service (MOSIS) program run by the University of Southern California's Information Sciences Institute. The method has been used successfully to design and fabricate through the MOSIS three different semi-custom prototype CMOS p-well chips. The three designs make use of the work presented and were designed consistent with design techniques and structures that are flight qualifiable, allowing one hour transfer of the design from engineering model status to flight qualifiable foundry-ready status through methods outlined in this article.
This paper will present definitions for smart power and power integrated circuits and show how, for a typical planetary spacecraft power system, a 37 percent reduction in mass, 89 percent reduction in parts and a 50 percent reduction in volume can be attained. Also discussed are the technology needs for isolation, monolithic current sensing, and high efficiency switching necessary to enable monolithic power structures, as well as various applications of power integrated circuits. A specific example will verify the projected reductions expected when power integrated circuits are implemented in future spacecraft designs. In conclusion, power-integrated circuits can impact the overall design of the spacecraft in all subsystems, not just the power sybsystem.
This is the Final Report representing the results of a 17-month study on the future trends and requirements of Monolithic Microwave Integrated Circuits (MMIC) for space communication applications. Specifically this report identifies potential space communication applications of MMICs, assesses the impact of MMIC on the classes of systems that were identified, determines the present status and probable 10-year growth in capability of required MMIC and competing technologies, identifies the applications most likely to benefit from further MMIC development and presents recommendations for NASA development activities to address the needs of these applications.
This Executive Summary presents the results of a 17-month study on the future trends and requirments for Monolithic Microwave Integrated circuits (MMIC) for space communication application. Specifically this report identifies potential space communication applications of MMICs, assesses the impact of MMIC on the classes of systems that were identified, determines the present status and probable 10-year growth in capability of required MMIC and competing technologies, identifies the applications most likely to benefit from further MMIC development, and presents recommendations for NASA development activities to address the needs of these applications.
A logic design has been conceived for a field-programmable gate array (FPGA) that would implement a complex system of multiple digital state-space filters. The main innovative aspect of this design lies in providing for reuse of parts of the FPGA hardware to perform different parts of the filter computations at different times, in such a manner as to enable the timely performance of all required computations in the face of limitations on available FPGA hardware resources. The implementation of the digital state-space filter involves matrix vector multiplications, which, in the absence of the present innovation, would ordinarily necessitate some multiplexing of vector elements and/or routing of data flows along multiple paths. The design concept calls for implementing vector registers as shift registers to simplify operand access to multipliers and accumulators, obviating both multiplexing and routing of data along multiple paths. Each vector register would be reused for different parts of a calculation. Outputs would always be drawn from the same register, and inputs would always be loaded into the same register. A simple state machine would control each filter. The output of a given filter would be passed to the next filter, accompanied by a "valid" signal, which would start the state machine of the next filter. Multiple filter modules would share a multiplication/accumulation arithmetic unit. The filter computations would be timed by use of a clock having a frequency high enough, relative to the input and output data rate, to provide enough cycles for matrix and vector arithmetic operations. This design concept could prove beneficial in numerous applications in which digital filters are used and/or vectors are multiplied by coefficient matrices. Examples of such applications include general signal processing, filtering of signals in control systems, processing of geophysical measurements, and medical imaging. For these and other applications, it could be advantageous to combine compact FPGA digital filter implementations with other application-specific logic implementations on single integrated-circuit chips. An FPGA could readily be tailored to implement a variety of filters because the filter coefficients would be loaded into memory at startup.
A test method for the evaluation of metallization on semiconductors is presented and discussed. The method has been prepared in MIL-STD format for submittal as a proposed addition to MIL-STD-883. It is applicable to discrete devices and to integrated circuits and specifically addresses batch-process oriented defects. Quantitative accept/reject criteria are given for contact windows, other oxide steps, and general interconnecting metallization. Figures are provided that illustrate typical types of defects. Apparatus specifications, sampling plans, and specimen preparation and examination requirements are described. Procedures for glassivated devices and for multi-metal interconnection systems are included.
Standardized methods are established for screening of JAN B microcircuits and JANTXV semiconductor components for space mission or other critical applications when JAN S devices are not available. General specifications are provided which outline the DPA (destructive physical analysis), environmental, electrical, and data requirements for screening of various component technologies. This standard was developed for Air Force Space Division, and is available for use by other DOD agencies, NASA, and space systems contractors for establishing common screening methods for electronic components.
The properties are reviewed of heterostructure devices for microwave-monolithic-integrated circuits (MMICs) and optoelectronic integrated circuits (OICs). Specific devices examined include lattice-matched and pseudomorphic InAlAs/InGaAs high-electron mobility transistors (HEMTs), mixer/multiplier diodes, and heterojunction bipolar transistors (HBTs) developed with a number of materials. MMICs are reviewed that can be employed for amplification, mixing, and signal generation, and receiver/transmitter applications are set forth for OICs based on GaAs and InP heterostructure designs. HEMTs, HBTs, and junction-FETs can be utilized in combination with PIN, MSM, and laser diodes to develop novel communication systems based on technologies that combine microwave and photonic capabilities.
With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.
With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.
Brief descriptions are given of research being carried out in the field of knowledge representation. Dynamic simulation and modelling of planning systems with real-time sensor inputs; development of domain-independent knowledge representation tools which can be used in the development of application-specific expert and planning systems; and development of a space-borne very high speed integrated circuit processor are among the projects discussed.
Advancements in technology have allowed the miniaturization of systems used in aerospace vehicles. This technology is driven by the need for next-generation systems that provide reliable, responsive, and cost-effective range operations while providing increased capabilities such as simultaneous mission support, increased launch trajectories, improved launch, and landing opportunities, etc. Leveraging the newest technologies, the command and telemetry processor (CTP) concept provides for a compact, flexible, and integrated solution for flight command and telemetry systems and range systems. The CTP is a relatively small circuit board that serves as a processing platform for high dynamic, high vibration environments. The CTP can be reconfigured and reprogrammed, allowing it to be adapted for many different applications. The design is centered around a configurable field-programmable gate array (FPGA) device that contains numerous logic cells that can be used to implement traditional integrated circuits. The FPGA contains two PowerPC processors running the Vx-Works real-time operating system and are used to execute software programs specific to each application. The CTP was designed and developed specifically to provide telemetry functions; namely, the command processing, telemetry processing, and GPS metric tracking of a flight vehicle. However, it can be used as a general-purpose processor board to perform numerous functions implemented in either hardware or software using the FPGA s processors and/or logic cells. Functionally, the CTP was designed for range safety applications where it would ultimately become part of a vehicle s flight termination system. Consequently, the major functions of the CTP are to perform the forward link command processing, GPS metric tracking, return link telemetry data processing, error detection and correction, data encryption/ decryption, and initiate flight termination action commands. Also, the CTP had to be designed to survive and operate in a launch environment. Additionally, the CTP was designed to interface with the WFF (Wallops Flight Facility) custom-designed transceiver board which is used in the Low Cost TDRSS Transceiver (LCT2) also developed by WFF. The LCT2 s transceiver board demodulates commands received from the ground via the forward link and sends them to the CTP, where they are processed. The CTP inputs and processes data from the inertial measurement unit (IMU) and the GPS receiver board, generates status data, and then sends the data to the transceiver board where it is modulated and sent to the ground via the return link. Overall, the CTP has combined processing with the ability to interface to a GPS receiver, an IMU, and a pulse code modulation (PCM) communication link, while providing the capability to support common interfaces including Ethernet and serial interfaces boarding a relatively small-sized, lightweight package.
This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.