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Evaluation and implementation tasks for the NASA-wide electronic publishing system known as networked DOCUTECH are examined and the system configuration is graphically depicted. DOCUTECH provides the capability to print on demand electronically stored documents. Use of the electronic publishing system in several applications has generated productivity gains ranging from 33 to 88 percent at geographically dispersed NASA centers.
A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.
Additive manufacturing techniques for electronics, including Aerosol Jet Printing (AJP), Syringe Printing, and Ink Jet Printing, will enable new detector assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument and electronics concepts by reducing trace widths down to 10 microns, printing on complex geometries, and allowing new concept production. This presentation summarizes efforts developing printing techniques to manufacture detectors and circuitry for space applications.
The Energetic Neutrons campaign led by Sandia National Laboratories (SNL) had a successful year testing electronic devices and printed circuit boards (PCBs) under 14 MeV neutron irradiation at OMEGA. During FY21 Sandia’s Neutron Effects Diagnostics (NEDs) and data acquisition systems were upgraded to test novel commercial off-the-shelf and Sandia-fabricated electronic components that support SNL’s National Security mission. The upgrades to the Sandia platform consisted of new cable chains, sample mount fixtures and a new fiber optics platform for testing optoelectronic devices.
This document describes a conformable substrate that includes a hydrogel having adhesion-promoting moieties, said adhesion-promoting moieties comprising one or more catechol groups. The conformable substrate includes an array of microelectrodes bonded to the hydrogel by the adhesion-promoting moieties via the one or more catechol groups. This document also describes a method for transfer printing of an electronic structure to a hydrogel. The method includes the steps of coating a donor substrate with a film of polyacrylic acid, crosslinking the film of polyacrylic acid in a solution comprising divalent ions, patterning a microelectrode array onto the crosslinked film of polyacrylic acid, laminating an adhesive hydrogel substrate onto the donor substrate coated by the crosslinked film of polyacrylic acid comprising the patterned microelectrode array, and separating the crosslinked film of polyacrylic acid from the donor substrate in a monovalent solution.
Two-dimensional layered materials/flakes, also known as crystalline atom-thick layer nanosheets, have recently been receiving great attention in electronics fabrication due to their unique and intriguing properties. The k-layer coverage area (i.e., the area covered by k number of overlapping layers) of the printed flake pattern significantly impacts on the properties of the printed electronics. In this work, we constructed a statistical model to describe the k-layer coverage of randomly distributed two-dimensional materials. A series of results are obtained to provide not only the expectation but also the variance of the coverage area. The boundary effects on the random flakes coverage are also studied. In addition, an approximated statistical testing approach is also developed in this work to detect abnormal coverage patterns. Furthermore, the case studies based on simulated data and real flakes images obtained from the inkjet printing process demonstrate the accuracy and effectiveness of the proposed model and analysis methods.
Aerosol jet printing offers a versatile, high-resolution prototyping capability for flexible and hybrid electronics. Despite its rapid growth in recent years, persistent problems such as process drift hinder the adoption of this technology in production environments. Here we explore underlying causes of process drift during aerosol jet printing and introduce an engineered solution to improve deposition stability. In this work it is shown that the ink level within the cartridge is a critical factor in determining atomization efficiency, such that the reduction in ink volume resulting from printing itself can induce significant and systematic process drift. By integrating a custom 3D-printed cartridge with an ink recirculation system, ink composition and level within the cartridge are better maintained. This strategy allows extended duration printing with improved stability, as evidenced by 30 h of printing over 5 production runs. This provides an important tool for extending the duration and improving reliability for aerosol jet printing, a key factor for integration in practical manufacturing operations.
In this project PARC and Energy ETC aimed to develop an ultra-low cost, size, weight, and power (SWaP) printed CO 2 sensor system for occupancy detection to enable Demand Control Ventilation (DCV) on a per-room basis. The CO 2 sensor technology is based on the temperature variation when CO 2 reversibly physisorbs to a highly conductive and high surface area sorbent surface, and is compatible with integration with PARC innovations in printed sensors and flexible electronics, for which PARC is a globally leading research center. The printed CO 2 sensor itself is designed to be compatible with PARC’s “peel-and-stick” platform of ultra-low power, low-cost, distributed sensors, and to facilitate real-time DCV based on overall indoor air quality (IAQ). Previously, PARC has developed flexible hybrid electronics (FHE) compatible materials to measure humidity, temperature, light, strain, and gases such as carbon monoxide, methane, ammonia, and hydrogen sulfide. Through this project, PARC developed FHE-compatible materials to measure CO 2 . Thus, with one <$15 FHE “peel-and-stick” based sensor node, a building management system (BMS) will be able to capture a complete picture of the indoor environment. This includes IAQ, light, temperature, and other comfort factors that impact building operations. Combined with optimized DCV, this low-cost sensor capability can be a key enabler of annual primary energy savings of ~ 0.3-0.4 Quad in commercial buildings while ensuring healthy IAQ. Energy ETC is a leader in supplier-agnostic BMS deployments and will design the commissioning and deployment procedures to maximize system interoperability.
The Energetic Neutrons campaign led by Sandia National Laboratories (SNL) had a successful year testing electronic devices and printed circuit boards (PCBs) under 14 MeV neutron irradiation at OMEGA. During FY20 the Energetic Neutrons campaign increased the number and complexity of experiments, continued collaborations with external organizations, and generated knowledge that supports SNL’s National Security mission. In FY20 the Energetic Neutrons campaign was executed by an early career team led by a new PI. The SNL team members were trained to take over new responsibilities during the shot day to increase the number and complexity of experiments in the campaigns. Also, in FY20 for the first time the Energetic Neutrons campaign had a graduate student contributing with pre and post-irradiation characterizations at SNL of the semiconductor devices irradiated at OMEGA. In FY20 SNL collaborated with the Air Force Nuclear Weapons Center (AFNWC) and supported experiments related to radiation effects in semiconductor devices. SNL also gave the opportunity to ride along to Los Alamos National Laboratory and multiple scientists from MIT and LLE. SNL continued using the last two generations of the Neutron Effects Diagnostics (NEDs) to field active and passive experiments but also redesigned the latest generation of the NEDs to accommodate larger components and improve the vacuum sealing as shown in figure 1a. The redesigned NEDs allowed SNL to perform active tests of a high voltage (HV) PCB for the first time at OMEGA; where signals before, during and after the irradiation were recorded. The HV PCB installed in one of the SNL NEDs is shown in figure 1b where a 3D-printed nosecone was used to check for mechanical and electrical interference. Passive irradiations of multiple components were followed up with leakage current, gain measurements and radiation-induced defect characterization.
U.S. aerospace engineering faculty and students were surveyed as part of the NASA/DoD Aerospace Knowledge Research Project. Faculty and students were viewed as information processors within a conceptual framework of information seeking behavior. Questionnaires were received from 275 faculty members and 640 students, which were used to determine: (1) use and importance of information sources; (2) use of specific print sources and electronic data bases; (3) use of information technology; and (4) the influence of instruction on the use of information sources and the products of faculty and students. Little evidence was found to support the belief that instruction in library or engineering information use has significant impact either on broadening the frequency or range of information products and sources used by U.S. aerospace engineering students.
Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.
Electrical characterization of several 4H-SiC Schottky diodes with Aerosol-Jet printed gold (Au), silver (Ag), and platinum (Pt) contacts was performed using forward and reverse current–voltage (IV) measurements. From these measurements, device parameters such as Schottky barrier height and ideality factor were determined; however, many of the devices exhibited nonideal behavior and inferior performance characterized by ideality factors significantly greater than one, disproportionate low voltage leakage current and low barrier heights. Forward current–voltage (FIV) characteristics were fitted to an inhomogeneous barrier height theory to explain the abnormal behavior exhibited by the printed devices. Here, transmission electron microscopy (TEM) of the device cross-sections was performed to investigate the printed metal and semiconductor epitaxial layer interface, which revealed the imperfections in the metal–semiconductor contact. Despite these irregularities, alpha radiation detection capability of these devices was still achieved with an energy resolution of 1.89% at 5.486 MeV, and the best achievable resolution at 0.51% with no energy degradation of 5.486 MeV.
R2R processing is used to manufacture a wide range of products for various applications which span many industrial business sectors. The overall R2R methodology has been in use for decades and this continuous technique traditionally involves deposition of material(s) onto moving webs, carriers or other continuous belt-fed or conveyor-based processes that enable successive steps to build a final version which serves to support the deposited materials. Established methods that typify R2R processing include tape casting, silk-screen printing, reel-to-reel vacuum deposition/coating, and R2R lithography. Products supported by R2R manufacturing include micro-electronics, electro-chromic window films, PVs, fuel cells for energy conversion, battery electrodes for energy storage, and barrier and membrane materials. Due to innovation in materials and process equipment, high-quality yet very low-cost multilayer technologies have the potential to be manufactured on a very cost-competitive basis. To move energy-related products from high-cost niche applications to the commercial sector, the means must be available to enable manufacture of these products in a cost-competitive manner that is affordable. Fortunately, products such as fuel cells, thin- and mid-film PVs, batteries, electrochromic and piezoelectric films, water separation membranes, and other energy saving technologies readily lend themselves to manufacture using R2R approaches. However, more early-stage research is needed to solve the challenge of linking the materials (particles, polymers, solvents, additives) used in ink and slurry formulations and the coating and drying processes to the ultimate performance of the final R2R product, especially for a process that uses multiple layers of deposition to achieve the end product. To solve the problems associated with these challenges, the R2R Collaboration is executing a research program with outcomes that will ultimately link modeling, processing, metrology and defect detection tools, thereby directly relating the properties of constituent particles and processing conditions to the performance of final devices. This collaborative approach was designed to foster identification and development of materials and processes related to R2R for clean-energy materials development. Using computational and experimental capabilities by acknowledged subject matter experts within the supported National Laboratory system, this project leverages the capabilities and expertise at each of five National Laboratories to further the development of multilayer technologies that will enable high-volume, cost-competitive platforms. A typical R2R process has three steps: (1) mixing of particles and various constituents in a slurry, (2) coating of the ink/slurry mixture on a substrate, and (3) drying/curing and processing of the coating. Final performance of devices made via R2R processes is dependent on the active materials (e.g., electrochemical particles in battery or fuel cell electrodes) and the device structure that stems from the governing component interactions within the various steps. However, a fundamental understanding of the underlying mechanisms and phenomena is still lacking, which is why industrial-scale R2R process development and manufacturing is still largely empirical in nature. The FY 2019 through FY 2021 program addresses aspects of the following two targets from the AMO Multi-Year Program Plan: (1) Target 8.1 Develop technologies to reduce the cost per manufactured throughput of continuous R2R manufacturing processes. (A) Increasing throughput of R2R processes by 5 times for batteries (to 50 square feet per minute (50 ft 2 /min)) and capacitors and 10 times for printed electronics and the manufacture of other substrates and MEs used in support of these products. (B) Developing resolution capabilities to enable registration and alignment that will detect, align, and co-deposit multiple layers of coatings and print < 1-micron (1 µm) features using continuous process scalable for commercial production. (C) Developing scalable and reliable R2R processes for solution deposition of ultra-thin (<10 nm) films for active and passive materials. (D) Develop in-line multilayer coating technology on thin films with yields greater than 95%. (2) Target 8.2 Develop in-line instrumentation tools that will evaluate the quality of single and multilayer materials in-process. (A) Developing in-line QC technologies and methodologies for real-time identification of defects and expected product properties “in-use/application” during continuous processing at all size-scales with a focus on the “micro” and “nano” scale traces, lines, and devices, i.e., <1 μm at 300 ft./min for R2R processing in air and <10 nm at 20 ft./min for vacuum (B) Developing technologies to increase the measurement frequency of surface rheology without significant cost increases with a goal of a 10-nanometer in-line profilometry at a production rate of 100,000 square millimeters per minute (100,000 mm 2 /min).
Superconducting films made in relatively simple process. Thick films of YBa2Cu3O7-x superconductor deposited on highly-polished alumina substrates by screen printing. In addition to simplicity, screen-printing technique offers advantage that patterns for electronic and microwave circuits and devices printed directly, without additional etching steps.
New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.
Silicone, a commonly used household and construction adhesive, filler, or sealant, is also known for its flexibility, thermal stability, and insulating properties. It is viable as a conformally 3D-printed elastomeric matrix for flexible electronics and biomedical applications. Since most of the popular 3D printing methods use precise print specifications and defined resolution, this study explored the 3D printability of commercial silicone adhesives via a paste extrusion setup. Its viscoelastic and composition properties including the dimensional accuracy and mechanical properties of printed objects using controlled print parameters have been investigated. Finally, these experimental processes in 3D printing should pave the way in using materials originally intended for household use.
On-line access to complete texts of scholarly journal articles, conference papers, and books is facilitated by rapidly developing World-wide Web Internet access and capabilities. Meanwhile, print publications continue to be produced and read in spite of the proliferation of many networked electronic publications. The purpose of this presentation is to highlight fundamental issues impacting stakeholder groups, as the trend continues towards migration from paper to affordable ubiquitous networked full-text publications. Librarians, publishers, authors and end-users have various viewpoints, interests, and concerns. There are many issues challenging all stakeholder groups. For instance, all share concerns about administering copyright compliance and enforcing fair use. Uncontrollable electronic downstreaming could result in infringed copyright, while limiting a publisher's entitled revenue stream. Moreover, metered fee-based access may hamper scholarly information research. And, self-authoring on the Internet without peer filtering could lead to information clutter. Many related issues challenge librarians in particular. Among these are rising journal subscription prices, regardless if offered in print or electronic. Some electronic offerings are independent of print, others supplement or duplicate print; several publishers presently require subscribing to print in order to access electronic. Furthermore, numbers of publications are n'ow being marketed via the Internet directly to end-users, which can be viewed as encouraging users to bypass the traditional library. A key issue challenging publishers today is the rapidly expanding electronic user base that is demanding delivery of added-value full-text to desktop computers. Also of growing concern appears to be the decline in print sales to libraries, thereby reducing traditional revenue stream potential. Nowadays, publishers are more hesitant about investing in the production of publications geared toward small niche subjects, since these tend to require higher pricing and carry limited sales potential. Both electronic and print publications necessitate similar editorial, production, operating, and marketing dollars. Tradeoffs owing to delivery format difference do not necessarily mean less dollars need to be spent. Authors wishing to publish books are facing a decline in the role of scholarly monographs in electronic media. However, they are witnessing increased roles of electronic preprints and electronic journal articles. Moreover, the Internet fosters self-publishing without peer monitoring or formal review. Issues challenging end-users include electronic barriers to peer-reviewed formal published works (i.e., fee-based subscriptions to journal literature vs. traditional free-library concept). This often means password only access or IP address controlled site-licensed access. Also, in an uncontrolled Internet environment, sometimes there is a blurring of publication authorship/ownership, as various pieces of publications are cut/pasted into/re-posted on various, disconnected Web searchable home pages.
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.