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All sources NASA NTRS DOE OSTI

DOE OSTI2021

Chemomechanical effect of reduced graphene oxide encapsulation on hydrogen storage performance of Pd nanoparticles

Primary chemomechanical impacts of confinement on hydrogen storage performance are studied using a nanolaminate structure where reduced graphene oxide (rGO) encapsulates palladium (Pd) nanoparticles. Three contributing factors are identified that can alter the reaction enthalpy: nanosizing, chemical interaction with the encapsulant, and mechanical stress induced strain from a combination of clamping force and lateral pulling force exerted on the Pd nanoparticles. The mechanical contributions are quantified by combining transmission electron microscopy, ab initio computation, and continuum elasticity theory, from which the encapsulation is found to exert an additional strain of 4.96% and 2.99% before and after hydrogen absorption, respectively, increasing the Pd and Pd hydride (PdH x ) reaction enthalpy by 1.3–2.8 kJ (mol H 2 ) -1 . The effect of the chemical interaction with rGO also raises the reaction enthalpy by up to 1.6 kJ (mol H 2 ) -1 , while the nanosizing effect decreases the reaction enthalpy. The three contributing factors to the reaction enthalpy are found to be similar in magnitude, where the net effect is in agreement with the measured enthalpy increase of 3.7 kJ (mol H 2 ) -1 from the bulk value. Hydrogen absorption kinetics and capacity also improved, which is attributed to facile nucleation of the hydrogen-rich phase enabled by the inhomogeneous strain distribution over the encapsulated PdHx nanoparticles. These results demonstrate that the chemomechanical effect can be controlled in the nanolaminate structure, providing an ideal template for tuning hydrogen storage performance.

08 HYDROGEN↗

DOE OSTI2019

Electrostatic imaging of encapsulated graphene

Devices made from two-dimensional (2D) materials such as graphene and transition metal dichalcogenides exhibit remarkable electronic properties of interest to many subdisciplines of nanoscience. Owing to their 2D nature, their quality is highly susceptible to contamination and degradation when exposed to the ambient environment. Protecting the 2D layers by encapsulation between hexagonal boron nitride (hBN) layers significantly improves their quality. Locating these samples within the encapsulant and assessing their integrity prior to further processing then becomes challenging. Here we show that conductive scanning probe techniques such as electrostatic force and Kelvin force microscopy make it possible to visualize the encapsulated layers, their charge environment and local defects on the sub-micrometer scale. Our techniques are employed without requiring electrical contact to the embedded layer, providing valuable feedback on the device's local electronic quality prior to any device etching or electrode deposition. We show that these measurement modes, which are simple extensions of atomic force microscopy, are perfectly suited for imaging encapsulated conductors and their local charge environments.

36 MATERIALS SCIENCE↗

DOE OSTI2018

Evaluation of the PID-s Susceptibility of Modules Encapsulated in Materials of Varying Resistivity

A common mechanism of potential-induced degradation is by shunting (PID-s) in PV modules, usually associated with the transport of sodium ions (Na+) through the encapsulant and penetrating the front junction of solar cells under voltage stress. Encapsulants with high volume resistivity have been suggested as a potentially cost-effective solution to this degradation mechanism. In this work, we examine three polyolefin elastomer (POE) encapsulants with volume resistivity varying over two orders of magnitude (ranging from 9 x 10^13 to 1 x 10^16 ..omega.. cm) that show equivalent and complete resistance to PID at the damp heat stress test level of 85 degrees C and 85% relative humidity and -1000 V system voltage stress. Performance is compared with a PID-susceptible ethylene vinyl acetate (EVA) encapsulant with resistivity 1 x 10^13 ..omega.. cm. The independence of PID susceptibility with respect to the resistivity of the polyolefin is attributed to the impermeability of POEs to Na + ions. Specific ions (i.e. Na + ), rather than charge-carrying species in general, are responsible for this degradation mechanism.

14 SOLAR ENERGY↗

DOE OSTI2015

Integration of molecular-layer-deposited aluminum alkoxide interlayers into inorganic nanolaminate barriers for encapsulation of organic electronics with improved stress resistance

Diffusion barrier stacks for the encapsulation of organic electronics made from inorganic nanolaminates of Al{sub 2}O{sub 3} and TiO{sub 2} with aluminum alkoxide interlayers have been deposited by atomic layer deposition (ALD) and molecular layer deposition (MLD). As a part of the MLD process development, the deposition of aluminum alkoxide with low a density of about 1.7 g/cm{sup 3} was verified. The ALD/MLD diffusion barrier stack is meant to be deposited either on a polymer film, creating a flexible barrier substrate, or on top of a device on glass, creating a thin-film encapsulation. In order to measure the water vapor transmission rate (WVTR) through the barrier, the device is replaced by a calcium layer acting as a water sensor in an electrical calcium test. For the barrier stack applied as thin-film encapsulation on glass substrates, high resolution scanning electron microscopy investigations indicate that the inorganic nanolaminates without MLD interlayers are brittle as they crack easily upon the stress induced by the corroding calcium below. The introduction of up to three MLD interlayers of 12 nm each into the 48 nm barrier film laminate successfully mitigates stress issues and prevents the barrier from cracking. Using the three MLD interlayer configurations on glass, WVTRs of as low as 10{sup −5} g/m{sup 2}/d are measured at 38 °C and 32% relative humidity. On polymer barrier substrates, the calcium is evaporated onto the barrier stack and encapsulated with a cavity glass. In this configuration, the corroding calcium has space for expansion and gas release without affecting the underlying barrier film. In consequence, a WVTR of about 3 × 10{sup −3} g/m{sup 2}/d is measured for all samples independently of the number of MLD interlayers. In conclusion, a stabilization and preservation of the ALD barrier film against mechanical stress is achieved by the introduction of MLD interlayers into the inorganic nanolaminate.

36 MATERIALS SCIENCE↗

DOE OSTI2022

Reliability Evaluation of Bifacial and Monofacial Glass/Glass Modules with EVA and non-EVA Encapsulants

The market share for bifacial modules is projected to be doubled from 30% to 60% in the next ten years. For the monofacial crystalline silicon glass/backsheet (G/B) modules, extensive reliability data has been available for over 40 years. However, practically little/no long-term field or accelerated reliability test data is available for the new generation glass/glass (G/G) bifacial modules and glass/transparent (G/T) bifacial modules. Therefore, the primary motivation of this project was to identify the reliability strengths and weaknesses of new generation G/G modules compared to G/B modules. In this 3-year project, the goal was to objectively recommend the best construction materials for the new generation G/G (bifacial) modules through a systematic experimental approach with appropriate tasks including: Evaluation of field retrieved old-generation G/G modules; Inspection of new-generation G/G modules installed in the plants; Evaluation of new-generation G/G, G/B and G/T modules using EAST (Extended Accelerated Stress Testing), CAST (Combined Accelerated Stress Testing) and FAST (Field Accelerated Stress Testing); and, dynamic literature search and review. Major accomplishments and outcomes of this project are: Accomplishments: Evaluated more than 60 field retrieved modules and constructed and characterized more than 135 mini-modules with three substrate types (G, B, and T), two encapsulant types (EVA and POE), and two cell types (monofacial and bifacial) as well as evaluated more than 30 commercial G/G and G/B modules; Subjected all the modules to multitude characterization tests and various indoor and outdoor accelerated stress tests including FAST (Field Accelerated Stress Testing), EAST (Extended Accelerated Stress Testing), and CAST (Combined Accelerated Stress Testing) to identify and correlate the failure modes in both field and lab tests. Outcomes: Based on the accelerated test results and handling/mounting experience obtained in this project, the recommended best construction for the glass/glass modules is: “Framed GG modules with cut-cells and POE encapsulant (UVpass front; UVpass back).” However, from a statistical and manufacturing point of view (along with stakeholders surveys), the following cautionary notes are added to the above-mentioned recommendation: (i) Cut cells could introduce a higher level of manufacturing issues, including a higher number of cell interconnects; (ii) POE encapsulant is more expensive than EVA and could present a delamination risk and lower throughput during manufacturing due to lower adhesion strength. Other encapsulants, such as coextruded EPE (EVA/POE/EVA), are also recommended to be investigated. The potential public benefit of the proposed project is to present the strengths and weaknesses of glass/glass modules, so an informed procurement decision can be made.

14 SOLAR ENERGY↗

NASA NTRS1979

Develop Silicone Encapsulation Systems for Terrestrial Silicon Solar Arrays

The results for Task 3 of the Low Cost Solar Array Project are presented. Task 3 is directed toward the development of a cost effective encapsulating system for photovoltaic modules using silicon based materials. The technical approach of the contract effort is divided into four special tasks: (1) technology review; (2) generation of concepts for screening and processing silicon encapsulation systems; (3) assessment of encapsulation concepts; and (4) evaluation of encapsulation concepts. The candidate silicon materials are reviewed. The silicon and modified silicon resins were chosen on the basis of similarity to materials with known weatherability, cost, initial tangential modulus, accelerated dirt pick-up test results and the ratio of the content of organic phenyl substitution of methyl substitution on the backbone of the silicon resin.

Source record↗

NASA NTRS1978

Evaluations of candidate encapsulation designs and materials for low-cost silicon photovoltaic arrays

Three encapsulation designs for silicon photovoltaic arrays based on cells with silk-screened Ag metallization have been evaluated: transparent polymeric coatings over cells laminated between two films or sheets of polymeric materials; cells adhesively bonded to a glass cover with a polymer pottant and a glass or other substrate component. Silicone and acrylic coatings were assessed, together with acrylic sheet, 0.635 mm fiberglass-reinforced polyester sheet, 0.102 mm polycarbonate/acrylic dual-layer film, 0.127 mm fluorocarbon film, soda-lime glass, borosilicate glass, low-iron glass, and several adhesives. The encapsulation materials were characterized by light transmittance measurements, determination of moisture barrier properties and bond strengths, and by the performance of cells before and after encapsulation. Silicon and acrylic coatings provided inadequate protection. Acrylic and fluorocarbon films displayed good weatherability and acceptable optical transmittance. Borosilicate, low-iron and soda-lime-float glasses were found to be acceptable candidate encapsulants for most environments.

Gaines, G. B.↗

NASA NTRS1981

A quantitative method for photovoltaic encapsulation system optimization

It is pointed out that the design of encapsulation systems for flat plate photovoltaic modules requires the fulfillment of conflicting design requirements. An investigation was conducted with the objective to find an approach which will make it possible to determine a system with optimum characteristics. The results of the thermal, optical, structural, and electrical isolation analyses performed in the investigation indicate the major factors in the design of terrestrial photovoltaic modules. For defect-free materials, minimum encapsulation thicknesses are determined primarily by structural considerations. Cell temperature is not strongly affected by encapsulant thickness or thermal conductivity. The emissivity of module surfaces exerts a significant influence on cell temperature. Encapsulants should be elastomeric, and ribs are required on substrate modules. Aluminum is unsuitable as a substrate material. Antireflection coating is required on cell surfaces.

Garcia, A., III↗

NASA NTRS1982

An accelerated stress testing program for determining the reliability sensitivity of silicon solar cells to encapsulation and metallization systems

The use of accelerated testing methods in a program to determine the reliability attributes of terrestrial silicon solar cells is discussed. Different failure modes are to be expected when cells with and without encapsulation are subjected to accelerated testing and separate test schedules for each are described. Unencapsulated test cells having slight variations in metallization are used to illustrate how accelerated testing can highlight different diffusion related failure mechanisms. The usefulness of accelerated testing when applied to encapsulated cells is illustrated by results showing that moisture related degradation may be many times worse with some forms of encapsulation than with no encapsulation at all.

Lathrop, J. W.↗

NASA NTRS1986

Tests of Solar-Array Encapsulants

Materials tested for degradation by heat and light. Report presents early results of continuing series of photothermal aging tests of some candidate encapsulating materials for solar photovoltaic modules. Objectives of testing program: contribute to development of durable, low-cost encapsulants and predict lifetimes of encapsulated photovoltaic modules placed outdoors. Toward these ends, tests designed to reveal physical and chemical degradation mechanisms that affect encapsulants.

Liang, R. H.↗

DOE OSTI2026

Effect of metal encapsulation on bulk superconducting properties of niobium thin films used in qubits

Niobium metal occupies nearly 100% of the volume of a typical 2D transmon device. While the aluminum Josephson junction is of utmost importance, maintaining quantum coherence across the entire device means that pair-breaking in Nb leads, capacitive pads, and readout resonators can be a major source of decoherence. The established contributors are surface oxides and hydroxides, as well as absorbed hydrogen and oxygen. Metal encapsulation of freshly grown surfaces with non-oxidizing metals, preferably without breaking the vacuum, is a successful strategy to mitigate these issues. While the positive effects of encapsulation are undeniable, it is important to understand its impact on the macroscopic behavior of niobium films. We present a comprehensive study of the bulk superconducting properties of Nb thin films encapsulated with gold and palladium/gold, and compare them to those of bare Nb films. Magneto-optical imaging, magnetization, resistivity, and London and Campbell penetration depth measurements reveal significant differences in encapsulated samples. Both sputtered, and epitaxial Au-capped films exhibit the highest residual resistivity ratio and superconducting transition temperature, as well as the lowest upper critical field, London penetration depth, and critical current. These results are in good agreement with the microscopic theory of anisotropic normal and superconducting states of Nb. We conclude that pair-breaking in the bulk of niobium films, driven by disorder throughout the film rather than just at the surface, is a significant source of quantum decoherence in transmons. We also conclude that gold capping not only passivates the surface but also affects the properties of the entire film, significantly reducing the scattering rate due to defects likely induced by surface diffusion if the film is not protected immediately after fabrication.

Datta, Amlan [Ames Lab; Iowa State U.]↗

DOE OSTI2020

Incorporating the Nanoscale Encapsulation Concept from Liquid Electrolytes into Solid-State Lithium–Sulfur Batteries

Solid-state Li–S batteries are attractive due to their high energy density and safety. However, it is unclear whether the concepts from liquid electrolytes are applicable in the solid state to improve battery performance. Here, we demonstrate that the nanoscale encapsulation concept based on Li 2 S@TiS 2 core–shell particles, originally developed in liquid electrolytes, is effective in solid polymer electrolytes. Using in situ optical cell and sulfur K-edge X-ray absorption, we find that polysulfides form and are well-trapped inside individual particles by the nanoscale TiS 2 encapsulation. We see that this TiS 2 encapsulation layer also functions to catalyze the oxidation reaction of Li 2 S to sulfur, even in solid-state electrolytes, proven by both experiments and density functional theory calculations. A high cell-level specific energy of 427 W·h·kg –1 is achieved by integrating the Li 2 S@TiS 2 cathode with a poly(ethylene oxide)-based electrolyte and a lithium metal anode. This study points to the fruitful direction of borrowing concepts from liquid electrolytes into solid-state batteries.

25 ENERGY STORAGE↗

DOE OSTI2025

Encapsulation of Monolayer 2D Materials Using Kinetic Energy-Controlled Pulsed Laser Deposition

The integration of monolayer (ML) two-dimensional (2D) materials into next-generation microelectronics, optoelectronics, and sensors is hindered by their sensitivity to environmental exposure. Deposition of additional layers for encapsulation or growth on ML 2D materials by versatile but energetic plasma techniques such as pulsed laser deposition (PLD) has not been considered at the monolayer level because of potential damage caused by hyperthermal species with kinetic energies (KEs) exceeding the threshold displacement energy (TDE) of the ML. Here, we describe a general strategy to understand and mitigate damage during PLD by reducing the incident KE of ablated species below the TDE of the 2D monolayer using background gas collisions. Ion flux diagnostics, combined with in situ Raman spectroscopy of monolayer graphene during PLD of amorphous boron nitride (a-BN) as a dielectric encapsulation layer, show that damage is primarily correlated with fast ions that penetrate the background gas in accordance with Beer’s Law and are often overlooked in ICCD imaging due to the dominance of the bright, delayed plasma luminescence. Significantly, if fast ions are eliminated and a ∼2 nm-thick a-BN layer is “soft landed”, the monolayer graphene is effectively protected from damage by high KE species in the boron nitride plasma plume. Deposited a-BN films display a characteristic dielectric constant of 3.6 at 100 kHz and tunable charge injection properties. Our results enable PLD as a viable option for encapsulation and thin film growth onto ML 2D materials, with implications for both fundamental research and device integration.

2D materials↗

NASA NTRSDate not supplied

Microbes Share Rides Too: Updating Encapsulated Bioburden Estimate Values in Electronic Parts Common to Class D Mission Platforms.

As NASA develops more planetary protection missions that are Category III and in the Class D/rideshare mission platform, there is an increasing reliance on estimation of prelaunch bioburden to understand needs for burn up and breakup analyses or other methods to meet pre-launch bioburden levels. Current levels estimated for the encapsulated bioburden of semiconductor parts cited by NASA have been based on estimates of semiconductor manufacturing approaches from the 1970s that do not incorporate over fifty years of evolving cleanliness of semiconductor manufacturing processes and facilities. This investigation will focus on direct sampling of semiconductor parts for encapsulated bioburden values, drawing upon Goddard’s strength in EEE parts, supply chain management, destructive parts analysis and existing local planetary protection lab facilities to prepare and measure encapsulated bioburden at a statistically significant level for standard electronics parts common to known Class D/rideshare platforms.

planetary protection↗

DOE OSTI2014

Encapsulation of LiFePO{sub 4} by in-situ graphitized carbon cage towards enhanced low temperature performance as cathode materials for lithium ion batteries

The severe capacity decay of LiFePO{sub 4} at low temperatures (≤0 °C) limits its wide applications as cathode materials for energy storage batteries. Creating comprehensive carbon network between particles with improved electronic conductivity is a well known solution to this problem. Here, a novel structured LiFePO{sub 4}/C composite was prepared by a facile solid state route, in which nanosized LiFePO{sub 4} spheres were encapsulated by in-situ graphitized carbon cages. With the enhancement in electronic conductivity (2.15e−1 S cm{sup −1}), the composite presented excellent rate performance at room temperature and remarkable capacity retention at −40 °C, with charge transfer resistance much lower than commercial LiFePO{sub 4}. - Graphical abstract: A novel structured LiFePO{sub 4/}C composite was prepared by a facile solid state route, in which nanosized LiFePO{sub 4} spheres were encapsulated by in-situ graphitized carbon cages. - Highlights: • Several nano-sized LiFePO{sub 4} particles are encapsulated in carbon cage. • Carbon is in-situ graphitized with enhanced electronic conductivity. • The as prepared LiFePO{sub 4} exhibits notable capacity retention at −40 °C. • R{sub ct} is lowered by a factor of ∼10 compared with commercial LiFePO{sub 4}.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2022

Dependence of adhesion on degradation mechanisms of ethylene co-vinyl acetate encapsulants over the lifetime of photovoltaic modules

The long-term reliability of encapsulation has a critical impact on the overall cost and effectiveness of photovoltaic modules. An often overlooked but important element of this reliability concerns adhesive degradation of the encapsulant, which results in delamination. This work critically examines the degradation mechanisms – deacetylation, β-scission, and hydrolytic depolymerization – primarily responsible for adhesion loss in ethylene co-vinyl acetate (EVA) encapsulants to provide evidence and clarity regarding the contribution of these mechanisms to the adhesive degradation over the lifetime of a module. EVA samples obtained from mini-modules exposed in two sets of controlled, accelerated conditions – with and without ultraviolet (UV) radiation – are characterized to find specific evidence for the proposed degradation mechanisms. The mini-modules were exposed up to 10,000 h, which represents up to 15–20 years in the field. Results affirm that initially, deacetylation dominates the degradation before scission takes over, followed by hydrolytic depolymerization. Additional analysis highlights the climacteric interdependency between deacetylation and hydrolytic depolymerization as it relates to eventual delamination, where deacetylation products catalyze interfacial hydrolysis reactions. Furthermore, effects occurring at a given interface are isolated, explicitly providing evidence for how these mechanisms are nonuniform throughout the thickness of the EVA. Results demonstrate that the EVA that interfaces with the glass as opposed to the cell experiences increased levels of degradation, explaining why this initially stronger interface becomes the preferential interface for delamination after longer periods of exposure. Additionally, elevated temperatures alone are shown to induce limited migration of sodium ions across the glass/EVA interface.

36 MATERIALS SCIENCE↗

DOE OSTI2017

Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation

In advanced microelectronics, precise design of liner and capping layers become critical, especially when it comes to the fabrication of Cu interconnects with dimensions lower than its mean free path. Here in this paper, we demonstrate that direct-liquid-evaporation chemical vapor deposition (DLE-CVD) of Co is a promising method to make liner and capping layers for nanoscale Cu interconnects. DLE-CVD makes pure, smooth, nanocrystalline, and highly conformal Co films with highly controllable growth characteristics. This process allows full Co encapsulation of nanoscale Cu interconnects, thus stabilizing Cu against diffusion and electromigration. Electrical measurements and high-resolution elemental imaging studies show that the DLE-CVD Co encapsulation layer can improve the reliability and thermal stability of Cu interconnects. Also, with the high conductivity of Co, the DLE-CVD Co encapsulation layer have the potential to further decrease the power consumption of nanoscale Cu interconnects, paving the way for Cu interconnects with higher efficiency in future high-end microelectronics.

36 MATERIALS SCIENCE↗

DOE OSTI2017

Control over Silica Particle Growth and Particle–Biomolecule Interactions Facilitates Silica Encapsulation of Mammalian Cells with Thickness Control

Over the past 20 years, many strategies utilizing sol–gel chemistry to integrate biological cells into silica-based materials have been reported. One such strategy, Sol-Generating Chemical Vapor into Liquid (SG-CViL) deposition, shows promise as an efficient encapsulation technique due to the ability to vary the silica encapsulation morphology obtained by this process through variation of SG-CViL reaction conditions. In this report, we develop SG-CViL as a tunable, multi-purpose silica encapsulation strategy by investigating the mechanisms governing both silica particle generation and subsequent interaction with phospholipid assemblies (liposomes and living cells). Using Dynamic Light Scattering (DLS) measurements, linear and exponential silica particle growth dynamics were observed which were dependent on deposition buffer ion constituents and ion concentration. Silica particle growth followed a cluster–cluster growth mechanism at acidic pH, and a monomer-cluster growth mechanism at neutral to basic pH. Increasing silica sol aging temperature resulted in higher rates of particle growth and larger particles. DLS measurements employing PEG-coated liposomes and cationic liposomes, serving as model phospholipid assemblies, revealed that electrostatic interactions promote more stable liposome–silica interactions than hydrogen bonding and facilitate silica coating on suspension cells. However, continued silica reactivity leads to aggregation of silica-coated suspension cells, revealing the need for cell isolation to tune deposited silica thickness. As a result, utilizing these mechanistic study insights, silica was deposited onto adherent HeLa cells under biocompatible conditions with micrometer-scale control over silica thickness, minimal cell manipulation steps, and retained cell viability over several days.

36 MATERIALS SCIENCE↗