DOE OSTI2022
Ceramics are employed in various engineering applications including electronics, semiconductors, automotive and aerospace industry, among others. Ceramics are desirable materials due to their high hardness, thermal resistance, chemical, thermal, and mechanical properties. A drawback of engineering ceramics is the manufacturing process. Ceramics are hard and brittle and conventional drilling or cutting methods can damage the material. These challenges in manufacturing have limited the application of ceramics in certain engineering applications. The non-contact machining of ceramics through ultrashort pulsed laser drilling offers a possible solution to the manufacturing issues. The advantage of laser drilling is the ability to machine hard and brittle materials. A laser, pulsed in the time regime of femtoseconds (fs), drills/machines sharp and well-defined holes and cuts. Additionally, the short pulse width results in limited melting, cracking, or heat transfer to the surrounding material, as well as no residual stresses. This non-contact process can greatly aid in the machining of hard materials. This study focuses on drilling into silicon nitride to produce zero-taper through holes. With this, other thicknesses can be explored, to achieve zero-taper holes.
Femtosecond laser ablation, Ceramics, Silicon Nitr↗