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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Impact of Thermal Stress on Attachment and Stability of High Temperature Strain Sensors

Static and dynamic strain sensing is required in high-temperature (HT), harsh-environments (HE) for industrial, aerospace, and energy sector applications to ensure equipment and process safety, reduce the cost of operation and maintenance, and increase process efficiency. Challenges that arise in HT HE sensing applications include device mounting, packaging, integrity, and stability to HT HE conditions. In previously reported work, static and dynamic strain surface acoustic wave resonator (SAWR) sensors were fabricated on langasite (LGS) and mounted on Inconel 625 strain beams for wireless testing up to 400°C. In this work, it has been identified that after subjecting the mounted SAWR strain sensor to thermal cycling between 100°C and 425°C, the measured sensitivity to dynamic strain decreased by 73% due to cracking at the adhesive/LGS interface, further deteriorating after additional thermal cycles. Strain modeling of the mounted LGS sensor chip up to 400°C revealed the existence of concentrated strain at the borders of the LGS chip. Microcracks caused by dicing make the chip boarders the most susceptible location for cracks to initiate when the sensor is subjected to thermal stress. In an attempt to mitigate the high strain at the LGS chip borders due to heating, adhesive shaping is proposed in this work. Simulations indicate a strain reduction of 50% at the border is achieved using both circular and triangular adhesive shapes, while also reducing the maximum strain over the entire adhesive/LGS interface by around 30%. Furthermore, the technique is thus promising for improving the integrity, reliability, and stability of static and dynamic strain sensors, particularly while operating under HT HE with several hundreddegree Celsius temperature excursions.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

Experiments to Quantify the Shielding Efficacy of Materials to be Implemented for Portable Shielding Enclosures that Adequately Mitigate EMI from Lighting Attachment Events

Mitigating electric and magnetic fields induced by lightning strike events is critical for the security and longevity of electrical components. Electromagnetic interference originating from a lightning strike is categorized into the low to medium frequency ranges, commonly referred to as the “magnetic coupling” regime. This low-frequency characteristic brings about the problem of shielding magnetic flux lines. Such shielding can be accomplished with highly conductive materials via the generation of eddy currents or by diverting the flux lines using materials with a large relative permeability. The shielding effectiveness of materials with varying thicknesses and geometry are tested using a pulse forming network having comparable characteristics to a scaled lighting strike. A four-stage Marx generator with a peak current of ~33 kA and a risetime of 1.4 μs is used as the pulse forming network to emulate the scaled electric and magnetic fields. The data collected from these experiments provide information and techniques that can be implemented into the design of a portable, deployable shielding enclosure.

61 RADIATION PROTECTION AND DOSIMETRY↗
DOE OSTI2025

Simulation Process Automation for Window Attachments Rating

WINDOW (LBNL 2022) and AERCalc (LBNL 2018) software developed by Lawrence Berkely National Laboratory are needed for running the tool. The database that in installed along with WINDOW software is utilized and modified to develop database for AERCalc simulation in generic case. However, any other custom WINDOW database created by users can be utilized as well. Another requirement for use of the tool is the availability of the shading fabric in the complex glazing database (CGDB). The CGDB id of the fabric was used for database generation discussed in next section.

97 MATHEMATICS AND COMPUTING↗