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At least 1,405 records · Page 78

Semiconductor power device including wire or ribbon bonds over device active region

A semiconductor power device including a base plate; an input lead; an output lead; a field effect transistor (FET) power die disposed over the base plate, wherein the FET power die includes a set of source fingers, a set of drain fingers, and a set of gate fingers disposed directly over an active region, wherein the gate fingers are configured to receive an input signal from the input lead, and wherein the FET power die is configured to process the input signal to generate an output signal at the drain fingers for routing to the output lead; and electrical conductors (wirebonds or ribbons) bonded to the source and/or drain directly over the active region of the FET power die. The electrical conductors produce additional thermal paths between the active region and the base plate for thermal management of the FET power die.

42 ENGINEERING↗

Fine wire manipulator

A system for manipulating a filament can include a filament supply from which a filament can be drawn, the filament supply being positioned along an axis, a vacuum manipulator assembly positioned along the axis, wherein the vacuum manipulator assembly is configured to engage the filament when a vacuum is drawn through the vacuum manipulator assembly and draw the filament along the axis to a workpiece, and a welding tool comprising a welding head positioned along the axis between the filament supply and the vacuum manipulator assembly, the welding tool being configured to weld the filament to the workpiece.

Christensen, Kyle B.↗