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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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This presentation provides a state of the art of electric-drive vehicle power electronics, and covers the APEEM Group research in thermomechanical and reliability aspects of advanced power electronics packaging. Some future directions are identified.
The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described.
The 2022 PV Reliability Workshop (PVRW) was held virtually from February 21-25, 2022. These proceedings collect the oral and poster presentation recordings from the workshop.
Presentation to the Legislative Energy Horizons Institute on grid reliability and renewable integration, including resource adequacy, flexibility, and distributed energy resource considerations.
The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
This presentation introduces INL's human reliability analysis data collection studies.
Many researchers have emphasized the importance of dynamic probabilistic safety assessment (PSA), which highlights the necessity of studies for dynamic human reliability analysis (HRA). Dynamic HRA concentrates on a dynamic account of human actions or how performance shaping factors (PSFs) can dynamically modify the human error probability (HEP) over time. In contrast, existing static HRA does not consider human actions as changes over time or event progressions. Accordingly, previous research on dynamic HRA conceptually suggested PSF lag and linger effects to treat dependence between operator actions in dynamic HRA versus existing approaches. As follow-up research, this study attempted to identify PSF lag and linger effects for dynamic HRA on the basis of experimental data. Firstly, mathematical models for PSF lag and linger effects were developed based on a literature survey in the field of biology. Secondly, we analyzed experimental scenarios from a control room study to identify operator actions considered in PSA. Lastly, based on the experimental data, the effect of the stress PSF with lag and linger effects was compared to that without PSF lag and linger effects. This paper concludes with an overall discussion of PSF lag and linger effects based on the relation between the stress PSF and error occurrence.
As a type of human actions defined in human reliability analysis (HRA), pre-initiator refers to the human actions that may lead to the unavailability of systems, typically committed during maintenance, test, or calibration. This paper investigates representative HRA methods used for analyzing pre-initiators. The HRA methods are Technique for Human Error Rate Prediction (THERP), Korean Standard HRA (K-HRA) and Standard Plant Risk HRA (SPAR-H). In this paper, characteristics of each HRA method are compared for qualitative and quantification aspects. Two pre-initiators, i.e., a calibration task and a valve restoration task, are analyzed using the HRA methods to compare human error probabilities. Then, insights from the analysis and additional research requirements are discussed in this paper.
As a type of human actions defined in human reliability analysis (HRA), pre-initiator refers to the human actions that may lead to the unavailability of systems, typically committed during maintenance, test, or calibration. This paper investigates representative HRA methods used for analyzing pre-initiators. The HRA methods are Technique for Human Error Rate Prediction (THERP), Korean Standard HRA (K-HRA) and Standard Plant Risk HRA (SPAR-H). In this paper, characteristics of each HRA method are compared for qualitative and quantification aspects. Two pre-initiators, i.e., a calibration task and a valve restoration task, are analyzed using the HRA methods to compare human error probabilities. Then, insights from the analysis and additional research requirements are discussed in this paper.
An overview of the National Renewable Energy Laboratories Component Reliability Project including the accomplishments for the previous year.
For many decades, PSA (Probabilistic Safety Assessment) or PRA (Probabilistic Risk Assessment) techniques have been used to enhance the operational safety of nuclear power plants (NPPs) based on the consideration of potential hazards that could result in an unexpected consequence. As human error is one of the potential hazards, diverse human reliability analysis (HRA) methods have been proposed to provide a systematic way to estimate the likelihood of human errors (i.e., human error probability, HEP) in specific task contexts. Accordingly, it is evident that the quality of HRA results strongly depends on the credibility of HEP estimations. This implies that, in terms of enhancing this credibility, the collection of raw information (HRA data) that is helpful for understating when and why human errors occur is a crucial issue. In order to address this issue, in this study, the feasibility of a framework to integrate HRA data obtained from different sources is investigated based on the complexity of proceduralized tasks.
High temperature operation of wide bandgap devices continue to be a challenge for the power electronics packages. Thermal performance and reliability are important factors that determine the viability of a bonded interface for operation at high temperatures. In this presentation, we present the technical approach and key results from the research on sintered silver, transient liquid phase alloy, and polymeric materials. A lifetime prediction model that incorporates the thermomechanical behavior of sintered silver at 200C was developed. The copper-aluminum transient alloy completed 350 thermal cycles from -40C to 200C and little increase in the defect level was observed. In addition to material research, we initiated a time-series analysis on the scanning acoustic microscope images of eutectic solder to explore statistical forecasting methods and machine learning techniques. Initial results that report the accuracy of a few different statistical models are presented.
Human-system interfaces (HSIs) play an important role in enabling operators to communicate with the nuclear power plant (NPP) side. Getting the information required to understand a NPP’s current status or perform necessary actions for responding to a given operational context are representative operator tasks performed using HSIs. To date, HSIs have been mainly evaluated in the context of human reliability analysis (HRA). However, the current HSI evaluation that occurs during HRA may be challengeable on two fronts: (1) reflecting the unique characteristics of HSI systems and (2) considering situations in which HSIs are poorly operated due to software/hardware malfunctions. Accordingly, this study proposes an approach for specifically evaluating HSIs for digital instrumentation and controls (DI&C) systems, using Redundancy-guided Systems-theoretic Hazard Analysis (RESHA) and HRA. RESHA is a method for analyzing DI&C systems with redundancy features. In this study, we investigate how HSIs are evaluated in existing HRA methods, and what challenges exist in the current approaches. To better evaluate HSIs for DI&C systems, this study modifies the existing HSI evaluation process by additionally modeling the HSI back- and front- ends. In this paper, a HSI fault tree for the APR1400 DI&C system is introduced through a piping and instrumentation diagram. It then touches upon what aspects of the suggested method must be further researched.
Slides for an external presentation at a reliability workshop.
Challenging climates for Photovoltaics are usually based on climate classification. However, extreme weather events such as high wind, flooding, large hail, extreme snow etc. have become more ubiquitous globally. To study the impact of extraordinary weather events on PV reliability we used two of the largest databases in the USA. First, the National Oceanic and Atmospheric Administration (NOAA) database on extreme weather and secondly, the PV Fleet Data Initiative where we have collected high-resolution PV performance data of more than 8 gigawatts or about 6-7% of all commercial and utility systems in the USA. We analyzed almost 200 systems between 2008-20022 that were immediately impacted by these weather events. The immediate impact (outages) was determined to be about 1% of or a median of approximately 3 days of annual lost production. However, the risk these events pose is exemplified by a long tail where 0.4 % of all systems lost more than 2 weeks annual production. We also found a threshold for high wind (90 km/hr) and hail (25mm), above which we observed significantly higher degradation implying long-term damage to the systems. In addition, we are using satellite imagery to quantify visible damage to PV plants. Finally, we share module, design and installation lessons from some observed case studies to improve extreme weather resilience for PV power systems.
The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronic modules, especially in operating temperatures greater than 150 degrees Celsius. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees Celsius to 200 degrees Celsius) conditions. In the fabrication phase of the samples, we used different stencil patterns and found out that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality than a full-area print. The paste consisted of Cu microflakes and we performed sintering using a Budatec SP300 sintering press at 275 degrees Celsius with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained digital microscope images, which revealed adhesive fracture as the dominant failure mechanism.
This presentation is to guide interactive discussion by posing questions to workshop participants. Topic is reliability, maintenance cost, and performance risk associated with failure of PV connectors which make electrial connections between components.