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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,333 records · Page 74
All sourcesNASA NTRSDOE OSTI
DOE OSTI2018

Parameters of a Microstructure of Erosion Regions during the Action of a Spark Discharge on a Copper Electrode Surface in Air

The parameters of a microstructure of regions of action of a spark discharge on a copper plane electrode surface in air at atmospheric pressure in the spike–plane gap both for positive and negative polarity of a spike have been studied using scanning electron microscopy. It has been found that regions of action have the appearance of rounded spots or groups of spots with an internal structure in the form of agglomeration of a large number of microcraters. It has been shown that the statistical distributions of microcrater diameters and intermicrocrater distances are characterized by several local maximums that determine the presence of several predominant values of these parameters in a spot. It has been revealed that the microstructure of a spot is characterized by the fractal behavior and the fractal dimensionalities of the microstructure have been determined.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2018

Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs

A methanesulfonic acid (MSA) electrolyte with a single suppressor additive was used for potentiostatic bottom-up filling of copper in mesoscale through silicon vias (TSVs). Conversly, galvanostatic deposition is desirable for production level full wafer plating tools as they are typically not equipped with reference electrodes which are required for potentiostatic plating. Potentiostatic deposition was used to determine the over-potential required for bottom-up TSV filling and the resultant current was measured to establish a range of current densities to investigate for galvanostatic deposition. Galvanostatic plating conditions were then optimized to achieve void-free bottom-up filling in mesoscale TSVs for a range of sample sizes.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2013

Metallochaperones Regulate Intracellular Copper Levels

Copper (Cu) is an important enzyme co-factor that is also extremely toxic at high intracellular concentrations, making active efflux mechanisms essential for preventing Cu accumulation. Here, we have investigated the mechanistic role of metallochaperones in regulating Cu efflux. We have constructed a computational model of Cu trafficking and efflux based on systems analysis of the Cu stress response of Halobacterium salinarum. We have validated several model predictions via assays of transcriptional dynamics and intracellular Cu levels, discovering a completely novel function for metallochaperones. We demonstrate that in addition to trafficking Cu ions, metallochaperones also function as buffers to modulate the transcriptional responsiveness and efficacy of Cu efflux. This buffering function of metallochaperones ultimately sets the upper limit for intracellular Cu levels and provides a mechanistic explanation for previously observed Cu metallochaperone mutation phenotypes.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2025

Copper-containing layered oxide cathodes for sodium-ion batteries

Layered transition metal oxides are among the most promising cathode materials for sodium-ion batteries due to their high theoretical capacity, structural tunability, and cost-effectiveness. However, conventional Ni- and Co-based layered oxides are hindered by high raw material costs, limited elemental abundance, and phase instability during electrochemical cycling. Recently, copper has emerged as an attractive alternative transition metal, offering significant advantages in terms of redox activity, structural stabilization, voltage regulation, and rate performance. Unlike Ni and Co, Cu can facilitate unique redox mechanisms and enable more sustainable material design. This review systematically summarizes recent progress on Cu-containing layered sodium oxides, with emphasis on their structural characteristics, electrochemical behavior, and the critical roles that Cu plays within the host lattice. The insights provided herein aim to highlight the potential of Cu-substituted or Cu-containing layered oxides as a viable pathway toward high-performance and resource-accessible SIB cathodes for future energy storage applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2017

Operation of the NETL Chemical Looping Reactor with Natural Gas and a Novel Copper-Iron Material

The proposed Clean Power Plan requires CO 2 emission reductions of 30% by 2030 and further reductions are targeted by 2050. The current strategies to achieve the 30% reduction targets do not include options for coal. However, the 2016 Annual Energy Outlook suggests that coal will continue to provide more electricity than renewable sources for many regions of the country in 2035. Therefore, cost effective options to reduce greenhouse gas emissions from fossil fuel power plants are vital in order to achieve greenhouse gas reduction targets beyond 2030. As part of the U.S. Department of Energy’s Advanced Combustion Program, the National Energy Technology Laboratory’s Research and Innovation Center (NETL R&IC) is investigating the feasibility of a novel combustion concept in which the GHG emissions can be significantly reduced. This concept involves burning fuel and air without mixing these two reactants. If this concept is technically feasible, then CO 2 emissions can be significantly reduced at a much lower cost than more conventional approaches. This indirect combustion concept has been called Chemical Looping Combustion (CLC) because an intermediate material (i.e., a metal-oxide) is continuously cycled to oxidize the fuel. This CLC concept is the focus of this research and will be described in more detail in the following sections. The solid material that is used to transport oxygen is called an oxygen carrier material. The cost, durability, and performance of this material is a key issue for the CLC technology. Researchers at the NETL R&IC have developed an oxygen carrier material that consists of copper, iron, and alumina. This material has been tested extensively using lab scale instruments such as thermogravimetric analysis (TGA), scanning electron microscopy (SEM), mechanical attrition (ASTM D5757), and small fluidized bed reactor tests. This report will describe the results from a realistic, circulating, proof-of-concept test that was completed using NETL’s 50kW th circulating Chemical Looping Reactor (CLR) test facility.

01 COAL, LIGNITE, AND PEAT↗
DOE OSTI2018

Copper Hugoniot Measurements to 2.8 TPa on Z

We conducted three Hugoniot and release experiments on copper on the Z machine at Hugoniot stress levels of 0.34 and 2.6 TPa, using two-layer copper/aluminum impactors traveling at 8 and 27 km/s and Z-quartz windows. Velocity histories were recorded for 4 samples of different thicknesses and 5 locations on the flyer plate (3 and 4 for the first two experiments). On-sample measurements provided Hugoniot points (via transit time) and partial release states (via Z-quartz wavespeed). Fabrication of the impactor required thick plating and several diamond-machining steps. The lower-pressure test was planned as a 2.5 TPa test, but a failure on the Z machine degraded its performance; however, these results corroborated earlier Cu data in the same stress region. The second test suffered from significant flyer plate bowing, but the third did not. The Hugoniot data are compared with the APtshuler/Nellis nuclear-driven data, other data from Z and elsewhere, and representative Sesame models.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Metal Bellows Valve Reliability Testing - Copper Stem Tip Testing

SRNL was funded in Mid-Year FY20 by NNSA NA-231 to continue evaluation of alternate valves for use in tritium service to support domestic Mo-99 production. The focus of the effort was to identify valve cycle life as a function of actuator size and stem tip material. Using the minimum size actuator to reliability open and close valves can reduce glovebox size and thus support domestic companies to “come to market” faster in supplying Mo-99 to the US market. This report serves as a continuation to the FY19 report and summarizes the task activities completed in FY20 after authorization to start work was obtained on May 5 th , 2020. Copper stem tips were tested on the Swagelok 1C and 5C actuated metal bellows valves. With ambitions to cycle each set 150,000 times, both 1C and 5C valves were met with high failure rates. The smaller 1C actuated valves required additional closing pressure to form a seal with the Cu stem tips installed however, excessive stem tip deformation may be the root cause of the majority of the valves failing before 500 cycles. The larger 5C actuated valves were cycled 150,000 times but still resulted in 80% failure rate, suspected of metal fatigue in the bellows due to high cycling frequencies.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2025

Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging

Silicon carbide (SiC) power devices are playing ever- growing roles in high-power-density power electronics converters by offering benefits such as high voltage rating, fast transients, and high thermal performance. Organic direct-bonded copper (ODBC)-based packaging, due to its ductility and ease of han- dling, allows the possibility of a more flexible layout design that may better tap the potential of SiC benefits. In this work, an ODBC-based prototyping routine is developed that accelerates the iterations of packaging layout design with low cost. The properties of ODBC and its handling are briefly introduced, and tools and fabrication steps are explained. Following this routine, a 1.2-kV SiC half-bridge power module is designed and fabricated with the focus on sub-nanohenry ultra-low loop inductance. Simulation and experimental validation are also conducted.

25 ENERGY STORAGE↗
DOE OSTI2025

Front Side Copper Metallization Paste for Silicon Solar Cells (CRADA Final Report)

Adoption and testing of copper (Cu) metallization pastes on existing research and development (R&D) or production lines is hindered by the perceived idea that Cu will contaminate the equipment. The objective of this work is to prove if Cu from the pastes will contaminate and degrade the silver metallized cells being produced in the same firing furnace.

14 SOLAR ENERGY↗
DOE OSTI2017

Copper-coated electrodes for electrical discharge machining of 38X2H2MA steel

The use of copper-coated aluminum electrodes in the electrical discharge machining of 38X2H2MA steel is assessed. Such electrodes prove effective. The use of coated electrodes improves the economics of electrical discharge machining by permitting the use of cheaper materials in the electrode core.

36 MATERIALS SCIENCE↗
DOE OSTI2018

Nanoindentation of ZrN Coatings on Silicon and Copper Substrates

An effective mathematical model is proposed to describe experiments on the indentation of samples with layered or functionally graded coatings. The model is based on the elastic contact problem corresponding to the penetration of a punch in a coated elastic half-space. A Berkovich indenter is considered. The results of the simulation and the experiments are compared for the indentation of two zirconium nitride (ZrN) coatings on substrates of monocrystalline (100) silicon and annealed copper. The agreement of the results is good.

42 ENGINEERING↗
DOE OSTI2021

In Situ Recrystallization of Co-Evaporated Cu(In,Ga)Se2 Thin Films by Copper Chloride Vapor Treatment towards Solar Cell Applications

Cu(In,Ga)Se2 (or CIGS) thin films and devices were fabricated using a modified three-stage process. Using high deposition rates and a low temperature during the process, a copper chloride vapor treatment was introduced in between the second and third stages to enhance the films properties. X-ray diffraction and scanning electron microscopy demonstrate that drastic changes occur after this recrystallization process, yielding films with much larger grains. Secondary ion mass spectrometry shows that the depth profile of many elements is not modified (such as Cu, In and Se) while others change dramatically (such as Ga and Na). Because of the competing effects of these changes, not all parameters of the solar cells are enhanced, yielding an increase of 15% in the device efficiency at the most.

14 SOLAR ENERGY↗
DOE OSTI2021

Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits

Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 produced by a laser-interference setup that would theoretically yield a periodicity of 1.7 μm, which is near the 1.6–2 μm structuring limit that was estimated based on thermal diffusion length scale for an 8 ns laser pulse. The results show that although the expected periodic interference structuring was not attained, the melt-induced texturing was affected by the laser-interference profile. Single-lap shear tests were performed with specimen surfaces prepared by traditional abrasion and laser-interference structuring methods. Several laser processing parameters, such as the laser spot size, density, number of pulses, and raster speed, were studied. Scanning electron microscope and profilometry measurements were used to characterize the processed surface microstructures. Web-like structures, which indicate widespread melting, were shown to be formed at different processing conditions. Based on the surface topologies investigated, two laser raster speeds were selected to make single-lap-joint specimens. Baseline joints were prepared by abrading joining specimens. The shear-lap strength and displacement at maximum load were shown to be higher by 16.8% and 43.8% for the laser-structured specimens than those of the baseline specimens, respectively. Moreover, the load-displacement curves indicated that the laser-structured joints were more ductile than those without laser-structuring. The increased ductility for the laser-structured joints was found to yield an increase in the energy absorbed during shear-lap testing of approximately of 80–90% over those measured for baseline joints. It is another indicator that laser-interference structuring enhanced the bonding performance of single-lap shear joints.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Copper-Tantalum Metal Matrix Composites Consolidated from Powder Blends by Severe Plastic Deformation

We investigated the effectiveness of severe plastic deformation by equal channel angular extrusion (ECAE) for consolidation of metal powders into metal matrix composites. Equal volumes of copper (Cu) and tantalum (Ta) powders were consolidated at ambient temperature via different ECAE routes. Composites processed by ECAE routes 4E and 4Bc were also processed at 300 °C. The resulting materials were characterized by scanning electron microscopy (SEM) and compression testing. Processing by route 4Bc at 300 °C resulted in the highest compressive strength, lowest anisotropy, and least strain rate sensitivity. We conclude that the superior properties achieved by this route arise from mechanical bonding due to interlocking Cu and Ta phases as well as enhanced metallurgical bonds from contact of pristine metal surfaces when the material is sheared along orthogonal planes.

36 MATERIALS SCIENCE↗
DOE OSTI2023

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

36 MATERIALS SCIENCE↗