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At least 1,315 records · Page 73

A PARAMETER STUDY FOR BAROCLINIC VORTEX AMPLIFICATION

Recent studies have shown that baroclinic vortex amplification is strongly dependent on certain factors, namely, the global entropy gradient, the efficiency of thermal diffusion and/or relaxation as well as numerical resolution. We conduct a comprehensive study of a broad range and combination of various entropy gradients, thermal diffusion and thermal relaxation timescales via local shearing sheet simulations covering the parameter space relevant for protoplanetary disks. We measure the Reynolds stresses as a function of our control parameters and see that there is angular momentum transport even for entropy gradients as low as {beta} = -dln s/dln r = 1/2. Values we expect in protoplanetary disks are between {beta} = 0.5-2.0 The amplification-rate of the perturbations, {Gamma}, appears to be proportional to {beta}{sup 2} and thus proportional to the square of the Brunt-Vaeisaelae frequency ({Gamma}{proportional_to}{beta}{sup 2}{proportional_to}N {sup 2}). The saturation level of Reynolds stresses, on the other hand, seems to be proportional to {beta}{sup 1/2}. This highlights the importance of baroclinic effects even for the low entropy gradients expected in protoplanetary disks.

79 ASTRONOMY AND ASTROPHYSICS↗

Applications of high thermal conductivity composites to electronics and spacecraft thermal design

Recently, high thermal conductivity graphite fiber-reinforced metal matrix composites (MMCs) have become available that can save weight over present methods of heat conduction. Another significant advantage is that these materials can be used without the plumbing and testing complexities that accompany the use of liquid heat pipes. A spinoff of this research was the development of other MMCs as electronic device heat sinks. These use particulates rather than fibers and are formulated to match the coefficient of thermal expansion of electronic substrates in order to alleviate thermally induced stresses. The development of both types of these materials as viable weight-saving substitutes for the traditional methods of thermal control for electronics packaging and also for spacecraft thermal control applications are the subjects of this report.

Sharp, G. Richard↗

RCC Plug Repair Thermal Tools for Shuttle Mission Support

A thermal math model for the Space Shuttle Reinforced Carbon-Carbon (RCC) Plug Repair was developed to increase the confidence in the repair entry performance and provide a real-time mission support tool. The thermal response of the plug cover plate, local RCC, and metallic attach hardware can be assessed with this model for any location on the wing leading edge. The geometry and spatial location of the thermal mesh also matches the structural mesh which allows for the direct mapping of temperature loads and computation of the thermoelastic stresses. The thermal model was correlated to a full scale plug repair radiant test. To utilize the thermal model for flight analyses, accurate predictions of protuberance heating were required. Wind tunnel testing was performed at CUBRC to characterize the heat flux in both the radial and angular directions. Due to the complexity of the implementation of the protuberance heating, an intermediate program was developed to output the heating per nodal location for all OML surfaces in SINDA format. Three Design Reference Cases (DRC) were evaluated with the correlated plug thermal math model to bound the environments which the plug repair would potentially be used.

Rodriguez, Alvaro C.↗

Determination of permissible applied load stress in structural elements

Graphic method is used to select allowable stresses in thermally loaded structures. Equations are used for determining the mode of failure for specific materials in order to plot a range of stress curves. Linear assumption and iterative calculations are eliminated resulting in comparatively high accuracy.

Loy, R. E.↗

The slab geometry laser. II - Thermal effects in a finite slab

This paper presents two methods for calculating the thermally induced stress, focusing, and depolarization in a pumped zigzag-slab solid-state laser. A computer program capable of detailed calculations of thermal effects in the general case is described. An approximate analysis of slab thermal effects in many cases allows calculation of these effects without use of the computer model directly. The analysis predicts that slabs of square cross section can be designed to have low depolarization and thermal focusing compared to Nd:YAG laser rods.

Kane, T. J.↗

Non-destructive evaluation of degradation in EB-PVD thermal barrier coatings by infrared reflectance spectroscopy

At room temperature and atmospheric conditions infrared reflectance spectroscopy and X-ray diffraction were employed for the detection of the phase transformation and residual stress within thermal barrier coatings (TBC). The TBC's samples initially consisted of the porous ceramic topcoat deposited by electron beam plasma vapor deposition, a bond coat and a superalloy substrate. Reflectance spectroscopy scans were performed from 7497 cm{sup -1} to 68 cm{sup -1} to analysis the fingerprint region as well as the chemical bonding region. These regions should indicate if a detectable change within the TBC response is a result of thermal degradation of the microstructure and the changes in yttrium dispersion throughout the yttrium stabilized zirconium. The thermal degradation was induced by thermal cycling the samples to 1100 Degree-Sign C and then cooling them in an atmospheric environment. X-ray diffraction was also used to detect the phase composition within the TBC samples and see if either would clearly identify failure prior to actual spallation. The eventual measurability and quantify-ability of the phase changes within the TBC's may be used as an effective non-destructive evaluation (NDE) technique that would allow personnel in the field to know when servicing of the turbine blade was necessary.

36 MATERIALS SCIENCE↗

Bibliography

Bibliographical listing of recently published work pertaining to 15 subject areas of lunar research, with brief abstracts for each item listed. Subject areas covered include: motion of the moon in space, dynamics of the earth-moon system, and lunar astronautics; librations; shape and gravitational field; internal structure, thermal and stress history; chemical composition; lunar exosphere; lunar coordinates and mapping of the moon; physical structure of the lunar surface; photometry of the moon; thermal emission of the lunar surface; electromagnetic properties; exploration of the moon by spacecraft.

Kopal, Z.↗

External Tank (ET) Foam Thermal/Structural Analysis Project

An independent study was performed to assess the pre-launch thermally induced stresses in the Space Shuttle External Tank Bipod closeout and Ice/Frost ramps (IFRs). Finite element models with various levels of detail were built that included the three types of foam (BX-265, NCFI 24-124, and PDL 1034) and the underlying structure and bracketry. Temperature profiles generated by the thermal analyses were input to the structural models to calculate the stress levels. An area of high stress in the Bipod closeout was found along the aluminum tank wall near the phenolic insulator and along the phenolic insulator itself. This area of high stress might be prone to cracking and possible delamination. There is a small region of slightly increased stress in the NCFI 24-124 foam near its joint with the Bipod closeout BX-265 foam. The calculated stresses in the NCFI 24-124 acreage foam are highest at the NCFI 24-124/PDL 1034/tank wall interface under the LO2 and LH2 IFRs. The highest calculated stresses in the LH2 NCFI 24-124 foam are higher than in similar locations in the LO2 IFR. This finding is consistent with the dissection results of IFRs on ET-120.

Moore, David F.↗

Eleventh interim status report: Model 9975 O-Ring fixture long-term leak performance

A series of experiments to monitor the aging performance of Viton® GLT O-rings used in the Model 9975 package has been ongoing since 2004 at the Savannah River National Laboratory. One approach has been to periodically evaluate the leak performance of O-rings being aged in mock-up 9975 Primary Containment Vessels (PCVs) at elevated temperature. Other methods such as compression-stress relaxation (CSR) tests and field surveillance are also on-going to evaluate O-ring behavior. Seventy tests using PCV mock-ups were assembled and heated to temperatures ranging from 200 to 450 ºF. They were leak-tested initially and have been tested periodically to determine if they continue to meet the leak-tightness criterion defined in ANSI standard N14.5-97. Due to material substitution, fourteen additional tests were initiated in 2008 with GLT-S O-rings heated to temperatures ranging from 200 to 400 ºF.

42 ENGINEERING↗

Residual thermal and moisture influences on the free-edge delamination of laminated composites

A simple delamination analysis method is developed. It is based on a shear-type deformation theory and includes hygrothermal effects. The method is applied to mixed-mode edge delamination specimens made of T300/5208 graphite/epoxy. It is found that residual thermal influences were alleviated when moisture stresses were included. Thermal effects on the interlaminar shear stress and total energy release rate were totally alleviated for the same specific moisture content. Moreover, this value of moisture content was not significantly affected by the stacking sequence for the laminates considered.

Armanios, Erian A.↗

Failure Analysis to Identify Thermal Runaway of Bypass Diodes in Fielded Modules

We studied a bypass diode recuperated from fielded modules in a rooftop installation to determine the failure mechanism. The field-failed diode showed similar characteristics to thermal runaway, specifically X-ray tomography evidence of migrated metal. We also observed burn marks on the silicon surface like those lab-stressed for thermal runaway. Reaction products are more soluble than silicon and the surface is oxygen rich.

14 SOLAR ENERGY↗

Replica grating study

Methods are outlined which were used to test the response of replica diffraction gratings to a space environment, specifically the response of the replica gratings to thermal-vacuum and electron irradiation stress. It is concluded that there probably is some degradation to thermal stress, but that there is probably no significant degradation due to a vacuum environment. It is further concluded that the degradation of performance of replica gratings because of electron irradiation is due to the interaction of the electrons and the replica grating substrate and not to the replication material itself. Replica and original gratings on the same substrate material should thus respond to particle irradiation in the same manner. A study is presented on the variation of refraction index of a space-related material, Nd:CaF2, with wavelength, percent neodymium doping, and temperature.

Gunter, R. C., Jr.↗

Activation Energy for End-of-Life Solder Bond Degradation: Thermal Cycling of Field-Aged PV Modules

The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.

14 SOLAR ENERGY↗

In situ observation of the deformation and fracture of an alumina-alumina ceramic-matrix composite at elevated temperature using x-ray computed tomography

The deformation and fracture of a 0/90° Nextel 720 mullite fibre / alumina matrix ceramic-matrix composite material has been observed by in situ synchrotron x-ray computed micro-tomography at ambient temperature and at 1100 °C. A three-point loading configuration was used and samples were loaded monotonically until final fracture. Here, the flexural strength was found to be unaffected by temperature. 3D visualisation of the microstructure showed fracture occurred by propagation of internal cracks at stresses close to the flexural strength. Shear fractures propagated across fibre bundles that were oriented perpendicular to the flexural stress at both room temperature and 1100 °C. At the higher temperature, an additional failure mode of delamination was observed, that may arise from relaxation of thermal residual stresses and creep.

36 MATERIALS SCIENCE↗

Thermally induced PtOx interfacial layer enhances stability of Pt/β-Ga2O3 vertical Schottky diodes

This study investigates the long-term stability of Pt/β-Ga2O3 field-plated Schottky barrier diodes at high temperatures, with extended thermal cycling and soaking stress. The device characteristics reveal a strong dependence on operating temperature, leading to an ON/OFF current ratio of ∼10× at ±3 V and 600 °C. Extensive thermal cycling (25 cycles over 100 h) between room temperature and 350 °C shows that leakage currents stabilize after the initial ten cycles. This stabilization is likely due to the formation of a thin PtOx layer at the Pt/β-Ga2O3 interface, as confirmed by high-resolution scanning transmission electron microscopy. Further exposure to a constant 350 °C environment for 10 h reveals a slight increase in the leakage current from 10−7 to 10−6 A at −5 V and degradation of the forward current, due to potential thermodynamic instability of the Ohmic contacts. This study provides insights into the changes in the Pt/β-Ga2O3 diode performance with thermal stress, offering a basis for predicting the device’s operational reliability at high temperatures for sensing and power applications.

08 HYDROGEN↗

FWP FEAA149: “Next Generation Environmental Barrier Coatings”

Environmental barrier coatings (EBCs) are required coatings for utilization of SiC/SiC ceramic matrix composite (CMC) components in gas turbines, where the EBC represents the life-limiting factor for such components. EBC/CMC systems have shown success in aero-engine applications with increased turbine inlet temperatures and improved efficiencies, which are achieved through higher temperature stability, lower density, and decreased reliance on cooling air compared to traditional superalloys. While industrial gas turbines (IGTs) do not currently utilize SiC/SiC CMCs, the current shift towards low-carbon or carbon-free fuel sources for power generation could result in a need for EBC/CMC components with higher temperature capabilities. In this work, three tasks were outlined to improve understanding of EBC lifetimes to encourage use in IGTs with carbon-free fuel such as hydrogen: 1. Define the bond coating oxidation kinetics and EBC failure criteria, 2. Measure thermal expansion coefficients of each layered material, and 3. Perform advanced characterization and modeling to assess EBC lifetimes. Cyclic steam oxidation tests were conducted on various EBC/Si/SiC chemistries and EBC/SiC architectures to define substrate oxidation kinetics and EBC failure modes. An open-source code was developed to quantify the undulating thermally grown oxide thickness with thousands of measurements from specimen cross-section images. Bond coating oxidation kinetics were determined and used to develop a kinetic and thermodynamic model for predicting EBC lifetimes. High-temperature Raman spectroscopy was utilized for determining the SiO 2 thermally grown oxide phase transformation as the life-limiting feature for EBCs. Model efforts supported the claim that the SiO 2 phase transformation causes elevated stress during thermal cycling with associated cracking that decreases the adhesion strength of the EBC, eventually resulting in coating spallation. The finite element model subroutine will be made publicly available upon internal review. Further development of an EBC lifetime model for IGTs involves definition of a critical SiO 2 thickness for EBC spallation and must also consider both environmental (gas velocity, pressure, etc.) and specimen (EBC dopants, layer architectures, etc.) effects into predicted bond coating oxidation kinetics for long-lifetime components.

36 MATERIALS SCIENCE↗

The relationship between reliability and bonding techniques in hybrid microcircuits

Differential thermal expansion was shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. It is shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis was conducted of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses. It was experimentally observed that the stresses in more compliant bonding systems such as soft lead tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate was proven to be a determining factor in the prediction of failure solder systems. It was found that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Strain gage techniques were used to determine thermally induced expansion stresses of the capacitors and the alumina substrates. The compliance of the different bonding mediums was determined. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Caruso, S. V.↗