Development of Methods of Producing Large Areas of Silicon Sheet by the Slicing of Silicon Ingots Using Inside Diameter (I.D.) Saws
Methods of producing large areas of silicon sheets were developed by using inside diameter (I.D.) saws to slice silicon ingots. A 16 inch automated I.D. slicing machine was modified to accept programmable electric feed system, a crystal rotating system and a dyna-track blade monitoring and control system. The saw and accessories were used to slice 75 mm diameter single crystal silicon ingots while rotating them. The automated saw automatically recovered the wafers and loaded them into a cassette. The amount of material lost during slicing was reduced by using smaller blades than ones normally used to slice the wafers. Slicing runs on 100 mm diameter silicon is the next goal.