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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,297 records · Page 72

Effect of Melt Convection at Various Gravity Levels and Orientations on the Forces Acting on a Large Spherical Particle in the Vicinity of a Solidification Interface

Numerical modeling was Undertaken to analyze the influence of both radial and axial thermal gradients on convection patterns and velocities claiming solidification of pure Al and an Al-4 wt% Cu alloy. The objective of the numerical task was to predict the influence of convective velocity on an insoluble particle near a solid/liquid (s/l) interface. These predictions were then be used to define the minimum gravity level (q) required to investigate the fundamental physics of interactions between a particle and a s/l interface. This is an ongoing NASA founded flight experiment entitled "particle engulfment and pushing by solidifying interfaces (PEP)". Steady-state calculations were performed for different gravity levels and orientations with respect to the gravity vector The furnace configuration used in this analysis is the quench module insert (QMI-1) proposed for the Material Science Research Facility (MSRF) on board the International Space Station (ISS). The general model of binary alloy solidification was based on the finite element code FIDAP. At a low g level of 10(exp -4) g(sub o) (g(sub o) = 9.8 m/square s) maximum melt convection was obtained for an orientation of 90 deg. Calculations showed that even for this worst case orientation the dominant forces acting on the particle are the fundamental drag and interfacial forces.

Bune, Andris V.↗

Biomaterials, Biomimetics and Biological Interfaces Research at the Oak Ridge National Laboratory

A viewgraph presentation outlines the development of biomaterials, biomimetics (mimicking biological processes and functions), and biological interfaces research. The different types of biomaterials are described, including details on bio-ceramics, biocompatible materials, materials characterization, and 'hybrid' biomaterials. The vision for biomimetics in creating a virtual human is discussed. Biological interfaces research is outlined, including information on interfaces with materials and computing.

Mark E. Reeves↗

Molecular Dynamics Studies of Structure and Functions of Water-Membrane Interfaces

A large number of essential cellular processes occur at the interfaces between water and membranes. The selectivity and dynamics of these processes are largely determined by the structural and electrical properties of the water-membrane interface. We investigate these properties by the molecular dynamics method. Over the time scales of the simulations, the membrane undergoes fluctuations described by the capillary wave model. These fluctuations produce occasional thinning defects in the membrane which provide effective pathways for passive transport of ions and small molecules across the membrane. Ions moving through the membrane markedly disrupt its structure and allow for significant water penetration into the membrane interior. Selectivity of transport, with respect to ionic charge, is determined by the interfacial electrostatic potential. Many small molecules. of potential significance in catalysis, bioenergetics and pharmacology, are shown to bind to the interface. The energetics and dynamics of this process will be discussed.

Pohorille, Andrew↗

Penalty-Based Finite Element Interface Technology for Analysis of Homogeneous and Composite Structures

An effective and robust interface element technology able to connect independently modeled finite element subdomains has been developed. This method is based on the use of penalty constraints and allows coupling of finite element models whose nodes do not coincide along their common interface. Additionally, the present formulation leads to a computational approach that is very efficient and completely compatible with existing commercial software. A significant effort has been directed toward identifying those model characteristics (element geometric properties, material properties, and loads) that most strongly affect the required penalty parameter, and subsequently to developing simple 'formulae' for automatically calculating the proper penalty parameter for each interface constraint. This task is especially critical in composite materials and structures, where adjacent sub-regions may be composed of significantly different materials or laminates. This approach has been validated by investigating a variety of two-dimensional problems, including composite laminates.

Averill, Ronald C.↗

Computational Approaches to Interface Design

Tools which make use of computational processes - mathematical, algorithmic and/or knowledge-based - to perform portions of the design, evaluation and/or construction of interfaces have become increasingly available and powerful. Nevertheless, there is little agreement as to the appropriate role for a computational tool to play in the interface design process. Current tools fall into broad classes depending on which portions, and how much, of the design process they automate. The purpose of this panel is to review and generalize about computational approaches developed to date, discuss the tasks which for which they are suited, and suggest methods to enhance their utility and acceptance. Panel participants represent a wide diversity of application domains and methodologies. This should provide for lively discussion about implementation approaches, accuracy of design decisions, acceptability of representational tradeoffs and the optimal role for a computational tool to play in the interface design process.

Corker↗

A Steady State and Quasi-Steady Interface Between the Generalized Fluid System Simulation Program and the SINDA/G Thermal Analysis Program

A general purpose, one dimensional fluid flow code is currently being interfaced with the thermal analysis program SINDA/G. The flow code, GFSSP, is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development is conducted in multiple phases. This paper describes the first phase of the interface which allows for steady and quasisteady (unsteady solid, steady fluid) conjugate heat transfer modeling.

Schallhorn, Paul↗

Human Motion Tracking and Glove-Based User Interfaces for Virtual Environments in ANVIL

The Army/NASA Virtual Innovations Laboratory (ANVIL) at Marshall Space Flight Center (MSFC) provides an environment where engineers and other personnel can investigate novel applications of computer simulation and Virtual Reality (VR) technologies. Among the many hardware and software resources in ANVIL are several high-performance Silicon Graphics computer systems and a number of commercial software packages, such as Division MockUp by Parametric Technology Corporation (PTC) and Jack by Unigraphics Solutions, Inc. These hardware and software platforms are used in conjunction with various VR peripheral I/O (input / output) devices, CAD (computer aided design) models, etc. to support the objectives of the MSFC Engineering Systems Department/Systems Engineering Support Group (ED42) by studying engineering designs, chiefly from the standpoint of human factors and ergonomics. One of the more time-consuming tasks facing ANVIL personnel involves the testing and evaluation of peripheral I/O devices and the integration of new devices with existing hardware and software platforms. Another important challenge is the development of innovative user interfaces to allow efficient, intuitive interaction between simulation users and the virtual environments they are investigating. As part of his Summer Faculty Fellowship, the author was tasked with verifying the operation of some recently acquired peripheral interface devices and developing new, easy-to-use interfaces that could be used with existing VR hardware and software to better support ANVIL projects.

Joseph D. Dumas, II↗

The Overgrid Interface for Computational Simulations on Overset Grids

Computational simulations using overset grids typically involve multiple steps and a variety of software modules. A graphical interface called OVERGRID has been specially designed for such purposes. Data required and created by the different steps include geometry, grids, domain connectivity information and flow solver input parameters. The interface provides a unified environment for the visualization, processing, generation and diagnosis of such data. General modules are available for the manipulation of structured grids and unstructured surface triangulations. Modules more specific for the overset approach include surface curve generators, hyperbolic and algebraic surface grid generators, a hyperbolic volume grid generator, Cartesian box grid generators, and domain connectivity: pre-processing tools. An interface provides automatic selection and viewing of flow solver boundary conditions, and various other flow solver inputs. For problems involving multiple components in relative motion, a module is available to build the component/grid relationships and to prescribe and animate the dynamics of the different components.

Chan, William M.↗

ISS Material Science Research Rack HWIL Interface Simulation

In this paper, the first Material Science Research Rack (MSRR-1) hardware-in-the-loop (HWIL) interface simulation is described. Dynamic Concepts developed this HWIL simulation system with funding and management provided by the Flight Software group (ED14) of NASA-MSFC's Avionics Department. The HWIL system has been used both as a flight software development environment and as a software qualification tool. To fulfill these roles, the HWIL simulator accurately models the system dynamics of many MSRR-1 subsystems and emulates most of the internal interface signals. The modeled subsystems include the Experiment Modules, the Thermal Environment Control System, the Vacuum Access System, the Solid State Power Controller Module, and the Active Rack Isolation Systems. The emulated signals reside on three separate MIL-STD-1553B digital communication buses, the ISS Medium Rate Data Link, and several analog controller and sensor signals. To enhance the range of testing, it was necessary to simulate several off-nominal conditions that may occur in the interfacing subsystems.

Williams, Philip J.↗

Interfacing Computer Aided Parallelization and Performance Analysis

When porting sequential applications to parallel computer architectures, the program developer will typically go through several cycles of source code optimization and performance analysis. We have started a project to develop an environment where the user can jointly navigate through program structure and performance data information in order to make efficient optimization decisions. In a prototype implementation we have interfaced the CAPO computer aided parallelization tool with the Paraver performance analysis tool. We describe both tools and their interface and give an example for how the interface helps within the program development cycle of a benchmark code.

Jost, Gabriele↗

Design Through Manufacturing: The Solid Model - Finite Element Analysis Interface

State-of-the-art computer aided design (CAD) presently affords engineers the opportunity to create solid models of machine parts which reflect every detail of the finished product. Ideally, these models should fulfill two very important functions: (1) they must provide numerical control information for automated manufacturing of precision parts, and (2) they must enable analysts to easily evaluate the stress levels (using finite element analysis - FEA) for all structurally significant parts used in space missions. Today's state-of-the-art CAD programs perform function (1) very well, providing an excellent model for precision manufacturing. But they do not provide a straightforward and simple means of automating the translation from CAD to FEA models, especially for aircraft-type structures. The research performed during the fellowship period investigated the transition process from the solid CAD model to the FEA stress analysis model with the final goal of creating an automatic interface between the two. During the period of the fellowship a detailed multi-year program for the development of such an interface was created. The ultimate goal of this program will be the development of a fully parameterized automatic ProE/FEA translator for parts and assemblies, with the incorporation of data base management into the solution, and ultimately including computational fluid dynamics and thermal modeling in the interface.

Rubin, Carol↗

Notes on Interface Growth Kinetics 50 Years After Burton, Cabrera and Frank

This is an overview of basic problems of crystal growth kinetics controlled by processes on the crystal interface with solution and melt. Included, also, are results on fundamental issues concerning morphological stability of crystal-solution interface that engage both interface kinetics and mass transport by diffusion and convection.

Chernov, A. A.↗

Advanced Technology Development: Solid-Liquid Interface Characterization Hardware

Characterizing the solid-liquid interface during directional solidification is key to understanding and improving material properties. The goal of this Advanced Technology Development (ATD) has been to develop hardware, which will enable real-time characterization of practical materials, such as aluminum (Al) alloys, to unprecedented levels. Required measurements include furnace and sample temperature gradients, undercooling at the growing interface, interface shape, or morphology, and furnace translation and sample growth rates (related). These and other parameters are correlated with each other and time. A major challenge was to design and develop all of the necessary hardware to measure the characteristics, nearly simultaneously, in a smaller integral furnace compatible with existing X-ray Transmission Microscopes, XTMs. Most of the desired goals have been accomplished through three generations of Seebeck furnace brassboards, several varieties of film thermocouple arrays, heaters, thermal modeling of the furnaces, and data acquisition and control (DAC) software. Presentations and publications have resulted from these activities, and proposals to use this hardware for further materials studies have been submitted as sequels to this last year of the ATD.

Source record↗

Future Concepts for Realtime Data Interfaces for Control Centers

Existing methods of exchanging realtime data between the major control centers in the International Space Station program have resulted in a patchwork of local formats being imposed on each Mission Control Center. This puts the burden on a data customer to comply with the proprietary data formats of each data supplier. This has increased the cost and complexity for each participant, limited access to mission data and hampered the development of efficient and flexible operations concepts. Ideally, a universal format should be promoted in the industry to prevent the unnecessary burden of each center processing a different data format standard for every external interface with another center. With the broad acceptance of XML and other conventions used in other industries, it is now time for the Aerospace industry to fully engage and establish such a standard. This paper will briefly consider the components that would be required by such a standard (XML schema, data dictionaries, etc.) in order to accomplish the goal of a universal low-cost interface, and acquire broad industry acceptance. We will then examine current approaches being developed by standards bodies and other groups. The current state of CCSDS panel work will be reviewed, with a survey of the degree of industry acceptance. Other widely accepted commercial approaches will be considered, sometimes complimentary to the standards work, but sometimes not. The question is whether de facto industry standards are in concert with, or in conflict with the direction of the standards bodies. And given that state of affairs, the author will consider whether a new program establishing its Mission Control Center should implement a data interface based on those standards. The author proposes that broad industry support to unify the various efforts will enable collaboration between control centers and space programs to a wider degree than is currently available. This will reduce the cost for programs to provide realtime access to their data, hence reducing the cost of access to space, and benefiting the industry as a whole.

Kearney, Mike W., III↗

Electrical double layers at the oil/water interface

This review presents the historical development and current status of the theory of the electrical double layer at a liquid/liquid interface. It gives rigorous thermodynamic definitions of all basic concepts related to liquid interfaces and to the electrical double layer. The difference between the surface of a solid electrode and the interface of two immiscible electrolyte solutions (ITIES) is analyzed in connection to their electrical properties. The most important classical relationships for the electrical double layer are presented and critically discussed. The generalized adsorption isotherm is derived. After a short review of the classical Gouy-Chapman and Verwey-Niessen models, more recent developments of the double layer theory are presented. These include effects of variable dielectric permittivity, nonlocal electrostatics, hydration forces, the modified Poisson-Boltzmann equation and the ion-dipole plasma. The relative merits of different theories are estimated by comparing them with computer simulation of the ITIES and electrical double layer. Special attention is given to the structure of ITIES and its variation due to adsorption of ions and amphiphilic molecules.

Non-NASA Center↗

Molecular dynamics of the water liquid-vapor interface

The results of molecular dynamics calculations on the equilibrium interface between liquid water and its vapor at 325 K are presented. For the TIP4P model of water intermolecular pair potentials, the average surface dipole density points from the vapor to the liquid. The most common orientations of water molecules have the C2 nu molecular axis roughly parallel to the interface. The distributions are quite broad and therefore compatible with the intermolecular correlations characteristic of bulk liquid water. All near-neighbor pairs in the outermost interfacial layers are hydrogen bonded according to the common definition adopted here. The orientational preferences of water molecules near a free surface differ from those near rigidly planar walls which can be interpreted in terms of patterns found in hexagonal ice 1. The mean electric field in the interfacial region is parallel to the mean polarization which indicates that attention cannot be limited to dipolar charge distributions in macroscopic descriptions of the electrical properties of this interface. The value of the surface tension obtained is 132 +/- 46 dyn/cm, significantly different from the value for experimental water of 68 dyn/cm at 325 K.

NASA Center ARC↗

Concentrations of anesthetics across the water-membrane interface; the Meyer-Overton hypothesis revisited

The free energies of transferring a variety of anesthetic and nonanesthetic compounds across water-oil and water-membrane interfaces were obtained using computer simulations. Anesthetics exhibit greatly enhanced concentrations at these interfaces, compared to nonanesthetics. The substitution of the interfacial solubilites of the anesthetics for their bulk lipid solubilities in the Meyer-Overton relation, was found to give a better correlation, indicating that the potency of an anesthetic is directly proportional to its solubility at the interface.

NASA Center ARC↗

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Ngo, Quoc↗