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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,279 records · Page 71
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Initial Field Testing in the Deep Subsurface for the Thermal Breakout Project for Measuring In Situ Stress

The current state-of-the-art technology for in situ stress measurements involves an integrated approach that combines borehole breakout observations, drilling-induced tensile fractures, and hydraulic fracturing tests (i.e., mini-fracs); however, this methodology has several limitations that often prevent successful in situ stress measurements. One major limitation is that breakouts do not appear in every borehole and are generally a natural occurrence that cannot easily be controlled. Because borehole breakouts are used to measure the maximum horizontal in situ stress magnitude, the absence of borehole breakouts presents a major data gap for in situ stress measurements. As a response to this data gap a new thermal breakout technology is being developed that will provide a method for thermally inducing borehole breakouts and obtaining consistent measurements of the maximum horizontal stress magnitude. This thermal breakout technology involves heating the borehole and increasing the thermoelastic compressive stress in the rock until a breakout develops, which is directly correlated to the maximum horizontal stress magnitude. An initial component of the thermal breakout project involves developing a prototype downhole tool and performing field testing in the deep subsurface. The primary objective of the initial tool development and field testing is to provide a physical proof of concept for the thermal breakout technology. Three thermal breakout field tests were performed at approximately 4850 feet deep in the Sanford Underground Research Facility. Each test was performed in a borehole that had been previously used for overcoring stress measurements. The third and final test successfully created two diametrically opposed breakouts after deploying the thermal breakout tool for approximately 3 hours of continuous heating. Post-analysis of the thermally induced breakouts confirmed that the thermal breakout orientation directly corresponds to the known in situ stress orientation and magnitude.

Voegeli, Sam↗
NASA NTRS1991

Thermal shock testing for assuring reliability of glass-sealed microelectronic packages

Tests were performed to determine if thermal shocking is destructive to glass-to-metal seal microelectronic packages and if thermal shock step stressing can compare package reliabilities. Thermal shocking was shown to be not destructive to highly reliable glass seals. Pin-pull tests used to compare the interfacial pin glass strengths showed no differences between thermal shocked and not-thermal shocked headers. A 'critical stress resistance temperature' was not exhibited by the 14 pin Dual In-line Package (DIP) headers evaluated. Headers manufactured in cryogenic nitrogen based and exothermically generated atmospheres showed differences in as-received leak rates, residual oxide depths and pin glass interfacial strengths; these were caused by the different manufacturing methods, in particular, by the chemically etched pins used by one manufacturer. Both header types passed thermal shock tests to temperature differentials of 646 C. The sensitivity of helium leak rate measurements was improved up to 70 percent by baking headers for two hours at 200 C after thermal shocking.

Thomas, Walter B., III↗
DOE OSTI2014

Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias

One of the main causes of failure during the lifetime of microelectronics devices is their exposure to fluctuating temperatures. In this work, synchrotron-based X-ray micro-diffraction is used to study the evolution of stresses in copper through-silicon via (TSV) interconnects, “as-received” and after 1000 thermal cycles. For both test conditions, significant fluctuations in the measured normal and shear stresses with depth are attributed to variations in the Cu grain orientation. Nevertheless, the mean hydrostatic stresses in the “as-received” Cu TSV were very low, at (16 ± 44) MPa, most likely due to room temperature stress relaxation. In contrast, the mean hydrostatic stresses along the entire length of the Cu TSV that had undergone 1000 thermal cycles (123 ± 37) MPa were found to be eight times greater, which was attributed to increased strain-hardening. The evolution in stresses with thermal cycling is a clear indication that the impact of Cu TSVs on front-end-of-line (FEOL) device performance will change through the lifetime of the 3D stacked dies, and ought to be accounted for during FEOL keep-out-zone design rules development.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2017

Stress Models of the Annual Hydrospheric, Atmospheric, Thermal, and Tidal Loading Cycles on California Faults: Perturbation of Background Stress and Changes in Seismicity

Stresses in the lithosphere arise from multiple natural loading sources that include both surface and body forces. The largest surface loads include near-surface water storage, snow and ice, atmosphere pressure, ocean loading, and temperature changes. The solid Earth also deforms from celestial body interactions and variations in Earth's rotation. We model the seasonal stress changes in California from 2006 through 2014 for seven different loading sources with annual periods to produce an aggregate stressing history for faults in the study area. Our modeling shows that the annual water loading, atmosphere, temperature, and Earth pole tides are the largest loading sources and should each be evaluated to fully describe seasonal stress changes. In California we find that the hydrological loads are the largest source of seasonal stresses. We explore the seasonal stresses with respect to the background principal stress orientation constrained with regional focal mechanisms and analyze the modulation of seismicity. Our results do not suggest a resolvable seasonal variation for the ambient stress orientation in the shallow crust. When projecting the seasonal stresses into the background stress orientation we find that the timing of microseismicity modestly increases from an ~8 kPa seasonal mean-normal-stress perturbation. The results suggest that faults in California are optimally oriented with the background stress field and respond to subsurface pressure changes, possibly due to processes we have not considered in this study. At any time a population of faults are near failure as evident from earthquakes triggered by these slight seasonal stress perturbations.

58 GEOSCIENCES↗
NASA NTRS1991

Synthesis of high performance ceramic fibers by chemical vapor deposition for advanced metallics reinforcing

The chemical vapor deposition (CVD) synthesis of fibers capable of effectively reinforcing intermetallic matrices at elevated temperatures which can be used for potential applications in high temperature composite materials is described. This process was used due to its advantage over other fiber synthesis processes. It is extremely important to produce these fibers with good reproducible and controlled growth rates. However, the complex interplay of mass and energy transfer, blended with the fluid dynamics makes this a formidable task. The design and development of CVD reactor assembly and system to synthesize TiB2, CrB, B4C, and TiC fibers was performed. Residual thermal analysis for estimating stresses arising form thermal expansion mismatch were determined. Various techniques to improve the mechanical properties were also performed. Various techniques for improving the fiber properties were elaborated. The crystal structure and its orientation for TiB2 fiber is discussed. An overall view of the CVD process to develop CrB2, TiB2, and other high performance ceramic fibers is presented.

Revankar, Vithal↗
NASA NTRS2003

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier Coatings

In this paper, surface cracking and interface reactions of a BSAS coating and a multi-layer ZTO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions, which were largely enhanced by the coating surface cracking in the water vapor environment, were investigated in detail, and the reaction phases were identified for the coating system after the long- term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions.

Zhu, Dongming↗
NASA NTRS2003

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier Coatings

In this paper, surface cracking and interface reactions of a BSAS coating and a multi-layer ZrO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions, which were largely enhanced by the coating surface cracking in the water vapor environment, were investigated in detail, and the reaction phases were identified for the coating system after the long-term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions.

Zhu, Dong-Ming↗
NASA NTRS1990

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier

In this paper, surface cracking and interface reactions of a ZrO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions that were largely enhanced by the coating surface cracking in the water vapor environment were investigated in detail, and the reaction phases were identified for the coating system after the long-term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions. The coating design issues will also be discussed based on the observed failure mechanisms under the high-heat-flux test conditions.

Zhu, Dongming↗
NASA NTRS2015

Thin, Flexible IMM Solar Array

NASA needs solar arrays that are thin, flexible, and highly efficient; package compactly for launch; and deploy into large, structurally stable high-power generators. Inverted metamorphic multijunction (IMM) solar cells can enable these arrays, but integration of this thin crystalline cell technology presents certain challenges. The Thin Hybrid Interconnected Solar Array (THINS) technology allows robust and reliable integration of IMM cells into a flexible blanket comprising standardized modules engineered for easy production. The modules support the IMM cell by using multifunctional materials for structural stability, shielding, coefficient of thermal expansion (CTE) stress relief, and integrated thermal and electrical functions. The design approach includes total encapsulation, which benefits high voltage as well as electrostatic performance.

Walmsley, Nicholas↗
DOE OSTI2020

Residually Stressed Bimaterial Beam Specimen for Measuring Environmentally Assisted Crack Growth

Background: Subcritical crack growth can occur in a brittle material when the stress intensity factor is smaller than the fracture toughness if an oxidizing agent (such as water) is present at the crack tip. Objective: Here we present a novel bi-material beam specimen which can measure environmentally assisted crack growth rates. The specimen is “self-loaded” by residual stress and requires no external loading. Methods: Two materials with different coefficient of thermal expansion are diffusion bonded at high temperature. After cooling to room temperature a subcritical crack is driven by thermal residual stresses. A finite element model is used to design the specimen geometry in terms of material properties in order to achieve the desired crack tip driving force. Results: The specimen is designed so that the crack driving force decreases as the crack extends, thus enabling the measurement of the crack velocity versus driving force relationship with a single test. The method is demonstrated by measuring slow crack growth data in soda lime silicate glass and validated by comparison to previously published data. Conclusions: The self-loaded nature of the specimen makes it ideal for measuring the very low crack velocities needed to predict brittle failure at long lifetimes.

36 MATERIALS SCIENCE↗
DOE OSTI2018

Polarization Tomography of Residual Stresses in Cylindrical Gradient-Index Lenses

In most cases, cylindrical structures with a gradient refractive index (GRIN) are formed on the basis of diffusion technology. The refractive index and the residual stresses in them are axially symmetrical. The distortion determined by diffusion and the thermal internal stresses in them are simulated by the fictive temperature of residual stresses. The use of the integral photoelasticity for the reconstruction of residual stresses in GRIN lenses is usually limited to the case of a planar deformed state. In this study, this algorithm is extended to the case of the axial change of residual stresses. It is assumed that the illumination procedure is carried out in the sample cross section. The optical problem is solved within the quasi-isotropic approximation. The reconstruction is based on measuring the characteristic parameters of polarized light passed through the sample and on the combined solution of the thermoelasticity problem.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
NASA NTRS1966

Pyrolytic graphite.

Pyrolytic graphite production by thermal decomposition of hydrocarbon gas on heated surface, noting annealing, alloying and residual stresses

PYROLYTIC GRAPHITE↗
NASA NTRS1983

Large-area sheet task: Advanced dendritic-web-growth development

Thermally generated stresses in the growing web crystal were reduced. These stresses, which if too high cause the ribbon to degenerate, were reduced by a factor of three, resulting in the demonstrated growth of high-quality web crystals to widths of 5.4 cm. This progress was brought about chiefly by the application of thermal models to the development of low-stress growth configurations. A new temperature model was developed which can analyze the thermal effects of much more complex lid and top shield configurations than was possible with the old lumped shield model. Growth experiments which supplied input data such as actual shield temperature and melt levels were used to verify the modeling results. Desirable modifications in the melt level-sensing circuitry were made in the new experimental web growth furnace, and this furnace has been used to carry out growth experiments under steady-state conditions. New growth configurations were tested in long growth runs at Westinghouse AESD which produced wider, lower stress and higher quality web crystals than designs previously used.

Duncan, C. S.↗
NASA NTRS1986

Dislocation dynamics during the growth of silicon ribbon

The thermal viscoplastic stresses and the dislocation densities in silicon ribbon are computed for an axially changing thermal profile by using an iterative finite difference method. A material constitutive equation (Haasen-Sumino model) which involves an internal variable (mobile dislocation density) is used. The results are interpreted as showing that there is a maximum width of silicon ribbon that can be grown when viscoplasticity and dislocations are considered. This maximum width limitation does not exist if the material behavior is elastic.

Dillon, O. W., Jr.↗
DOE OSTI2015

Temperature-dependent phase-specific deformation mechanisms in a directionally solidified NiAl-Cr(Mo) lamellar composite

Phase-specific thermal expansion and mechanical deformation behaviors of a directionally solidified NiAl–Cr(Mo) lamellar in situ composite were investigated by using real-time in situ neutron diffraction during compression at elevated temperatures up to 800 °C. Tensile and compressive thermal residual stresses were found to exist in the NiAl phase and Crss (solid solution) phase, respectively. Then, based on the evolution of lattice spacings and phase stresses, the phase-specific deformation behavior was analyzed qualitatively and quantitatively. Moreover, estimates of phase stresses were derived by Hooke's law on the basis of a simple method for the determination of stress-free lattice spacing in in situ composites. During compressive loading, the NiAl phase yields earlier than the Crss phase. The Crss phase carries much higher stress than the NiAl phase, and displays consistent strain hardening at all temperatures. The NiAl phase exhibits strain hardening at relatively low temperatures and softening at high temperatures. During unloading, the NiAl phase yields in tension whereas the Crss phase unloads elastically. Additionally, post-test microstructural observations show phase-through cracks at room temperature, micro cracks along phase interfaces at 600 °C and intact lamellae kinks at 800 °C, which is due to the increasing deformability of both phases as temperature rises.

36 MATERIALS SCIENCE↗
DOE OSTI2014

Low-temperature phase transitions in a soluble oligoacene and their effect on device performance and stability

The use of organic semiconductors in high-performance organic field-effect transistors requires a thorough understanding of the effects that processing conditions, thermal, and bias-stress history have on device operation. Here, we evaluate the temperature dependence of the electrical properties of transistors fabricated with 2,8-difluoro-5,11-bis(triethylsilylethynyl)anthradithiophene, a material that has attracted much attention recently due to its exceptional electrical properties. We have discovered a phase transition at T = 205 K and discuss its implications on device performance and stability. We examined the impact of this low-temperature phase transition on the thermodynamic, electrical, and structural properties of both single crystals and thin films of this material. Our results show that while the changes to the crystal structure are reversible, the induced thermal stress yields irreversible degradation of the devices.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2019

Thermally Conductive Backsheets (TCB) for Reduced Operating Temperatures

The performance of photovoltaic (PV) modules is primarily influenced by the plane of array (POA) irradiance and their operating temperature. The lower the module operating temperature, the higher is its performance. Increasing a module’s operating temperature reduces its power output due to an increase in the semiconductor’s intrinsic carrier density, leading to a reduction in the open-circuit voltage and, subsequently, reducing the maximum power point voltage. Reducing the operating temperature lowers the levelized cost of energy (LCOE) via increased energy production (i.e., more kilowatt hour over the life of the asset) and increased service lifetime (years in the field). The module operating temperature is dictated by the weather parameters and the thermal properties of module construction materials. The primary weather parameters influencing the PV module temperature are: the ambient temperature (directly related), irradiance (directly related), and wind speed (inversely related). The primary thermal properties of module construction materials influencing the PV module temperature are: the optical transmissivity and thermal conductivity of superstrate, the thermal conductivity of substrate, the thermal conductivity of encapsulant and the efficiency of the encapsulated solar cells. The primary goal of this study is to reduce the operating temperature of PV modules using thermally conductive backsheet (TCB) substrates developed by the industry. The temperature of PV modules installed in a large multi-MW plant can also be influenced by their physical locations in the plants due to the influence of wind direction. A thermal mapping of PV plants has also been investigated and presented in this study. The most commonly used PV backsheet material has been polyvinyl fluoride (DuPont trade name “Tedlar”)-based backsheet, which typically has three layers: Tedlar–polyethylene terephthalate (PET)–Tedlar (TPT). The primary goal of this project is to reduce the module operating temperature below the benchmark TPT backsheet temperature using newly developed TCBs by the industry. The overall approach of this project involves six focus areas: i) select and procure one TPT and thirteen promising TCBs available in the industry; ii) construct a large number of 1-cell and 9-cell modules using benchmark TPT and selected TCBs [all other construction materials are fixed and they are: glass superstrate, EVA encapsulant, mono-Si cell and junction box]; iii) to identify best performing TCBs, monitor the long-term field operating temperatures of the constructed modules which are installed in three climatic conditions (hot-low wind [Mesa, AZ], hot-high wind [Maricopa County, AZ] and temperate [Cumberland County, NC]; iv) to identify the most durable TCB, perform extended accelerated reliability testing of modules constructed with best three TCBs and benchmark TPT; v) to predict module temperature, develop physical and empirical thermal models with and without thermal properties of all construction materials in the modules, respectively; and vi) to determine the influence of wind speed and direction on the module operating temperature in a plant, and perform thermal mapping of PV modules in two large PV plants [Maricopa County, AZ and Cumberland County, NC]. The key achievements of this project are listed below: Backsheet selection: 14 backsheets were procured after an extensive literature and industry search. Finally, based on the thermal and other selection criteria, 1 TPT and 4 thermally conductive backsheets were selected for this project. Fabrication of mini modules: 50 one-cell modules were fabricated in year 1 for thermal performance evaluation. The module design was changed to nine-cell module at start of year 2 to mimic commercial design. 20 nine-cell modules were fabricated in year 2 for thermal performance evaluation. 28 four-cell modules were fabricated in year 3 for accelerated stress-testing. Thermal conductivity of backsheets: Year 1 TCBs showed at least 8% higher thermal conductivities than TPT. Year 2 and 3 TCBs showed at least 20% higher thermal conductivities than TPT. Installation of mini PV modules at three sites: 6 one-cell modules and 8 nine-cell modules were installed at AZ-1 site [Mesa, AZ]. 12 one-cell modules and 6 nine-cell modules were installed at each of two powerplants (AZ-2 [Maricopa County, AZ] and NC sites). Nominal operating cell temperatures (NOCT) of mini PV modules: NOCT of TCBs were observed to be lower than TPT with differences as high as 2°C. Comparison of thermal performance: The median operating temperature of one-cell modules was found to be reduced by 2°C by using TCB_A modules compared to TPT modules on several days in a month for few months in a year. The median temperature improvement of 4oC was achieved at several instances on a few days, but not all days, in a year using multiple TCBs compared to TPT. The final project milestone of achieving median temperature improvement of 5oC was achieved at several instances on a few days, but not all days, in a year using TCB_A compared to TPT. Empirical thermal model (without the need of construction material properties): Empirical thermal model for one-cell module was developed based on the input data of irradiance, wind speed and ambient temperatures. The primary input data differentiator for temperature differences between TPT and TCBs appears to be the irradiance level (solar gain). Accelerated durability testing: 20 four-cell modules using 4 backsheets (1 TPT and 3 TCBs) were exposed to Damp Heat 1000 hours (8 modules), UV/Thermal cycling (50 cycles)/Humidity freeze (10 cycles) test sequence (8 modules) and UV Weathering for qualification (8 modules). All the modules with four selected backsheets passed the stress tests per the retest guidelines of IEC 61215 standard for the backsheet change. Simplified comparative LCOE analysis: Using backsheet-specific power degradation levels in the accelerated tests (for TCB_A and TPT only), efficiency, service lifetime and assuming same cost for all backsheets, the LCOE of modules using TCB_A is determined to be lower than TPT. Due to lower operating temperature of TCB_A-based modules compared to TPT-based modules, the operating efficiency and service life of TCB_A-based modules are calculated to be higher than TPT-based modules. Temperature mapping of PV power plants: A distinct temperature difference (as high as 4°C) has been observed between the modules located in various parts of a single PV plant.

14 SOLAR ENERGY↗
NASA NTRS1992

Anodized aluminum coatings for thermal control. I - Coating process and stresses

Anodized aluminum is a candidate material for use as a thermal radiator surface on Space Station Freedom. Here, results of measurements of coating stress at room temperature are presented. The effects of coating process conditions and also subsequent exposure to different humidities, from above ambient to vacuum, are reported. The most important observation with regard to space applications is that the coating stress is very dependent on humidity, changing from compressive at ambient humidity to strongly tensile in 10 exp -6 torr vacuum. The increase in stress is accompanied by loss of water from the coating, and the process is reversible.

Alwitt, R. S.↗