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Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.
Fabrication method is described for alumina passivated silicon MISFET arrays. Technique involves total passivation beam-lead approach and provides completely sealed chip with double level interconnect capability. Refractory metal alloy is used to form interconnect system and obtain metal contacts that withstand temperatures of 873 K for short periods of time.
Pertinent information for hardware selection, design, manufacture, and quality control necessary for flat conductor cable interconnecting harness application is presented. Comparisons are made between round wire cable and flat conductor cable. The flat conductor cable interconnecting harness systems show major cost, weight, and space savings, plus increased system performance and reliability. The design application section includes electrical characteristics, harness design and development, and a full treatise on EMC considerations. Manufacturing and quality control sections pertain primarily to the developed conductor-contact connector system and special flat conductor cable to round wire cable transitions.
Three lightweight solar cell arrays have been fabricated with a high power-to-weight ratio. These arrays incorporate resistance welded interconnections, improved antireflection coating on the solar cell and lightweight substrates. Two of the substrates were constructed of magnesium with different structural geometry, while the third substrate was conventional aluminum honeycomb. All arrays utilized thin solar cells having a titanium-palladium-silver contact system and an antireflection coating of titanium oxide. The cells were welded with silver plated molybdenum interconnections. The two arrays having magnesium substrates exhibited a power/weight of 70.4 W/kg (32 W/lb.) and 81 W/kg (36.8 W/lb.), while the conventional array demonstrated a power/weight of 45.2 W/kg (20.6 W/lb.).
Advanced On-board Processor the (AOP) uses large scale integration throughout and is the most advanced space qualified computer of its class in existence today. It was designed to satisfy most spacecraft requirements which are anticipated over the next several years. The AOP design utilizes custom metallized multigate arrays (CMMA) which have been designed specifically for this computer. This approach provides the most efficient use of circuits, reduces volume, weight, assembly costs and provides for a significant increase in reliability by the significant reduction in conventional circuit interconnections. The required 69 CMMA packages are assembled on a single multilayer printed circuit board which together with associated connectors constitutes the complete AOP. This approach also reduces conventional interconnections thus further reducing weight, volume and assembly costs.
This report presents the development and description of the decomposition aggregation approach to stability investigations of high dimension mathematical models of dynamic systems. The high dimension vector differential equation describing a large dynamic system is decomposed into a number of lower dimension vector differential equations which represent interconnected subsystems. Then a method is described by which the stability properties of each subsystem are aggregated into a single vector Liapunov function, representing the aggregate system model, consisting of subsystem Liapunov functions as components. A linear vector differential inequality is then formed in terms of the vector Liapunov function. The matrix of the model, which reflects the stability properties of the subsystems and the nature of their interconnections, is analyzed to conclude over-all system stability characteristics. The technique is applied in detail to investigate the stability characteristics of a dynamic model of a hypothetical spinning Skylab.
The structure of a new separator material for electrochemical cells has been investigated. Investigation into details of the separator structure showed it to be multilayered and to consist mainly of a quasi-impervious organic skin, a porous region of mixed organic and inorganic material, and an area of nonuniformly treated substrate. The essential feature of the coating (slurry) is believed to be interconnected pores which allow ionic conductivity. The interconnected pores are believed to be formed by the interaction of the plasticizer and inorganic fibers. The major failure mode of silver zinc cells using such a separator (zinc nodules shorting adjacent plates) was investigated.
A digital communication system is reported for parallel operation of 16 or more transceiver units with the use of only four interconnecting wires. A remote synchronization circuit produces unit address control words sequentially in data frames of 16 words. Means are provided in each transceiver unit to decode calling signals and to transmit calling and data signals. The transceivers communicate with each other over one data line. The synchronization unit communicates the address control information to the transceiver units over an address line and further provides the timing information over a clock line. A reference voltage level or ground line completes the interconnecting four wire hookup.
The purpose of this paper is to develop new methods for constructing vector Lyapunov functions and broaden the application of Lyapunov's theory to stability analysis of large-scale dynamic systems. The application, so far limited by the assumption that the large-scale systems are composed of exponentially stable subsystems, is extended via the general concept of comparison functions to systems which can be decomposed into asymptotically stable subsystems. Asymptotic stability of the composite system is tested by a simple algebraic criterion. By redefining interconnection functions among the subsystems according to interconnection matrices, the same mathematical machinery can be used to determine connective asymptotic stability of large-scale systems under arbitrary structural perturbations.
The concept of vector Liapunov functions is used to obtain conditions for the exponential stability of large-scale discrete systems which can be decomposed into a number of interconnected subsystems with the same stability property. Both the structurally invariant composite systems and the large-scale systems under structural perturbations are considered. Connective absolute stability of a large-scale system composed of the interconnected Lur'e-type subsystems is defined and resolved in this context, resulting in a computationally and conceptually attractive alternative to a straightforward stability analysis of the system by frequency-domain criteria.
An analytical model is developed for the dynamics of a tilting proprotor aircraft engine and drive train, including a rotor speed governor and interconnect shaft. The dynamic stability of a proprotor and cantilever wing is calculated, including the engine-transmission-governor model. It is concluded that the rotor behaves much as if windmilling as far as its dynamic behavior is concerned, with some influence of the turboshaft engine inertia and damping. The interconnect shaft has a significant influence on the antisymmetric dynamics of proprotor aircraft. The proprotor aerodynamics model is extended to include reverse flow, and a refinement on the method used to calculate the kinematic pitch-bending coupling of the blade is developed.
A test method for the evaluation of metallization on semiconductors is presented and discussed. The method has been prepared in MIL-STD format for submittal as a proposed addition to MIL-STD-883. It is applicable to discrete devices and to integrated circuits and specifically addresses batch-process oriented defects. Quantitative accept/reject criteria are given for contact windows, other oxide steps, and general interconnecting metallization. Figures are provided that illustrate typical types of defects. Apparatus specifications, sampling plans, and specimen preparation and examination requirements are described. Procedures for glassivated devices and for multi-metal interconnection systems are included.
Handbook provides specific guidelines related to ceramic multilayer circuit fabrication in terms of packaging density and interconnection methods, guiding the designer from initial stages of ceramic multilayer interconnection and artwork generation through test pattern utilization, assembly operations, and final inspection and test procedures.
A piloted, fixed-base simulation was conducted to study the effectiveness of some automatic control system features designed to improve the stability and control characteristics of fighter airplanes at high angles of attack. These features include an angle-of-attack limiter, a normal-acceleration limiter, an aileron-rudder interconnect, and a stability-axis yaw damper. The study was based on a current lightweight fighter prototype. The aerodynamic data used in the simulation were measured on a 0.15-scale model at low Reynolds number and low subsonic Mach number. The simulation was conducted on the Langley differential maneuvering simulator, and the evaluation involved representative combat maneuvering. Results of the investigation show the fully augmented airplane to be quite stable and maneuverable throughout the operational angle-of-attack range. The angle-of-attack/normal-acceleration limiting feature of the pitch control system is found to be a necessity to avoid angle-of-attack excursions at high angles of attack. The aileron-rudder interconnect system is shown to be very effective in making the airplane departure resistant while the stability-axis yaw damper provided improved high-angle-of-attack roll performance with a minimum of sideslip excursions.
The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.
A multilevel feedback control scheme is proposed for optimization of large-scale systems composed of a number of (not necessarily weakly coupled) subsystems. Local controllers are used to optimize each subsystem, ignoring the interconnections. Then, a global controller may be applied to minimize the effect of interconnections and improve the performance of the overall system. At the cost of suboptimal performance, this optimization strategy ensures invariance of suboptimality and stability of the systems under structural perturbations whereby subsystems are disconnected and again connected during operation.
Two types of lift/cruise fan technology aircraft were conceptually designed. One aircraft used turbotip fans pneumatically interconnected to three gas generators, and the other aircraft used variable pitch fans mechanically interconnected to three turboshaft engines. The components of each propulsion transmission system were analyzed and designed to the depth necessary to determine areas of risk, development methods, performance, weights and costs. The types of materials and manufacturing processes were identified to show that the designs followed a low cost approach. The lift/cruise fan thrust vectoring hoods, which are applicable to either aircraft configuration, were also evaluated to assure a low cost/low risk approach.
Thick film technology is applicable to three areas of silicon solar cell fabrication; metallization, junction formation, and coating for protection of screened ohmic contacts, particularly wrap around contacts, interconnection and environmental protection. Both material and process parameters were investigated. Printed ohmic contacts on n- and p-type silicon are very sensitive to the processing parameters of firing time, temperature, and atmosphere. Wrap around contacts are easily achieved by first printing and firing a dielectric over the edge and subsequently applying a low firing temperature conductor. Interconnection of cells into arrays can be achieved by printing and cofiring thick film metal pastes, soldering, or with heat curing conductive epoxies on low cost substrates. Printed (thick) film vitreous protection coatings do not yet offer sufficient optical uniformity and transparency for use on silicon. A sprayed, heat curable SiO2 based resin shows promise of providing both optical matching and environmental protection.