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At least 127 records · Page 7

All sources NASA NTRS DOE OSTI

NASA NTRS2007

Wire Crimp Connectors Verification using Ultrasonic Inspection

The development of a new ultrasonic measurement technique to quantitatively assess wire crimp connections is discussed. The amplitude change of a compressional ultrasonic wave propagating through the junction of a crimp connector and wire is shown to correlate with the results of a destructive pull test, which previously has been used to assess crimp wire junction quality. Various crimp junction pathologies (missing wire strands, incorrect wire gauge, incomplete wire insertion in connector) are ultrasonically tested, and their results are correlated with pull tests. Results show that the ultrasonic measurement technique consistently (as evidenced with pull-testing data) predicts good crimps when ultrasonic transmission is above a certain threshold amplitude level. A physics-based model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process. This model is in agreement within 6% of the ultrasonic measurements. A prototype instrument for applying the technique while wire crimps are installed is also presented.

Cramer, K. Elliott↗

NASA NTRS2006

Ultrasonics Equipped Crimp Tool: A New Technology for Aircraft Wiring Safety

We report on the development of a new measurement technique to quantitatively assess the condition of wire crimp connections. This ultrasonic (UT) method transmits high frequency sound waves through the joint under inspection. The wire-crimp region filters and scatters the ultrasonic energy as it passes through the crimp and wire. The resulting output (both time and frequency domains) provides a quantitative measure of the joint quality that is independent and unaffected by current. Crimps of poor mechanical and electrical quality will result in low temporal output and will distort the spectrum into unique and predictable patterns, depending on crimp "quality". This inexpensive, real-time measurement system can provide certification of crimps as they are made and recertification of existing wire crimps currently in service. The measurements for re-certification do not require that the wire be disconnected from its circuit. No other technology exists to measure in-situ the condition of wire joints (no electrical currents through the crimp are used in this analytical technique). We discuss the signals obtained from this instrument, and correlate these signals with destructive wire pull tests.

Yost, William T.↗

NASA NTRS2013

Use of beam deflection to control an electron beam wire deposition process

A method for controlling an electron beam process wherein a wire is melted and deposited on a substrate as a molten pool comprises generating the electron beam with a complex raster pattern, and directing the beam onto an outer surface of the wire to thereby control a location of the wire with respect to the molten pool. Directing the beam selectively heats the outer surface of the wire and maintains the position of the wire with respect to the molten pool. An apparatus for controlling an electron beam process includes a beam gun adapted for generating the electron beam, and a controller adapted for providing the electron beam with a complex raster pattern and for directing the electron beam onto an outer surface of the wire to control a location of the wire with respect to the molten pool.

Taminger, Karen M.↗

NASA NTRS2007

Next Generation Wiring

Wiring is a major operational component on aerospace hardware that accounts for substantial weight and volumetric space. Over time wire insulation can age and fail, often leading to catastrophic events such as system failure or fire. The next generation of wiring must be reliable and sustainable over long periods of time. These features will be achieved by the development of a wire insulation capable of autonomous self-healing that mitigates failure before it reaches a catastrophic level. In order to develop a self-healing insulation material, three steps must occur. First, methods of bonding similar materials must be developed that are capable of being initiated autonomously. This process will lead to the development of a manual repair system for polyimide wire insulation. Second, ways to initiate these bonding methods that lead to materials that are similar to the primary insulation must be developed. Finally, steps one and two must be integrated to produce a material that has no residues from the process that degrades the insulating properties of the final repaired insulation. The self-healing technology, teamed with the ability to identify and locate damage, will greatly improve reliability and safety of electrical wiring of critical systems. This paper will address these topics, discuss the results of preliminary testing, and remaining development issues related to self-healing wire insulation.

Medelius, Petro↗

DOE OSTI2025

Fabrication and Test of C3a: A Six-Layer Subscale Canted $\cos \theta$ Dipole Magnet Using High-Temperature Superconducting corc Wires

REBCO coated conductors have a strong potential for high-field magnet applications. The REBCO technology, however, is still in its infancy for accelerator magnet applications. As part of the U.S. Magnet Development Program (MDP), we developed a six-layer canted cos θ dipole magnet, C3a, using CORC® wires developed by Advanced Conductor Technologies LLC. All the layers were wound using a semi-automated winding machine. Three layers of the magnet used CORC® wires containing the SuperPower “AP” REBCO tapes and the remaining layers used the wires containing the “HM” tapes. At 77 K, both kinds of CORC® wires showed 5% to 10% degradation, after bending to a minimum bend radius of 30 or 35 mm, with respect to the self-field critical current measured before winding. At 4.2 K, the magnet reached 9.5 kA at a ramp rate of 9 A s -1 and generated a dipole field of 1.4 T. Further, the critical current of one layer degraded by 4% after a current transient up to 10.5 kA ramped in an averaged rate of 175 kA s -1 or 20 T s -1 . We confirmed the HM CORC® wire can carry a higher current than the AP CORC® wire at 4.2 K. The test results of the C3a magnet showed that the fabrication and assembly procedure can be used for the upcoming full-scale C3 magnet.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

DOE OSTI2020

High-speed imaging of transition from fluid breakup to phase explosion in electric explosion of tungsten wires in air

High-speed visible imaging of sub-microsecond electric explosion of wires at the low specific energy deposition threshold reveals three distinct modes of wire failure as capacitor charge voltage and energy deposition are increased. For 100 micron diameter gold-plated tungsten wires of 2 cm length, deposited energies of 1.9 eV/atom produces a liquid column that undergoes hydrodynamic breakup into droplets with radii of order of wire diameter on timescales of 200 μs. Instability growth, column breakup, and droplet coalescence follow classic Rayleigh-Plateau predictions for instability of viscous fluid column. Above 3.2 eV/atom of deposited energy, wires are seen to abruptly transition to an expanding mixture of micron scale liquid-droplets and vapor within one frame (less than 3.33 μs), which has been termed ‘phase explosion’ in literature. Between these two limits, at 2.5 eV/atom of deposited energy, wire radius is unchanged for the first 10 μs before the onset of a rapid expansion and disintegration that resembles homogenous nucleation of mechanically unstable bubbles. Here, thermodynamic calculations are presented that separate cases by temperature obtained during heating: below boiling point, near boiling point, and exceeding boiling point.

42 ENGINEERING↗

DOE OSTI2020

Initial Temperature Testing of Advanced Manufactured Melt Wire Package

As a part of the In-Pile Instrumentation Program, The Idaho National Laboratory (INL) has recently established in-house capabilities to fabricate and test new advanced manufactured sensors for measuring the peak irradiation temperature inside a nuclear test reactor. Although nuclear test reactors can use standard methods of real-time temperature monitoring, such as thermocouples, the complexity of feedthroughs and attachment complications to collect real-time measurements greatly increases the cost of the experiment. Passive monitoring techniques may be utilized that exploit the melting point of well characterized material (standard melt wires), however, the limited space available for instrumentation during experiments is also a challenge. To accommodate the challenge, INL has expanded its temperature detection instrumentation capabilities paired with the advancement of in-house advanced manufacturing options to include printed melt wires for peak irradiation temperature measurement. The advanced manufactured melt wire package can determine peak temperatures in experiments that can fit the challenging space available during irradiation. Recent results and knowledge from this ongoing work have made it possible to develop unique temperature sensors that can accomplish user specific temperature ranges inside the harsh environments experienced during radiation testing. This report summarizes the initial temperature testing using fabricated melt wires with two different melting temperatures, silver (melting temperature of ~960 °C) and solder (melting temperature of ~160 °C), that were initially tested for their relative melting points using non-standard method of furnace and hot plate testing under normal air conditions. Future work will include more controlled way of testing printed melt wires under inert gas with multiple temperature measurements followed by comparison of standard melt wire package performance for baseline characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2024

Additive manufacturing enabled hot-wire apparatus with suppressed edge effect error

This invention describes a method of structuring a metal or metal coated wire in a manner such that it provides enhanced accuracy when used in a hot-wire apparatus for transient thermal conductivity measurements for low-density materials. This is accomplished by using a diameter varying structure with two ends of the wire of sufficiently small diameter that the edge-effect induced error can be reduced by generating a more uniform temperature profile along the wire, whereas in conventional apparatus the temperatures always drop at the ends of a finite wire due to its ends that are being cooled by the wire-supports.

36 MATERIALS SCIENCE↗

DOE OSTI2022

Magnetic control over the fundamental structure of atomic wires

When reducing the size of materials towards the nanoscale, magnetic properties can emerge due to structural variations. Here, we show the reverse effect, where the structure of nanomaterials is controlled by magnetic manipulations. Using the break-junction technique, we find that the interatomic distance in platinum atomic wires is shorter or longer by up to ~20%, when a magnetic field is applied parallel or perpendicular to the wires during their formation, respectively. The magnetic field direction also affects the wire length, where longer (shorter) wires are formed under a parallel (perpendicular) field. Our experimental analysis, supported by calculations, indicates that the direction of the applied magnetic field promotes the formation of suspended atomic wires with a specific magnetization orientation associated with typical orbital characteristics, interatomic distance, and stability. A similar effect is found for various metal and metal-oxide atomic wires, demonstrating that magnetic fields can control the atomistic structure of different nanomaterials when applied during their formation stage.

36 MATERIALS SCIENCE↗

DOE OSTI2023

Variation of effective filament diameter, irreversibility field, anisotropy, and pinning efficiency in Bi-2212 round wires

Abstract In recent years Bi 2 Sr 2 CaCu 2 O x (Bi-2212) received increasing attention due to its round wire multifilamentary architecture, a unique feature in high- T c superconductor. In fact, round wires are preferable for magnet designs, including solenoids for nuclear magnetic resonance (NMR) or research purpose and accelerator magnets. However, due to the narrow over-pressure heat treatment conditions necessary to obtain high J c and to the peculiar microstructure of Bi-2212 wires, a full understanding of the correlations between the different properties has not yet been developed. In this paper we investigate the effect of a vital part of Bi-2212 optimization, the maximum heat-treatment temperature T max in the range of 885 °C–896 °C, on the variations of J c , effective filament diameter d eff , anisotropy γ , INTER- and intra-grain irreversibility fields and pinning energies U 0 , all critical parameters in unravelling the complex mix of vortex pinning and connectivity that ultimately determines the critical current density. We found that d eff of the higher J c wires heat-treated at lower temperature is much smaller than for the lower J c wires. Moreover, a systematic increase of the irreversibility field and a decrease of the intrinsic Bi-2212 anisotropy underpins the higher J c . The analysis of the pinning energies reveals that there is little sample-to-sample variation in the INTER-grain pinning, whereas in all samples the intra-grain pinning has an enhancement below ∼40–45 K becoming more and more evident with increasing J c . These results suggest that the overall J c performance are not only related to the wire microstructure and connectivity, which obviously affect the INTER-grain properties, but they are also intimately related to the intrinsic and intra-grain properties such as γ and U 0 .

Physics↗

DOE OSTI2025

Optical Absorption Spectroscopy Probes Water Wire and Its Ordering in a Hydrogen-Bond Network

Water wires, quasi-one-dimensional chains composed of hydrogen-bonded (H-bonded) water molecules, play a fundamental role in numerous chemical, physical, and physiological processes. Yet direct experimental detection of water wires has been elusive so far. Based on advanced many-body theory that includes electron-hole interactions, we report that optical absorption spectroscopy can serve as a sensitive probe of water wires and their ordering. In both liquid and solid water, the main peak of the spectrum is discovered to be a charge-transfer exciton. In water, the charge-transfer exciton is strongly coupled to the H-bonding environment where the exciton is excited between H-bonded water molecules with a large spectral intensity. In regular ice, the spectral weight of the charge-transfer exciton is enhanced by a collective excitation occurring on proton-ordered water wires, whose spectral intensity scales with the ordering length of water wire. The spectral intensity and excitonic interaction strength reaches its maximum in ice XI, where the long-range ordering length yields the most pronounced spectral signal. Our findings suggest that water wires, which widely exist in important physiological and biological systems and other phases of ice, can be directly probed by this approach. Published by the American Physical Society 2025

Tang, Fujie (ORCID:0000000197615359)↗

DOE OSTI2021

Critical Current Distributions of Recent Bi-2212 Round Wires

Bi 2 Sr 2 CaCu 2 O 8+x (Bi-2212) is the only high-field, high-temperature superconductor (HTS) capable of reaching a critical current density J c (16 T, 4.2 K) of 6500 A·mm –2 in the highly desirable round wire (RW) form. However, state-of-the-art Bi-2212 conductors still have a critical current density (J c ) to depairing current density (J d ) ratio around 20 to 30 times lower than that of state-of-the-art Nb–Ti or REBCO. Previously, we have shown that recent improvements in Bi-2212 RW J c are due to improved connectivity associated with optimization of the heat treatment process, and most recently due to a transition to a finer and more uniform powder manufactured by Engi-Mat. One quantitative measure of connectivity may be the critical current (I c ) distribution, since the local I c in a wire can vary along the length due to variable vortex-microstructure interactions and to factors such as filament shape variations, grain-to-grain connectivity variations and blocking secondary phase distributions. Modeling the experimental V-I transition measured on a low resistance shunt as a complex sum of voltage contributions of individual filament and wire sub-sections allows a numerical extraction of the I c distribution from the d 2 V/dI 2 treatment of the V-I curves. Here we compare ~0.1 m length I c distributions of Bi-2212 RWs with recent state-of-the-art very high-J c Engi-Mat powder and lower J c and older Nexans granulate powder. We do find that the I c spread for Bi-2212 wires is about twice the relative standard of high-J c Nb–Ti well below H irr . We do not yet see any obvious contribution of the Bi-2212 anisotropy to the I c distribution and are rather encouraged that these Bi-2212 round wires show relative I c distributions not too far from high-J c Nb–Ti wires.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

DOE OSTI2023

Exploring Randomly Wired Neural Networks for Climate Model Emulation

Exploring the climate impacts of various anthropogenic emissions scenarios is key to making informed decisions for climate change mitigation and adaptation. State-of-the-art Earth system models can provide detailed insight into these impacts but have a large associated computational cost on a per-scenario basis. This large computational burden has driven recent interest in developing cheap machine learning models for the task of climate model emulation. In this paper, we explore the efficacy of randomly wired neural networks for this task. We describe how they can be constructed and compare them with their standard feedforward counterparts using the ClimateBench dataset. Specifically, we replace the serially connected dense layers in multilayer perceptrons, convolutional neural networks, and convolutional long short-term memory networks with randomly wired dense layers and assess the impact on model performance for models with 1 million and 10 million parameters. We find that models with less-complex architectures see the greatest performance improvement with the addition of random wiring (up to 30.4% for multilayer perceptrons). Furthermore, of 24 different model architecture, parameter count, and prediction task combinations, only one had a statistically significant performance deficit in randomly wired networks relative to their standard counterparts, with 14 cases showing statistically significant improvement. We also find no significant difference in prediction speed between networks with standard feedforward dense layers and those with randomly wired layers. These findings indicate that randomly wired neural networks may be suitable direct replacements for traditional dense layers in many standard models.

54 ENVIRONMENTAL SCIENCES↗

DOE OSTI2024

Wire scanner assessment of transverse beam size in the Fermilab side-coupled linac

The Fermilab Side-Coupled Linac contains seven 805 MHz modules accelerating H- beam from 116 MeV to 400 MeV. Each module contains at least one wire scanner, yielding beam intensity at positions along a transverse direction. These wire scanners each contain three wires, mounted at different angles: "X", "Y", and 45° between "X" and "Y" to analyze coupling. Recently, a significant amount of transverse X-Y coupling was identified within wire scanner data from the Side-Coupled Linac, which has been present in data from the past decade. This realization has prompted an investigation into the wire scanner's utility as a diagnostic tool in the Fermilab Linac. This work presents efforts to better characterize the wire scanners' limitations and the phenomenon occurring in the Side-Coupled Linac.

43 PARTICLE ACCELERATORS↗

DOE OSTI2023

Metal (Cu,Al)/CNT Composite Wires for Energy Efficient Motors

This report summarizes the main results of research project on Metal/CNT nanocomposites conducted at University of Central Florida (UCF). It should be noted that the project was budgeted for three years, but the budget period 3 was unfortunately not funded and conducted in COVID19 pandemic years due to many reasons. The demonstration plan on the small motors was also removed according to the discussion with the DOE program manager. All research activities were focused on the (Cu,Al)/CNT material development and wire extrusion. Existing methods to fabricate Metal/CNTs were usually suffering from agglomeration of CNTs due to their density and stiffness differences. A new method is studied by the UCF research team, where CNTs are surface treated firstly, then coated with pure metals (i.e., Al, Cu, and Nickle). The metal encapsulation on CNT is expected to significantly improve the interfacial bonding between CNTs and the intimated metal matrices. The coated CNT powders were used to make sample materials through sintering, then a customized wire extrusion process was employed to fabricate wires. Measurement of material property improvements in mechanical strength, thermal conductivity, and electrical conductivity were conducted on both cylinder samples and extruded wires. In addition to the sintering process, casting on metal coated CNT powder was also investigated. The best results we achieved are summarized as follows. (1) The measured thermal conductivity of Al/CNT composite made with Ni-encapsulated CNTs and pure Al powders is about 85% better than that of pure aluminum fabricated. The measured electrical conductivity of fabricated Al/CNT is about 14-20% better than that of pure aluminum. (2) The measured electrical conductivity of Cu/CNT is about 14.5% better than that of pure copper fabricated. (3) The mechanical strengths of both Cu/CNT and Al/CNT (with about 1% wt. CNTs) are 70% better than pure metals although losing some material ductility. (4) Two-stage wire extrusion at high temperatures were designed and successfully conducted to fabricate wires of Metal/CNTs.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Wire Scanner Assessment of Transverse Beam Size in the Fermilab Side-Coupled Linac

43 PARTICLE ACCELERATORS↗

DOE OSTI2023

Advanced Manufacturing of High-Performance Superconductor Wires for Next Generation Electric Machines

While the transition of RE-Ba-Cu-O (REBCO, RE = rare earth) wires from lab-scale to initial manufacturing demonstrations has been accomplished, the high manufacturing cost is a major impediment to a commercial market. At the onset of this project, commercial REBCO wires exhibiting a critical current of ~ 340 A/cm at 65 K, 1.5T (operating condition of superconducting rotating machines targeted in this project) costed about $\$$300/kA-m which is well above the cost of copper wire. In this project, the UH-led team employed multiple innovative techniques to meet the aggressive performance and cost targets established. The key technology that was developed in this project was advanced metal organic chemical vapor deposition (MOCVD) to fabricate REBCO wires with films as thick as 5 µm and with excellent critical current performance at 65 K, 1.5 T. In addition to excellent performance in short samples, a major accomplishment of this project was to scale up the Advanced MOCVD technology to lengths of 50 meters while maintaining the superior critical current. Multiple 50-m-long tapes were demonstrated in the project with uniform critical current, that confirmed the viability of our technology for industrial manufacturing. Beyond scaling up our technology to long lengths, we worked with our industrial partners to design a REBCO-based motor coil, constructed one such coil and fabricated it using long tapes made in this project. This motor coil was successfully tested at 77 K and 65 K which affirmed the viability of high-performance REBCO wires made in this work for industrial applications. In addition to high critical current, we also demonstrated >4x precursor-to-film conversion efficiency in the advanced MOCVD process which has a first order impact on wire cost.

36 MATERIALS SCIENCE↗

NASA NTRS1971

Reliability improvement of 1 mil aluminum wire bonds for semiconductors, technical performance summary

The reliability of semiconductor devices as influenced by the reliability of wire bonds used in the assembly of the devices is investigated. The specific type of failure dealt with involves fracture of wire bonds as a result of repeated flexure of the wire at the heel of the bond when the devices are operated in an on-off mode. The mechanism of failure is one of induced fracture of the wire. To improve the reliability of a chosen transistor, one-mil diameter wires of aluminum with various alloy additions were studied using an accelerated fatigue testing machine. In addition, the electroprobe was used to study the metallurgy of the wires as to microstructure and kinetics of the growth of insoluble phases. Thermocompression and ultrasonic bonding techniques were also investigated.

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