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NASA NTRS1992

Extrapolation procedures in Mott electron polarimetry

In standard Mott electron polarimetry using thin gold film targets, extrapolation procedures must be used to reduce the experimentally measured asymmetries A to the values they would have for scattering from single atoms. These extrapolations involve the dependent of A on either the gold film thickness or the maximum detected electron energy loss in the target. A concentric cylindrical-electrode Mott polarimeter, has been used to study and compare these two types of extrapolations over the electron energy range 20-100 keV. The potential systematic errors which can result from such procedures are analyzed in detail, particularly with regard to the use of various fitting functions in thickness extrapolations, and the failure of perfect energy-loss discrimination to yield accurate polarizations when thick foils are used.

Gay, T. J.↗

NASA NTRS1972

Electron-beam-deposited thin polymer films - Electrical properties vs bombarding current.

Polymer films about 150 A thick, deposited on glass substrates by electron bombardment of tetramethyltetraphenyltrisiloxane, were studied, after being sandwiched between evaporated aluminum electrodes, the top one semitransparent. The capacitance, conductance, and photoconductance of the sandwiches were measured at room temperature as a function of the electron bombarding current which formed the polymer. The polymer thickness was obtained independently from Christy's (1960) empirical formula for the rate of formation. The obtained results indicate that, with increasing bombarding current, the polymer undergoes an increase in both crosslinking bonds and dangling bonds. Exposure to air drastically reduces the density of dangling bonds, but does not affect the crosslinking.

Babcock, L. E.↗

NASA NTRS1984

Failure Analysis of Nickel-hydrogen Cell Subjected to Simulated Low Earth Orbit Cycling

A nickel-hydrogen cell completed 10,080 simulated low earth orbit charge/discharge cycles at depths-of-discharge ranging from 50 to 80 percent prior to failure. The cell is of the Air Force design, rated at 50 ampere-hours, 8.9 cm (3.5 inches) in diameter. Upon disassembly, the end of the polysulfone core supporting the electrode stack was found to have fractured. This allowed the electrode stack to expand. A massive short was found at the inner diameter of the electrodes centered roughly at plate set 34 to 37 from the positive end of the electrode stack. The damaged area extended through approximately one third of the electrode stack, with the effect becoming progressively less with distance from plate set 34 to 37. Measured thicknesses of the positive plates were significantly greater than the initial specification values. The postulated cause of failure is that positive plate growth caused fracture of the shoulder from the end of the polysulfone core on which the electrodes are mounted. The electrode stack relieved and pressure points were created at the area near the inner diameter of the plates at the tab attachment. A short occurred at a pressure point between opposing plates and propagated to other electrode sets due to thermal and mechanical stresses caused by the short.

Mueller, V. C.↗

NASA NTRS2011

Reliability Evaluation of Base-Metal-Electrode Multilayer Ceramic Capacitors for Potential Space Applications

Base-metal-electrode (BME) ceramic capacitors are being investigated for possible use in high-reliability spacelevel applications. This paper focuses on how BME capacitors construction and microstructure affects their lifetime and reliability. Examination of the construction and microstructure of commercial off-the-shelf (COTS) BME capacitors reveals great variance in dielectric layer thickness, even among BME capacitors with the same rated voltage. Compared to PME (precious-metal-electrode) capacitors, BME capacitors exhibit a denser and more uniform microstructure, with an average grain size between 0.3 and 0.5 m, which is much less than that of most PME capacitors. BME capacitors can be fabricated with more internal electrode layers and thinner dielectric layers than PME capacitors because they have a fine-grained microstructure and do not shrink much during ceramic sintering. This makes it possible for BME capacitors to achieve a very high capacitance volumetric efficiency. The reliability of BME and PME capacitors was investigated using highly accelerated life testing (HALT). Most BME capacitors were found to fail with an early avalanche breakdown, followed by a regular dielectric wearout failure during the HALT test. When most of the early failures, characterized with avalanche breakdown, were removed, BME capacitors exhibited a minimum mean time-to-failure (MTTF) of more than 105 years at room temperature and rated voltage. Dielectric thickness was found to be a critical parameter for the reliability of BME capacitors. The number of stacked grains in a dielectric layer appears to play a significant role in determining BME capacitor reliability. Although dielectric layer thickness varies for a given rated voltage in BME capacitors, the number of stacked grains is relatively consistent, typically around 12 for a number of BME capacitors with a rated voltage of 25V. This may suggest that the number of grains per dielectric layer is more critical than the thickness itself for determining the rated voltage and the life expectancy of the BME capacitor. The leakage current characterization and the failure analysis results suggest that most of these early avalanche failures are due to the extrinsic minor construction defects introduced during fabrication of BME capacitors. The concentration of the extrinsic defects must be reduced if the BME capacitors are considered for high reliability applications. There are two approaches that can reduce or prevent the occurrence of early failure in BME capacitors: (1) to reduce the defect concentration with improved processing control; (2) to prevent the use of BME capacitors under harsh external stress levels so that the extrinsic defects will never be triggered for a failure. In order to do so appropriate dielectric layer thickness must be determined for a given rated voltage.

Liu, David (Donhang)↗

NASA NTRS1981

Chemical and morphological characteristics of lithium electrode surfaces

Lithium electrode surfaces were analyzed for chemical and morphological characteristics, using electron spectroscopy chemical analysis (ESCA) and scanning electron microscopy (SEM). Samples included lithium metal and lithium electrodes which were cycled in a 1.5 M lithium arsenic hexafluoride/two-methyl tetrahydrofuran electrolyte. Results show that the surface of the as-received lithium metal was already covered by a film composed of LiO2 and an Li2O/CO2 adduct with a thickness of approximately 100-200 A. No evidence of Ni3 was found. Upon exposure of the lithium electrode to a 1.5 M LiAsF6/2-Me-THF electrochemical environment, a second film was observed to form on the surface, consisting primarily of As, Si, and F, possibly in the form of lithium arsenic oxyfluorides or lithium fluorosilicates. It is suggested that the film formation may be attributed to salt degradation.

Yen, S. P. S.↗

NASA NTRS1973

Use of thin film light detector

A photovoltaic cell device with a trapezoidal barrier is described. An aluminum, magnesium, or tantalum base is vapor deposited on a quartz substrate. An oxide or nitride film of the base metal is produced as an insulator by reaction in a glow discharge plasma to a thickness of less than 100 Angstroms. A metal, preferably gold, conter-electrode is vapor deposited on the insulating layer. A bias generator of high impedance is used to set and shift or modulate the spectral response of the device.

Lewicki, G. W.↗

NASA NTRS1983

Transducers for ultrasonic limb plethysmography

The design, construction, and performance characteristics of ultasonic transducers suitable for limb plethysmography are presented. Both 3-mm-diameter flat-plate and 12-mm-diameter hemispheric ceramic transducers operating at 2 MHz were fitted in 1-mm thick epoxy-resin lens/acoustic-coupling structures and mounted in exercie-EKG electrode housings for placement on the calf using adhesive collars. The effects of transducer directional characteristics on performance under off-axis rotation and the electrical impedances of the transducers were measured: The flat transducer was found to be sensitive to rotation and have an impedance of 800 ohms; the hemispheric transducer, to be unaffected by rotation and have an impedance of 80 ohms. The use of hemispheric transducers as both transmitter and receiver, or of a flat transducer as transmitter and a hemispheric transducer as receiver, was found to produce adequate dimensional measurements, with minimum care in transducer placement, in short-term physiological experiments and long-term (up to 7-day) attachment tests.

Nickell, W. T.↗

NASA NTRS2005

Modifications of Fabrication of Vibratory Microgyroscopes

A micromachining process for the fabrication of vibratory microgyroscopes from silicon wafers, and aspects of the microgyroscope design that are inextricably linked with the fabrication process, have been modified in an effort to increase production yields from perspectives of both quantity and quality. Prior to the modifications, the effective production yield of working microgyroscopes was limited to one or less per wafer. The modifications are part of a continuing effort to improve the design and increase production yields to more than 30 working microgyroscopes per wafer. A discussion of pertinent aspects of the unmodified design and the unmodified fabrication process is prerequisite to a meaningful description of the modifications. The design of the microgyroscope package was not conducive to high yield and rapid testing of many microgyroscopes. One of the major impediments to high yield and testing was found to lie in vibration- isolation beams around the four edges of each microgyroscope, which beams were found to be unnecessary for achieving high resonance quality factors (Q values) characterizing the vibrations of petallike cantilevers. The fabrication process included an 8- m-deep plasma etch. The purpose of the etch was to create 8- m vertical gaps, below which were to be placed large gold evaporated electrodes and sensing pads to drive and sense resonant vibrations of the "petals." The process also included a step in which bridges between dies were cut to separate the dies. The etched areas must be kept clean and smooth (free of debris and spikes), because any object close to 8 m high in those areas would stop the vibrations. However, it was found that after the etch, there remained some spikes with heights that were, variously, almost as high or as high as the etch depth. It also was found that the cutting of bridges created silicon debris, some of which lodged in the 8- m gaps and some of which landed on top of the petals. The masses added to the petals by the debris altered resonance frequencies and/or Q values to unacceptable degrees. Hence, the spikes and the debris have been conjectured to cause most of the observed malfunctions of newly fabricated microgyroscopes. Another pertinent aspect of the unmodified design and process was the fabrication of electrodes and the 8- m capacitance gap on a 500- m-thick wafer, and the fabrication of a 3-mm-thick baseplate from another wafer. It was necessary to bond these wafers to each other in an assembly step that was later found to be superfluous in that it could be eliminated by a suitable modification of the design.

Bae, Sam Y.↗

NASA NTRS1972

Preparation of thin film silver fluoride electrodes from constituent elements

The feasibility of preparing thin-film metal fluoride electrodes from the elemental constituents has been demonstrated. Silver fluoride cathodes were prepared by deposition of silver on a conducting graphite substrate followed by fluorination under controlled conditions using elemental fluorine. The resulting electrodes were of high purity, and the variables such as size, shape, and thickness were easily controlled.

Odonnell, P. M.↗

NASA NTRS1981

Effect of thrust chamber configuration on MPD arcjet performance

The performance of quasisteady multimegawatt MPD thrusters is significantly affected by anode thickness, location, and orifice radius, and by cathode length. Terminal voltage oscillations and electrode erosion are deferred until higher currents by anodes at more downstream locations and of smaller orifice radius and by cathodes of greater length. Without an optimized geometry, specific impulses of 3300 s and thrust efficiencies up to 31% are implied by the best data.

King, D. Q.↗

NASA NTRS1983

Measuring Elastic Modulus of Sintered Metal

Technique minimizes effect of substrate on thin sintered coating. Uniaxial tension test yields approximate value for elastic modulus of sintered material on thin substrate. Electrode composed of central perforated nickel plated steel sheet about 4 mils (0.1mm) thick, coated on each face by porous sintered nickel about 8 mils (0.2mm) thick.

Fedors, R. F.↗

NASA NTRS1992

Improved Capacitive Liquid Sensor

Improved capacitive sensor used to detect presence and/or measure thickness of layer of liquid. Electrical impedance or admittance of sensor measured at prescribed frequency, and thickness of liquid inferred from predetermined theoretical or experimental relationship between impedance and thickness. Sensor is basically a three-terminal device. Features interdigitated driving and sensing electrodes and peripheral coplanar ground electrode that reduces parasitic effects. Patent-pending because first to utilize ground plane as "shunting" electrode. System less expensive than infrared, microwave, or refractive-index systems. Sensor successfully evaluated in commercial production plants to characterize emulsions, slurries, and solutions.

Waldman, Francis A.↗

NASA NTRS1997

Microfabricated Ice-Detection Sensor

Knowledge of ice conditions on important aircraft lift and control surfaces is critical for safe operation. These conditions can be determined with conventional ice-detection sensors, but these sensors are often expensive, require elaborate installation procedures, and interrupt the airflow. A micromachined, silicon-based, flush-mounted sensor which generates no internal heat has been designed, batch fabricated, packaged, and tested. The sensor is capable of distinguishing between an ice-covered and a clean surface. It employs a bulk micromachined wafer with a 7 micrometer-thick, boron-doped, silicon diaphragm which serves as one plate of a parallel-plate capacitor. This is bonded to a second silicon wafer which contains the fixed electrodes, one to drive the diaphragm by application of a voltage, the other to measure the deflection by a change in capacitance. The diaphragm sizes ranged from 1x1 mm to 3x3 mm, and the gap between parallel-plate capacitors is 2 micrometers. A 200 V d.c. was applied to the driving electrode which caused the capacitance to increase approximately 0.6pf, from a nominal capacitance of 0.6pf, when the surface was ice free. After the sensor was cooled below the freezing point of water, the same voltage range was applied to the drive electrode. The capacitance increased by the same amount. Then a drop of water was placed over the diaphragm and allowed to freeze. This created an approximately 2mm-thick ice layer. The applied 200V d.c. produced no change in capacitance, confirming that the diaphragm was locked to the ice layer. Since the sensor uses capacitive actuation, it uses very little power and is an ideal candidate for inclusion in a wireless sensing system.

DeAnna, Russell G.↗

NASA NTRS1991

How to create ball lightning

Procedures are given on how to produce ball lightning. Necessary equipment includes a transformer of 150,000 watts capable of providing approximately 10,000 amperes at 15 volts, 60 cycles; thick one inch cables of stranded wire leading into a 3 by 4 by 1 foot plastic tank; a quarter inch thick 4 by 6 inch aluminum plate to be used as one of the discharge electrodes; and another electrode of heavy copper wire with the insulation stripped back 6 inches.

Golka, Robert K., Jr.↗

NASA NTRSDate not supplied

High Altitude Re-entry Plasma Emulation Experiment (HARPEE)

A table-top apparatus has recently been constructed at the NASA Glenn Research Center to investigate potential solutions for the radio-frequency communication blackout problem -- experienced by landing modules during high-speed atmospheric entry. This customized plasma chamber was designed to emulate Earth-based atmospheric entry plasmas with electron densities in the range of 10^16 m^-3 to 10^19 m^-3. The system makes use of a 40-kHz, perforated coaxial electrode pair to generate a disk-shaped, static plasma with an approximate diameter and thickness of 405 mm and 100 mm, respectively. A translatable Langmuir probe was employed to characterize the radial profile of electron temperature and density as a function the 40-kHz power (< 1 kW) and dry-nitrogen flow rate (< 160 SCCM).

plasma↗

NASA NTRS2004

Progress in High Power Density SOFC Material Development for Aerospace Applications

Solid oxide fuel cell (SOFC) systems for aircraft applications require order of magnitude increase in specific power density and long life under aircraft operating conditions. Advanced SOFC materials and fabrication processes are being developed at NASA GRC to increase specific power density and durability of SOFC cell and stack. Initial research efforts for increasing specific power density are directed toward increasing the operating temperature for the SOFC system and reducing the weight of the stack. While significant research is underway to develop anode supported SOFC system operating at temperatures in the range of 650 - 850 C for ground power generation applications, such temperatures may not yield the power densities required for aircraft applications. For electrode-supported cells, SOFC stacks with power densities greater than 1.0 W/sq cm are favorable at temperatures in excess of 900 C. The performance of various commercial and developmental anode supported cells is currently being evaluated in the temperature range of 900 to 1000 C to assess the performance gains and materials reliability. The results from these studies will be presented. Since metal interconnects developed for lower temperature operation are not practical at these high temperatures, advanced perovskite based ceramic interconnects with high electronic conductivity and lower sintering temperatures are being developed. Another option for increasing specific power density of SOFC stacks is to decrease the stack weight. Since the interconnect contributes to a significant portion of the stack weight, considerable weight benefits can be derived by decreasing its thickness. Eliminating the gas channels in the interconnect by engineering the pore structure in both anode and cathode can offer significant reduction in thickness of the ceramic interconnect material. New solid oxide fuel cells are being developed with porous engineered electrode supported structures with a 10 - 20 micron thin electrolyte. The performance data for advanced SOFC cells with engineered porosity in both electrodes will be presented.

Cable, Thomas L.↗

NASA NTRS1996

Ice Detector and Deicing Fluid Effectiveness Monitoring System

An ice detector and deicing fluid effectiveness monitoring system for an aircraft is disclosed. The ice detection portion is particularly suited for use in flight to notify the flight crew of an accumulation of ice on an aircraft lifting and control surfaces, or helicopter rotors, whereas the deicing fluid effectiveness monitoring portion is particularly suited for use on the ground to notify the flight crew of the possible loss of the effectiveness of the deicing fluid. The ice detection portion comprises a temperature sensor and a parallel arrangement of electrodes whose coefficient of coupling is indicative of the formation of the ice, as well as the thickness of the formed ice. The fluid effectiveness monitoring portion comprises a temperature sensor and an ionic-conduction cell array that measures the conductivity of the deicing fluid which is indicative of its concentration and, thus, its freezing point. By measuring the temperature and having knowledge of the freezing point of the deicing fluid, the fluid effectiveness monitoring portion predicts when the deicing fluid may lose its effectiveness because its freezing point may correspond to the temperature of the ambient.

Seegmiller, H. Lee B.↗

NASA NTRS2013

Fabrication Methods for Adaptive Deformable Mirrors

Previously, it was difficult to fabricate deformable mirrors made by piezoelectric actuators. This is because numerous actuators need to be precisely assembled to control the surface shape of the mirror. Two approaches have been developed. Both approaches begin by depositing a stack of piezoelectric films and electrodes over a silicon wafer substrate. In the first approach, the silicon wafer is removed initially by plasmabased reactive ion etching (RIE), and non-plasma dry etching with xenon difluoride (XeF2). In the second approach, the actuator film stack is immersed in a liquid such as deionized water. The adhesion between the actuator film stack and the substrate is relatively weak. Simply by seeping liquid between the film and the substrate, the actuator film stack is gently released from the substrate. The deformable mirror contains multiple piezoelectric membrane layers as well as multiple electrode layers (some are patterned and some are unpatterned). At the piezolectric layer, polyvinylidene fluoride (PVDF), or its co-polymer, poly(vinylidene fluoride trifluoroethylene P(VDF-TrFE) is used. The surface of the mirror is coated with a reflective coating. The actuator film stack is fabricated on silicon, or silicon on insulator (SOI) substrate, by repeatedly spin-coating the PVDF or P(VDFTrFE) solution and patterned metal (electrode) deposition. In the first approach, the actuator film stack is prepared on SOI substrate. Then, the thick silicon (typically 500-micron thick and called handle silicon) of the SOI wafer is etched by a deep reactive ion etching process tool (SF6-based plasma etching). This deep RIE stops at the middle SiO2 layer. The middle SiO2 layer is etched by either HF-based wet etching or dry plasma etch. The thin silicon layer (generally called a device layer) of SOI is removed by XeF2 dry etch. This XeF2 etch is very gentle and extremely selective, so the released mirror membrane is not damaged. It is possible to replace SOI with silicon substrate, but this will require tighter DRIE process control as well as generally longer and less efficient XeF2 etch. In the second approach, the actuator film stack is first constructed on a silicon wafer. It helps to use a polyimide intermediate layer such as Kapton because the adhesion between the polyimide and silicon is generally weak. A mirror mount ring is attached by using adhesive. Then, the assembly is partially submerged in liquid water. The water tends to seep between the actuator film stack and silicon substrate. As a result, the actuator membrane can be gently released from the silicon substrate. The actuator membrane is very flat because it is fixed to the mirror mount prior to the release. Deformable mirrors require extremely good surface optical quality. In the technology described here, the deformable mirror is fabricated on pristine substrates such as prime-grade silicon wafers. The deformable mirror is released by selectively removing the substrate. Therefore, the released deformable mirror surface replicates the optical quality of the underlying pristine substrate.

Toda, Risaku↗